178 results about "Interconnector" patented technology

The invention provides a back contact solar cell, a photovoltaic module and a photovoltaic system, and relates to the technical field of photovoltaics. The battery comprises a battery body and an electrode structure located on the back side of the battery body. According to the electrode structure, first electrode disc columns and second electrode disc columns extend in the second direction and are alternately distributed in the first direction; the first electrode disc row comprises a plurality of first electrode discs which are arranged in rows in the second direction, and the first electrode discs are electrically connected with the N-type grid lines; the second electrode disc row comprises a plurality of second electrode discs which are arranged in rows in the second direction, and the second electrode discs are electrically connected with the P-type grid lines; in the second direction, the battery body comprises a plurality of areas, and the area of the second electrode disc in the same area is larger than that of the first electrode disc. According to the invention, the bonding area of the second electrode disc and the interconnector is increased, and the bonding force of the second electrode disc and the interconnector is further enhanced, so that the second electrode disc and the interconnector are firmly bonded, the risk of pulling-off basically does not exist, and the electrical connection is more reliable.

A power regulator device, a power distribution device and related methods and systems for managing power consumption in electric vehicle supply equipment (EVSE) stations. The power regulator device includes an interconnector attached to an EVSE cable, a storage module for receiving a modulation configuration, and a filtering module for intercepting and altering the signal transmitted from the EVSE station to the electric vehicle. The power distribution device is configured to receive a load configuration and a list of EVSE controllers, measure the total load, and communicate modulation configurations to the EVSE controllers to manage power consumption. The system, designed to operate on a mesh network, includes multiple EVSE stations, power distribution devices, and a centralized monitoring agent for managing and controlling power consumption across the EVSE stations.

A preparation method of an SOFC or SOEC with a long-life sealing interface is formed by allowing a sealing layer, a cell and a metal interconnector to be mutually contacted. In the present disclosure, with spinel as a coating material of the metal interconnector, staged thermal treatment is employed to form a high-density and strong-adhesion spinel coating to improve the endurance and entire performance of the metal interconnector. The present disclosure also optimizes the material system of the sealing layer, namely, uses the SiO2—MgO—Al2O3—SrO—V2O5 system to prepare the sealing layer, which not only improves the resistivity of the sealing layer but also increases its hardness and fracture strength. Further, under the condition of ensuring the airtightness, the coefficient of thermal expansion of the sealing layer is matched with the coefficients of thermal expansion of the metal interconnector and the cell, improving the endurance of the sealing interface.

The present application provides a semiconductor device and a method for preparing the same. The semiconductor device includes a substrate having an active region; a recess gate structure disposed in the substrate and intersecting the active region; a conductive pillar disposed over the substrate and electrically connected to the active region; a landing pad disposed on the conductive pillar and electrically connected to the conductive pillar; and a stack of dielectric layers disposed over the substrate and laterally surrounding the conductive pillar and the landing pad. The semiconductor device also includes a contact structure disposed between the substrate and the conductive pillar, a capacitor plug disposed on the landing pad and electrically connected to the landing pad, and a storage capacitor disposed on the capacitor plug and electrically connected to the capacitor plug.

A heat pump system includes a regenerative thermal machine (1*, 1**, 1***) in fluid communication with one or more heat reservoirs (21; 31), wherein the regenerative thermal machine (1, 1**, 1***) comprises working fluid compression (12) and expansion (11) spaces; and an electrical machine (130) that is electrically connectable via interconnector (3) to an electricity distribution grid (2); characterised in that the regenerative thermal machine (1*, 1**, 1***) further comprises a phase change means (160) operable to change the phase relationship between the said working fluid compression (12) and expansion spaces (11) of the regenerative thermal machine (1*, 1**, 1***).

The present application provides a semiconductor device and a method for preparing the same. The semiconductor device includes a substrate having an active region; a recess gate structure disposed in the substrate and intersecting the active region; a conductive pillar disposed over the substrate and electrically connected to the active region; a landing pad disposed on the conductive pillar and electrically connected to the conductive pillar; and a stack of dielectric layers disposed over the substrate and laterally surrounding the conductive pillar and the landing pad. The semiconductor device also includes a contact structure disposed between the substrate and the conductive pillar, a capacitor plug disposed on the landing pad and electrically connected to the landing pad, and a storage capacitor disposed on the capacitor plug and electrically connected to the capacitor plug.

