The invention discloses a multi-target deposition control method and
system, a medium and equipment. The multi-target deposition control method comprises the following steps: acquiring angle parameters between a substrate and a plurality of targets; environmental parameters in the cavity are adjusted to meet preset standards; based on the angle parameters and a preset control strategy, electric fields are applied to the
multiple target positions respectively, a uniform composite
electric field is formed through superposition, and the substrate is located in the composite
electric field; the target position is deposited on the substrate through the
electric field to form a
film material, and
control parameters of the electric field are adjusted based on thickness parameters of the
film material until deposition is completed; a plurality of non-parallel target positions are arranged on the outer side of a substrate, an electric field is applied to each target position, a composite electric field with uniform strength is formed at the position of the substrate, and
plasma density distribution is uniform, so that the
sputtering rate and direction of a target material on the target positions tend to be consistent on the surface of the whole substrate, and the uniformity of
film material thickness preparation is ensured; and the electric field is uniformly distributed, so that the target material is uniformly etched, and the
utilization rate can be increased from 40-50% to 60-70%.