66 results about "Interconnector" patented technology

Interconnector for power module. The invention relates to an interconnector (50) intended to be electrically connected to a power module (1) and an electronic board, characterized in that it comprises: a connection grid comprising electrically conductive elements (102, 202) including at least one electrically conductive signal track (102) and at least one power conductor (202), each of the conductive elements comprising, at a first end, a connection pad (1023) intended to be electrically connected to the power module (1) and, at a second end, a connection terminal (2023); an enclosure (51) partially overmolded around the electrically conductive elements (102, 202), the connection pads (1023) and the connection terminals (2023) being disposed outside the enclosure (51). (Figure 4)

The application relates to a power interconnector operation mode adaptive switching hybrid control method and device, computer equipment and a storage medium. The method comprises the following steps: determining a first three-phase modulation wave of a first power grid and a second three-phase modulation wave of a second power grid according to a first power grid phase angle, a first active current given value and a first reactive current given value of the first power grid in a first current operation mode, and a second power grid phase angle, a second active current given value and a second reactive current given value of the second power grid in a second current operation mode; in the case that a characteristic difference value between a first modulation wave characteristic value of the first three-phase modulation wave and a second modulation wave characteristic value of the second three-phase modulation wave is greater than a preset characteristic difference value, performing corresponding state control processing on a first converter and a second converter according to the first three-phase modulation wave and the second three-phase modulation wave respectively. By adopting the method, the control accuracy of the power interconnector can be improved.

Disclosed are a method and a device for distributed operation. The computing device includes a plurality of processing devices; and an interconnector connected to the plurality of processing devices and configured to provide data transmission paths for the plurality of processing devices, wherein the interconnector is configured to selectively activate a first data transmission path from a source device to one target processing device and a second data transmission path from the source device to a plurality of target processing devices, and the source device includes one of the plurality of processing devices or a storage device shared by the plurality of processing devices.

The invention relates to an electronic assembly comprising: - a main housing (5), - at least one electronic board (6A) housed in the main housing (5), - a cover (7) configured to close the main housing (5), the cover (7) being configured to bear a base of an external connector comprising electrical connection elements to be connected to an interconnector on the electronic board (6A), - a plurality of centering pins (14) configured to center both the electronic board (6A) and the cover (7) with respect to the main housing (5).

The invention relates to an interconnector (50) intended to be electrically connected to a power module (1) and to an electronic board, characterized in that it comprises: - a connection grid comprising electrically conductive elements (102, 202) among which at least one electrically conductive signal track (102) and at least one power conductor (202), each of the conductive elements comprising, at a first end, a connection area (1023) intended to be electrically connected to the power module (1) and, at a second end, a connection terminal (2023) - an envelope (51) partially overmolded around the electrically conductive elements (102, 202), the connection areas (1023) and the connection terminals (2023) being disposed outside the envelope (51).

A method for manufacturing a battery module includes: providing a pre-module including a plurality of aligned battery cells having differently-oriented surfaces; attaching a terminal end of a flexible interconnector to the pre-module, the flexible interconnector including a strip-shaped flexible printed circuit (FPC), the FPC including a first insulating main surface, a second insulating main surface opposite the first insulating main surface, and a plurality of thermally and / or electrically conducting lines between the first insulating main surface and the second insulating main surface, each of the conducting lines having a contact portion exposed by a contact aperture in the first insulating main surface and / or the second insulating main surface; and wrapping the flexible interconnector around the pre-module such that the contact portions contact the differently-oriented surfaces of the battery cells.

This solar battery cell (1) comprises: a cell body (10); a bypass diode (20); an interconnector (21) that electrically connects the cell body (10) and the bypass diode (20); and a cover glass (40) that covers light-receiving surfaces of the cell body (10) and the bypass diode (20). One end (21a) of the interconnector (21) is welded to the bypass diode (20), the other end (21b) of the interconnector (21) is welded to an opposite surface electrode (14) on the opposite surface to the light-receiving surface of the cell body (10), the cell body (10) is provided with a stress buffering part (13) at a portion of the light-receiving surface corresponding to a welded portion at which the other end (21b) of the interconnector (21) is welded on the opposite surface, and the stress buffering part (13) has the same height as a front surface electrode (grid line) (11) provided on the light-receiving surface of the cell body (10).