An assembly includes a stack of SOEC / SOFC solid oxide cells, the stack having a plurality of plates stacked one on top of the other, each plate having an outer lateral surface, the plurality of plates including at least a plurality of electrochemical cells, a plurality of interconnectors, and upper and lower end plates. At least two guiding elements are configured to guide the vertical stacking of at least some of the plates of the stack. The at least two guiding elements extend vertically in a vertical direction and bear against the outer lateral surface of each of the at least some of the plates.

The invention relates to a spacer for a solid oxide electrochemical device (200), said device (200) comprising: at least one interconnector (102,104), a solid oxide electrochemical cell (106) arranged between said interconnector (102,104) and another interconnector (102;104), andsaid spacer (202), arranged between said interconnectors (102,104), in particular, around said cell (106); characterized in that said spacer (202): comprises a layer, called a main layer, made of a ceramic matrix composite material, called a CMC material, or of a precursor of said CMC material, which is electrically insulating; andis partly, or entirely, gas-tight. It also relates to a solid oxide electrochemical device comprising such a spacer. It further relates to a solid oxide electrochemical system comprising such electrochemical devices. See Figure 2a

The invention relates to a method for manufacturing at least one interconnector (1) for solid oxide electrochemical devices, referred to as ISO (1), referred to as the method. The method includes: compressing (7) a stack (2) comprising at least two machined metal sheets (3) in contact with one another; and, at the same time as the pressure is applied, heating the stack to a temperature of between 700°C and 1200°C. The compressing includes applying a pressure greater than or equal to 4 bar. The at least two metal sheets are machined and arranged such that, after manufacture, the ISO is formed. The pressure is applied perpendicularly to the at least two sheets.

A valve interconnector, suitable for use in combination with a receiver interconnector to couple a first hollow body to a second hollow body, is disclosed. The valve interconnector comprises a neck (7) to be secured to the first hollow body and further comprises a base cap (8) comprising an exterior tube portion (85) covering at least a portion of the external surface (7s) of the neck (7). The exterior tube portion and the neck are secured to each other with ability of relative rotation about a central axis. The valve interconnector is provided with a selector (44, 48) operative between the neck (7) and the exterior tube portion of the base cap (8) and configured for assuming at least a first position and a second position, in the first position the base cap being prevented from being axially released from the neck, in the second position the base cap being enabled to be axially released from the neck.

Interconnector for power module. The invention relates to an interconnector (50) intended to be electrically connected to a power module (1) and an electronic board, characterized in that it comprises: a connection grid comprising electrically conductive elements (102, 202) including at least one electrically conductive signal track (102) and at least one power conductor (202), each of the conductive elements comprising, at a first end, a connection pad (1023) intended to be electrically connected to the power module (1) and, at a second end, a connection terminal (2023); an enclosure (51) partially overmolded around the electrically conductive elements (102, 202), the connection pads (1023) and the connection terminals (2023) being disposed outside the enclosure (51). (Figure 4)

The application relates to a power interconnector operation mode adaptive switching hybrid control method and device, computer equipment and a storage medium. The method comprises the following steps: determining a first three-phase modulation wave of a first power grid and a second three-phase modulation wave of a second power grid according to a first power grid phase angle, a first active current given value and a first reactive current given value of the first power grid in a first current operation mode, and a second power grid phase angle, a second active current given value and a second reactive current given value of the second power grid in a second current operation mode; in the case that a characteristic difference value between a first modulation wave characteristic value of the first three-phase modulation wave and a second modulation wave characteristic value of the second three-phase modulation wave is greater than a preset characteristic difference value, performing corresponding state control processing on a first converter and a second converter according to the first three-phase modulation wave and the second three-phase modulation wave respectively. By adopting the method, the control accuracy of the power interconnector can be improved.

The invention discloses an optical interconnection cable assembly, a communication system, a server and a link power consumption control method, and relates to the technical field of computer systems and information interaction.The optical interconnection cable assembly is characterized in that a first processor and a first optical interconnection device are controlled to enter or exit a low-power-consumption mode through a first cable sub-assembly, and a second processor and a second optical interconnection device are controlled to enter or exit a low-power-consumption mode through a second cable sub-assembly; and the second processor controls the second processor and the second optical interconnection device to enter or exit from the low-power-consumption mode, thereby solving the technical problem that the power consumption of the whole link is relatively high due to the fact that the optical cable or the optical module is not allowed to enter the low-power-consumption mode and works in the standard mode for a long time in the prior art, and achieving the technical effect of reducing the energy consumption of the whole optical interconnection link.

