Interconnector for power module

Abstract

Interconnector for power module. The invention relates to an interconnector (50) intended to be electrically connected to a power module (1) and an electronic board, characterized in that it comprises: a connection grid comprising electrically conductive elements (102, 202) including at least one electrically conductive signal track (102) and at least one power conductor (202), each of the conductive elements comprising, at a first end, a connection pad (1023) intended to be electrically connected to the power module (1) and, at a second end, a connection terminal (2023); an enclosure (51) partially overmolded around the electrically conductive elements (102, 202), the connection pads (1023) and the connection terminals (2023) being disposed outside the enclosure (51). (Figure 4)

Description

Title of the invention: Interconnector for power module

[0001] The present invention relates to the field of power electronics and in particular to the field of electric motor power supply equipment. More specifically, the present invention relates to a power module interconnector, a power assembly comprising the power module and its associated interconnector, as well as a current converter.

[0002] The invention can find its application, for example, in electronic systems for traction inverters, for on-board chargers, for electric cooling pumps, for example, for batteries, for heat pumps, for laser sensors, for example for autonomous driving, etc...

[0003] Electronic modules generally include contacts for connecting an auxiliary electronic board, such as an inverter control board. These contacts allow the transmission of signals, for example, control signals, between the power module and the auxiliary electronic board.

[0004] A power module typically comprises a power board and electrically conductive traces, at least one signal board. The set of electrically conductive traces forms the connection grid, also known by its Anglo-Saxon name "leadframe." The connection grid forms the external contacts of the module and ensures the connection with various elements of the power module as explained below.

[0005] The power board comprises power sections which are planar strips arranged on the power section substrate. These power sections are either at potential B-, potential B+, or phase potential. The power board also comprises at least one power transistor. Power transistors enable the conversion of direct current into a polyphase current system and vice versa. For example, this could be an insulated-gate field-effect transistor, or MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor).

[0006] Each power portion is electrically connected to at least one electrically conductive track. Thus, each power portion is electrically connected to the connecting grid.

[0007] Finally, such a prior art power module includes a housing enclosing the power board, the signal board and the connection grid.

[0008] In prior art electronic modules, transistors are arranged on the power board with a predefined spacing to avoid thermal coupling. To meet space constraints, it is known to arrange the gate Connections are located above the power and signal boards. Rigid electrical connection pillars link the transistors to the connection gate. This is referred to as a multi-stage power module. The connection gate is laser-welded to the rigid pillars.

[0009] Such an arrangement presents certain drawbacks. On the one hand, the rigid pillars subjected to mechanical stress can damage the transistors. On the other hand, during soldering of the connection grid to the pillars, there is a risk of metal spatter on the power and signal boards, which is difficult to accommodate in mass production. Furthermore, in order to connect the module elements together, the positioning possibilities for the various signal paths are limited, which can prove problematic depending on the pin requirements in the module. Prior art power modules are large and complex to assemble. In addition, known power modules offer limited integration adaptability for the connection terminals of the module's power and signal terminals.

[0010] The invention falls within this context and is based on separating the power module's connection grid. The invention proposes an interconnector integrating the power and signal connection grid in the form of an overmolded part. Such an interconnector allows for easy connection to its associated power module and readily adapts to the pinout arrangements of the customer interface.

[0011] This results in a standard design power module with a remote grid connection, leading to a compact power module directly applicable to various electronic systems, for example, for traction inverters. Furthermore, adaptation to customer interfaces is simplified.

[0012] To this end, the invention relates to an interconnector intended to be electrically connected to a power module and an electronic board and / or to power conductors, characterized in that it comprises: - a connection grid comprising electrically conductive elements, including at least one electrically conductive signal track and at least one power conductor, each of the conductive elements comprising, at a first end, a connection pad intended to be electrically connected to the power module and, at a second end, a connection terminal intended to be electrically connected to the electronic board and / or the power conductors, - a partially overmolded casing around the electrically conductive elements, with the connection range and connection terminals arranged outside the casing.

