5results about How to "Improve surface uniformity" patented technology

The application discloses a driving circuit and a method thereof of a display panel, the display panel and a display device, and relates to the technical field of display. The circuit comprises a picture detection module, the picture detection module is arranged to detect a picture scene type of an input picture, and determine a picture detection signal according to the picture scene type; a compensation trigger module, a signal trigger end of the compensation trigger module is electrically connected with a first signal interface of the picture detection module, the compensation trigger module is arranged to receive the picture detection signal sent by the picture detection module, and trigger a level signal of a heavy load picture according to the picture detection signal, and generate a clock signal; and a charging compensation module, a signal input end of the charging compensation module is electrically connected with a signal output end of the compensation trigger module, the charging compensation module is arranged to perform charging compensation according to the clock signal sent by the compensation trigger module. The application aims to improve the surface uniformity of a super-large size screen picture display.

A method of plasma etching a workpiece is disclosed. The method includes the steps of placing the workpiece on a substrate support within a plasma chamber, wherein the workpiece comprises a SiC substrate; introducing SF6, O2, and He process gases into the plasma chamber; plasma etching the SiC substrate by alternating between (i) applying a bias RF power to the substrate support to generate a reactive ion etch plasma in the plasma chamber and etching the SiC substrate at a first plasma chamber pressure for a first time period; and (ii) applying a source RF power to the plasma chamber to generate an inductively coupled plasma in the plasma chamber and applying a bias RF power to the substrate support, and etching the SiC substrate at a second plasma chamber pressure for a second time period, thereby reducing a surface roughness of the SiC substrate.

The application discloses a microwave plasma etching device and method, which comprises an etching chamber, a moving platform, a plasma torch, a gas supply assembly and a microwave generator. The moving platform is movably arranged in the etching chamber and used for placing materials to be processed. The plasma torch comprises a nozzle, the nozzle is arranged relative to the moving platform and connected to the inner wall of the etching chamber, the inside of the nozzle is hollow, and the nozzle is provided with a jet hole relative to the moving platform. The gas supply assembly comprises a first gas supply part, the gas outlet end of the first gas supply part is connected to the inside of the nozzle and used for providing plasma generating gas. The microwave generator is connected to the nozzle and used for providing a microwave signal for the nozzle to form a plasma flame. The application can solve the problem that in the prior art, the bias voltage is easily generated due to the discharge of positive and negative electrodes in the plasma forming process, thereby causing electrostatic discharge loss.

This utility model relates to the field of laser cutting technology, specifically to a device for diamond laser cutting, comprising a laser, a mirror assembly, a circular polarizer, a beam expander, and a cutting head; the laser is used to emit linearly polarized laser light; the mirror assembly is used to reflect the linearly polarized laser light emitted by the laser to the circular polarizer; the circular polarizer is fixedly installed and used to convert the incident linearly polarized laser light into circularly polarized laser light; the beam expander is installed on the output path of the circular polarizer and is used to expand the circularly polarized laser beam; the cutting head is installed on the output path of the beam expander, and its central axis forms an adjustable angle with the Z-axis. The cutting head focuses the laser light to form a light cone, which acts on the diamond to achieve cutting.

The utility model discloses a white pad for wafer rough polishing belongs to the technical field of polishing pad, a white pad for wafer rough polishing, including polishing pad layer, the upper end of polishing pad layer is provided with fluid storage pad, the upper end sealed coupling of fluid storage pad has base surface layer, the inside of fluid storage pad is provided with integrative fluid flow cavity, and the inside of fluid flow cavity has non - newtonian fluid layer. The utility model solves the problem that the existing wafer grinding pad in actual use process, and the partial buffer invalidation of polishing pad caused by the breakage of micro air bag will affect the continuity work, the non - newtonian fluid layer of the utility model in the grinding process, and the viscosity changes with the real - time change of pressure, shear rate, realizes adaptive buffer, reduces the wafer edge collapse response speed that partial stress concentration leads to, and the action of cooperation grinding particle can reduce partial leakage, and the surface uniformity is promoted.