The present application provides a semiconductor device and a method for preparing the same. The semiconductor device includes a substrate having an active region; a recess gate structure disposed in the substrate and intersecting the active region; a conductive pillar disposed over the substrate and electrically connected to the active region; a landing pad disposed on the conductive pillar and electrically connected to the conductive pillar; and a stack of dielectric layers disposed over the substrate and laterally surrounding the conductive pillar and the landing pad. The semiconductor device also includes a contact structure disposed between the substrate and the conductive pillar, a capacitor plug disposed on the landing pad and electrically connected to the landing pad, and a storage capacitor disposed on the capacitor plug and electrically connected to the capacitor plug.

The photovoltaic module comprises a plurality of battery pieces, each battery piece comprises a plurality of fine gate electrodes, and each fine gate electrode comprises a first section and a second section which are alternately arranged and connected together; the second section is wider than the first section; the top surfaces of the first section and the second section in a fine gate electrode are flush with each other; the at least one second section comprises a first part and a second part, and the second part is connected with the first part and the first section; and the width of the second part is gradually increased in the direction from the first section to the first part. According to the photovoltaic module provided by the embodiment of the invention, the pulling-out force between the interconnection piece and the battery piece can be ensured.

The invention relates to an interconnection device (3) for a stator (1) of an electric machine, comprising at least two interconnectors (4, 4a, 4b, 4c) and a connection element (5), each interconnector (4, 4a, 4b, 4c) comprising a terminal (6) and at least one wire portion (7, 7a, 7b) integral with the terminal (6), the wire portion (7, 7a, 7b) being formed from a solid strand comprising a main section (8) and at least one terminal section (9) configured to be electrically connected to a coil (2) of the stator (1), the connection element (5) being integral with the terminal (6) of each interconnector (4, 4a, 4b, 4c), characterized in that the wire portion (7, 7a, 7b) is divided into a first portion (17a) and a second portion (17b), each portion of the wire portion (7, 7a, 7b) extending on either side of the terminal (6), respectively.

Disclosed are a method and a device for distributed operation. The computing device includes a plurality of processing devices; and an interconnector connected to the plurality of processing devices and configured to provide data transmission paths for the plurality of processing devices, wherein the interconnector is configured to selectively activate a first data transmission path from a source device to one target processing device and a second data transmission path from the source device to a plurality of target processing devices, and the source device includes one of the plurality of processing devices or a storage device shared by the plurality of processing devices.

The invention relates to an electronic assembly comprising: - a main housing (5), - at least one electronic board (6A) housed in the main housing (5), - a cover (7) configured to close the main housing (5), the cover (7) being configured to bear a base of an external connector comprising electrical connection elements to be connected to an interconnector on the electronic board (6A), - a plurality of centering pins (14) configured to center both the electronic board (6A) and the cover (7) with respect to the main housing (5).

The invention relates to an interconnector (50) intended to be electrically connected to a power module (1) and to an electronic board, characterized in that it comprises: - a connection grid comprising electrically conductive elements (102, 202) among which at least one electrically conductive signal track (102) and at least one power conductor (202), each of the conductive elements comprising, at a first end, a connection area (1023) intended to be electrically connected to the power module (1) and, at a second end, a connection terminal (2023) - an envelope (51) partially overmolded around the electrically conductive elements (102, 202), the connection areas (1023) and the connection terminals (2023) being disposed outside the envelope (51).

The invention relates to a high temperature electrolyser comprising interconnectors (4) forming grooves for retaining seals (44, 46). The invention also relates to the corresponding production and assembly methods.

A method for manufacturing a battery module includes: providing a pre-module including a plurality of aligned battery cells having differently-oriented surfaces; attaching a terminal end of a flexible interconnector to the pre-module, the flexible interconnector including a strip-shaped flexible printed circuit (FPC), the FPC including a first insulating main surface, a second insulating main surface opposite the first insulating main surface, and a plurality of thermally and / or electrically conducting lines between the first insulating main surface and the second insulating main surface, each of the conducting lines having a contact portion exposed by a contact aperture in the first insulating main surface and / or the second insulating main surface; and wrapping the flexible interconnector around the pre-module such that the contact portions contact the differently-oriented surfaces of the battery cells.