Described herein are mechanically reconfigurable charging ports for electric vehicles and methods of operating electric vehicles comprising such ports. A charging port comprises external contacts, internal contacts, and a mechanical switch comprising a movable interconnecting unit and an actuator configured to change the position of the movable interconnecting unit relative to the external contacts and the internal contacts based on one of the operating modes of the charging port. Specifically, the movable interconnecting unit comprises a support and interconnectors attached to and supported by the interconnector support. Depending on the operating mode / position of the movable interconnecting unit, the interconnectors are for connections between different subsets of the external contacts and internal contacts. For example, the mechanically reconfigurable charging ports may support a combined DC-changing and export-power mode, an AC charging-only mode, a DC charging-only mode, and an export power-only mode.

The invention relates to a power electrical interconnector (10) of an interlocking system (11), for an electronic device such as an on-board vehicle charger (2), in particular of the single-phase or three-phase type, the power electrical interconnector (10) comprising: a body (14) made of insulating material, in particular of a plastic material, one or more power electrical contact elements (15), in particular of the male or female type, disposed in said body (14) and configured to transmit power, this or these power electrical contact elements (15) being in particular configured to be soldered onto an electronic board (16), at least one interlocking contact element (17) disposed in said body (14) and configured to be connected to a complementary interlocking contact element (18) on an external power connector (19),in order to allow detection of a connection interruption on the power electrical contact element(s) (15), this interlocking contact element (17) being specifically configured to be soldered onto an electronic board (16). Figure for the abbreviation: Fig. 2,

A multi-terminal power transmission network includes first and second DC terminals that are interconnected by a first transmission conduit to permit the transfer of power. The first DC terminal is connected with an interconnection conduit and is separately connected with a first power converter. The first power converter interconnects the first DC terminal with a first AC network element and includes a first converter controller. The second DC terminal is interconnected with a second AC network element by a second power converter which includes a second converter controller. The first power converter further includes a supplementary controller to selectively modify the first DC voltage reference that the first power converter is required to provide so as to drive the DC current flowing in the interconnection conduit below a predetermined threshold and facilitate disconnection of the interconnection conduit from the first DC terminal via opening of the first interconnector switch.

In some examples, a fluid-ejection device can include a fluidic tube to fluidically connect to a fluid supply, a carriage having a fluidic interconnector fluidically connectable to the fluidic tube and movable between a first position and a second position, a receiver to receive an air purger, wherein the air purger, when present, is coupled to the receiver and fluidically connectable to the fluidic interconnector, and a controller to cause the carriage to actuate from the first position to the second position, determine a location of the carriage at the second position, and based on the location of the carriage at the second position, detect a status of the air purger, a status of an engageable lock in the air purger, or both.

To provide a fuel cell device that can effectively reduce the maximum temperature of the fuel cell. [Solution] In a fuel cell device, fuel gas is supplied to the fuel electrode 7 of a fuel cell cell C sandwiched between two interconnectors 15 through a fuel electrode side passage 17 formed between one interconnector 15 and the fuel electrode 7, and air is supplied to the air electrode 8 of the fuel cell cell C through an air electrode side passage 18 formed between the other interconnector 15 and the air electrode 8. Between the two interconnectors 15 that do not have a fuel cell C in between, a porous layer 16 is provided, which has a porous body 19 that is in contact with both of the two interconnectors 15, and fuel gas before it is supplied to the fuel electrode side passage 17, or air before it is supplied to the air electrode side passage 18, flows through the porous layer 16 between the inlet 16a and the outlet 16b.

To provide an electrochemical cell stack constituted so that a sufficient amount of fuel gas can be made to flow even on the outlet side of a fuel chamber.SOLUTION: An anode current collector 312 of an electrochemical cell stack 1 includes an upper side part 311c in contact with an anode layer 312a, a lower side part 312C in contact with an interconnector 313, and a pair of coupling parts 312a connecting the upper side part 312C and the lower side part 312b, and is arranged in an anode chamber Sf. A projection part side 312A is formed by the upper side part side 312b and the pair of connecting part side 312A, and the combustion chamber Sf is partitioned into an inside space side 312A surrounded by the projection part side A1 and the interconnector 313, and an outside space side 312A surrounded by the projection part side A2 and the electrolytic cell 311. The connecting portion side 312b has an opening through which the inner space side A1 and the outer space side A2 communicate with each other. The opening ratio in the front half area FA of the connecting portion 312b is smaller than the opening ratio in the rear half area RA.SELECTED DRAWING: Figure 9

An interconnector for a heat exchanger includes a body having an upper inlet and a lower inlet connected by an inlet conduit, an upper outlet and a lower outlet connected by an outlet conduit, an external inlet in communication with the inlet conduit, and an external outlet in communication with the outlet conduit, the inlet conduit and the outlet conduit are fluidly isolated from each other within the interconnector.

The invention relates to a fuel cell stack (12) for a fuel cell device (10) for operation with ammonia (A), comprising a plurality of stacked fuel cells (100) and a plurality of interconnectors (96), wherein an interconnector (96) is arranged between each pair of adjacent fuel cells (100). It is proposed that the interconnectors (96) each comprise an ammonia cracker (98) for converting the ammonia (A) into nitrogen (N) and hydrogen (H).

An electrochemical cell, an electrochemical cell device, a module, and a module housing device that can improve durability are provided. [Solution] The electrochemical cell has a support, a solid electrolyte layer, an interconnector, and an overlapping portion. The support has a first surface extending in a first direction, a second surface opposite to the first surface, and a side surface connecting an end of the first surface to an end of the second surface in a second direction intersecting the first direction. The solid electrolyte layer faces the first surface and the side surface. The interconnector faces the second surface. At the overlapping portion, the solid electrolyte layer and the interconnector overlap when the second surface is viewed in plan. The solid electrolyte layer is in contact with the end of the interconnector in the second direction. When the lengths of the support and the overlapping portion along the second direction are W0 and W1, respectively, 0

The invention relates to a solid oxide fuel cell at least having an anode, an electrolyte, a cathode, a ceramic interconnector for which either Si3N4 or MoSi2 is used as matrix and either MoSi2 or Si3N4 is used as secondary phase, and SiC and / or TiC is optionally used as material for the ceramic interconnector.

The invention relates to an electrical interconnector (19) for an electronic device such as an on-board vehicle charger, the electrical interconnector (19) comprising: a body (101) made of insulating material, in particular a plastic material, one or more electrical contact elements, in particular of the male or female type, arranged in said body (101) and configured to transmit electrical signals or power, at least one grounding tab (103), in particular metallic, integral with said body (101), said grounding tab (103) being configured to be, on the one hand, fixed, in particular soldered, to an electronic board, in particular in contact with a grounding trace of said electronic board, and, on the other hand, in contact with a conductive portion of a cover or metallic housing of the electronic device,ensuring ground continuity between the electronic board and the cover or housing. Figure for the abbreviation: Fig. 5,

A semiconductor package includes a frame having a first surface and a second surface, and including a wiring structure and a through-hole. The package further includes a first redistribution structure disposed on the first surface of the frame and including a first insulating layer and a first redistribution layer on the first insulating layer and connected to the wiring structure, a bridge die in the through-hole and having an interconnector, and an encapsulant surrounding the bridge die, and covering the second surface of the frame. The package further includes a second redistribution structure disposed on the encapsulant, and including a second insulating layer and a second redistribution layer on the second insulating layer and connected to the interconnector and the wiring structure, and a plurality of semiconductor chips disposed on the second redistribution structure, connected to the second redistribution layer, and electrically connected to each other through the interconnector.

A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

The invention discloses a GaN device double-sided heat dissipation structure based on flexible plate bottom filling, a GaN device is electrically interconnected with a ceramic substrate through a welding spot, and the electrical interconnection between the GaN device and the ceramic substrate adopts a nano-metal material sintering process; a flexible insulating copper-clad plate is sintered between the bottom electrodes of the GaN device, and the flexible insulating copper-clad plate is located between the GaN device and the ceramic substrate; the enclosure frame surrounds the GaN device and is arranged on the ceramic substrate; the cover plate is arranged above the enclosure frame, the thermal interface material is arranged between the GaN device and the cover plate, the GaN device is coated with the thermal interface material, and the cover plate is in contact with the thermal interface material, so that heat dissipation from the GaN device to the cover plate is realized. According to the invention, an appropriate interface interconnection material for double-sided heat dissipation of the GaN device is selected, an interface interconnection process based on flexible plate bottom filling is realized, and the double-sided heat dissipation structure of the GaN device is realized in the airtight packaging shell, so that the GaN device with the double-sided heat dissipation structure has the characteristic of high integration.

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a bottom interconnector layer positioned in the substrate; a bottom dielectric layer positioned on the bottom glue layer; an interconnector structure positioned along the bottom dielectric layer and the bottom glue layer, positioned on the bottom interconnector layer, and positioned on the bottom dielectric layer; a top glue layer conformally positioned on the bottom dielectric layer and the interconnector structure; a top dielectric layer positioned surrounding the top glue layer. A top surface of the top glue layer and a top surface of the top dielectric layer are substantially coplanar. The top dielectric layer is porous.