A gallium nitride power device with wide-range working gate voltage structurally includes a base and isolation regions, wherein the base is provided with a substrate, a nucleating layer, a buffer layer, a channel layer, a barrier layer and a passivation layer in sequence from the bottom up, and a voltage-limiting tube region, a power tube region and a bleed-off tube region are arranged on the barrier layer. A first metallic drain electrode in the voltage-limiting tube region and a third metallic gate electrode in the bleed-off tube region are connected via a first metallic interconnector and connected to an input gate voltage, and a first metallic source electrode in the voltage-limiting tube region, a second metallic gate electrode in the power tube region and a third metallic drain electrode in the bleed-off tube region are connected via a second metallic interconnector,

This solar battery cell (1) comprises: a cell body (10); a bypass diode (20); an interconnector (21) that electrically connects the cell body (10) and the bypass diode (20); and a cover glass (40) that covers light-receiving surfaces of the cell body (10) and the bypass diode (20). One end (21a) of the interconnector (21) is welded to the bypass diode (20), the other end (21b) of the interconnector (21) is welded to an opposite surface electrode (14) on the opposite surface to the light-receiving surface of the cell body (10), the cell body (10) is provided with a stress buffering part (13) at a portion of the light-receiving surface corresponding to a welded portion at which the other end (21b) of the interconnector (21) is welded on the opposite surface, and the stress buffering part (13) has the same height as a front surface electrode (grid line) (11) provided on the light-receiving surface of the cell body (10).

The invention relates to an antenna: a first wall and a second wall facing the first wall, the surfaces of the first and second walls facing each other being at least partially reflective and defining a cavity between them; at least one lateral wall connecting the first and second walls and having an internal surface within the cavity that is at least partially reflective; the cavity being a resonant cavity; the antenna further comprising at least one electromagnetic source on one of the walls; at least one transmitting array carried by the second wall comprising at least two elementary cells, each comprising: a receiver within the cavity, a transmitter outside the cavity, and an interconnector transmitting the wave from the receiver to the transmitter; one of the elementary cells being configured so that the phase of the wave is modified before transmission. Figure for the abstract: Fig. 1

Described herein are mechanically reconfigurable charging ports for electric vehicles and methods of operating electric vehicles comprising such ports. A charging port comprises external contacts, internal contacts, and a mechanical switch comprising a movable interconnecting unit and an actuator configured to change the position of the movable interconnecting unit relative to the external contacts and the internal contacts based on one of the operating modes of the charging port. Specifically, the movable interconnecting unit comprises a support and interconnectors attached to and supported by the interconnector support. Depending on the operating mode / position of the movable interconnecting unit, the interconnectors are for connections between different subsets of the external contacts and internal contacts. For example, the mechanically reconfigurable charging ports may support a combined DC-changing and export-power mode, an AC charging-only mode, a DC charging-only mode, and an export power-only mode.

The invention relates to a power electrical interconnector (10) of an interlocking system (11), for an electronic device such as an on-board vehicle charger (2), in particular of the single-phase or three-phase type, the power electrical interconnector (10) comprising: a body (14) made of insulating material, in particular of a plastic material, one or more power electrical contact elements (15), in particular of the male or female type, disposed in said body (14) and configured to transmit power, this or these power electrical contact elements (15) being in particular configured to be soldered onto an electronic board (16), at least one interlocking contact element (17) disposed in said body (14) and configured to be connected to a complementary interlocking contact element (18) on an external power connector (19),in order to allow detection of a connection interruption on the power electrical contact element(s) (15), this interlocking contact element (17) being specifically configured to be soldered onto an electronic board (16). Figure for the abbreviation: Fig. 2,

The invention relates to a copper pad metallization system and a related method. A particular implementation of a method of forming an interconnect may include forming a grain layer (10) over a plurality of pads (6); patterning the photoresist layer (12) having a plurality of openings (14) exposing the plurality of pads (6); forming a plurality of copper interconnectors (18) by electroplating each of the plurality of copper interconnectors (18) into each of the plurality of openings (14); removing the photoresist layer (12); etching the grain layer (10); forming one or more layers (24) on the plurality of copper interconnectors (18); and patterning the polyimide layer (26) over the plurality of copper interconnectors (18) to form at least one opening (28) over at least one of the plurality of copper interconnectors (18).

The invention provides a multi-port alternating current and direct current multiplexing power supply device. Through the dynamic switching of the AC / DC multiplexing interface module and the collaborative architecture of the multi-port DC interconnector module, the intelligent reconstruction of a hardware circuit and the flexible configuration of an energy path are realized. The AC / DC multiplexing interface module automatically switches an AC rectification / inversion mode or a DC buck-boost mode according to the power distribution type, thereby solving the limitation that a conventional device only supports a single type of port. The multi-port direct-current interconnector module establishes a reconfigurable energy path through a switching signal driven by hierarchical logic, so that the voltage conversion range is expanded while the transmission loss is reduced. Multi-mode operation intervals are divided in real time in an actual application scene, energy supply of high-priority ports is guaranteed preferentially, power decoupling is achieved through the inductor energy storage characteristic, the problems in the aspects of voltage gain and transmission power in a traditional scheme are solved, and the light-weight and high-compatibility power supply device is formed.