To provide an interconnector for a solid oxide electrochemical cell stack with a densified protective film that improves adhesion to a metal substrate and enables satisfactory workability for complex shapes.SOLUTION: An interconnector 1 for a solid oxide electrochemical cell stack includes a metal base material 2 made of an iron-based alloy containing chromium and a protective film 3 provided on the surface of the metal base material 2. An intermediate layer 4 capable of relieving stress is interposed between the metal base material 2 and the protective film 3.SELECTED DRAWING: Figure 1

This achieves both an increase in the number of cell cassette layers and stable stacking of the cell stacks. [Solution] The electrochemical cell stack 20A comprises a central plate 22A having an upper surface 221 and a lower surface 222, a first cell cassette group 24 consisting of a plurality of cell cassettes 100 stacked on the upper surface 221 side, and a second cell cassette group 25 consisting of a plurality of cell cassettes 100 stacked on the lower surface 222 side. Each cell cassette comprises a reaction section 110, a frame section 120, and a separator section 130 connecting the reaction section and the frame section. The central plate has higher bending rigidity in the thickness direction than the electrolytic cell 111, interconnector 113, and current collector 112 included in the reaction section of the electrochemical cell stack. The central plate has protruding portions 22a and 22b that protrude outward from the outer casing of the frame section in a plan view, and these protruding portions include at least two parts that face each other in a plan view.

To provide an interconnector for a solid oxide electrochemical cell stack, which has a densified protective film to improve adhesion to a metal substrate and satisfies workability for a complicated shape.SOLUTION: An interconnector 1 for a solid oxide electrochemical cell stack according to an embodiment includes a metal base 2 containing an iron-based alloy containing chromium, and a protective film 3 provided on the surface of the metal base 2, and the protective film 3 includes a protective film body containing at least one selected from spinel-type oxides and perovskite-type oxides, and a dispersed phase scattered in the protective film body and containing an oxide of at least one element selected from the group consisting of rare earth elements and zirconium.SELECTED DRAWING: Figure 1

Interconnect Fabrication Method for an Electronic Device This description relates to an interconnect fabrication method for an electronic device comprising the steps: a) providing a substrate (100) in which a first chip is formed, assembled to a second chip (200) by hybrid bonding, and on which conductive pads (110) are positioned, the second chip (200) comprising through-vias (220), b) forming conductive wires (150) on the connection pads (110), and optionally on the through-vias (220), c) depositing a layer of insulating material (410) on the substrate (100) and on the second chip (200), to encapsulate the conductive wires (150), d) thinning the layer of insulating material (410), e) forming conductive elements on the layer of insulating material, the conductive elements being connected either to the conductive pads (110) or to the vias (220). Figure for the abstract: Fig. 2D

The invention belongs to the technical field of functional textiles, and relates to an omnidirectional radiation sensing braid for mine disaster rescue and a preparation method thereof.The omnidirectional radiation sensing braid comprises a braid body, sensing yarn, stitches and covering materials, the sensing yarn is integrated on the surface of the braid body during weaving, and the covering materials are integrated on the surface and the back face of the braid body; the sensing yarn is composed of a core yarn and more than one interconnection body antenna, each interconnection body antenna is composed of a chip, a conductor I and a conductor II, a plurality of interconnection bodies are spirally integrated on the core yarn according to interval arrangement, the wrapping material on the surface of the braid wraps the interconnection body antennas on the sensing yarn, and the wrapping material on the back face of the braid increases the thickness of the braid. According to the sensing braid, the antenna units are distributed on the surface of the braid, and the polarization direction is optimized, so that 360-degree omnidirectional signal coverage and stable reading are realized.

The application relates to a model-driven optoelectronic integrated link analysis system and method. The system comprises a signal transmitting end model for generating an original electrical signal; an electrical interconnection model comprising at least one electrical interconnection sub-model for simulating input-output characteristics of an electrical interconnection device and outputting a primary electrical signal according to the original electrical signal; an electro-optical-electrical equivalent model comprising at least one electro-optical-electrical equivalent sub-model for simulating input-output characteristics of an electro-optical-electrical link and outputting a secondary electrical signal according to the primary electrical signal; and a signal receiving end model for analyzing the secondary electrical signal to obtain an analysis result. The system solves the problems of complicated construction of an optoelectronic interconnection model and difficult signal integrity analysis in existing optoelectronic integrated link modeling.

A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.