[0013] The casing can be made of thermoplastic. It partially overmolds the electrically conductive elements in the sense that their ends are free, i.e., directly accessible. In other words, the ends of the electrically conductive elements are not enclosed by the casing. An electrically conductive element comprises a central portion and two ends, each end terminating the central portion. The casing overmolds the central portion but not the two ends.

[0014] Thanks to the features of the invention, the interconnector allows for remote electrical connections between the power module and the auxiliary electronic board. The interconnector incorporates the connection grid. The number and routing of the electrically conductive elements, as well as the location of the connection pads and terminals, can be adapted to the configuration of the power module and the electronic board. This allows for a standardized power module and facilitates the necessary adaptations of the connections at the interconnector level.

[0015] According to an optional feature of the invention, the connection areas are parallel to each other. This allows them to be connected to connection faces of the power module that are in a plane of the upper surface of the power module.

[0016] According to an optional feature of the invention, at least one electrically conductive track comprises a first part having a planar shape and a second part comprising the connection area, the first part extending along an axis intersecting, preferably perpendicular, a surface of the connection area. Such a shape of electrically conductive track makes it possible to connect, on the one hand, the connection area to a connection zone of the power module and, on the other hand, the first part to an auxiliary device, for example, the electronic board for the signals, for example, the power conductors, in particular of the busbar type, in a remote manner.

[0017] The invention also relates to a power assembly comprising such an interconnector, and at least one power module comprising: - A power board comprising a power module substrate, two power portions arranged on the substrate, - A signal card mounted on the power card, - Electrically conductive connection pads, each pad of connection comprising a first face and a second face parallel to the first face, the first face being connected to one of the power portions and the signal card, - A housing containing the power board, the signal board, and the connection pads,

[0018] The second face of the connection pads is flush with an upper surface of the housing, and for each connection pad, a connection area of ​​the interconnector is electrically connected to a second face of one of the connection pads. This means that the connection pads extend, preferably perpendicular to the plane of the substrate, from a power portion or the signal card to the upper surface of the housing. In other words, the second face is visible at the level of the upper surface of the housing and is preferably parallel to the plane of the substrate. The second face lies in a plane parallel to the plane of the upper surface area onto which it is connected, this plane being preferably substantially coplanar with the plane of said surface area. The connection areas are parallel to the second faces, so as to ensure a planar connection.

[0019] It is thus understood that such a power module contains the power sections and the signal card, each having connection areas on the second face of its associated connection pads. For each connection pad, the second face is located on the upper surface of the housing. Thus, all the elements of the power module form a first stage and are enclosed within the housing. The connection pads ensure the connection of the power sections and the signal card. They provide the electrical link between the first stage and the upper surface of the housing.

[0020] The power module does not include the connection grid in its housing. The connection grid is contained within the interconnector. The interconnector constitutes the second stage and provides the electrical link between the first stage and the auxiliary device. The interconnector's connection grid can be connected to the power sections and the signal card via the connection pads, the second face of which is flush with the top surface of the housing. The connection to the power sections and the signal card is thus located on the top surface of the housing.Moving the connection grid outside the power module allows, on the one hand, for a wide variety of possible positioning of the elements within the module since the routing of the conductive elements within the housing no longer needs to be taken into account, and on the other hand, facilitates the manufacture of such a power module by making the resin injection step simpler and less expensive.

[0021] The principle of the invention is thus based on separating the connection grid from the power module and relocating the electrical connections of the power sections and the signal board to the upper surface of the power module housing. By externalizing the connection grid, this allows for standardization of the module. The conductive elements form the contacts of the power module to the inputs / outputs of the customer's electronic devices. Since the power module does not include the connection grid, it follows that the same The power module can be used for various electronic devices. Only the interconnector needs to be adapted to the specific requirements of the electronic device to which the power module is to be connected. This results in greater modularity of the power assemblies.

[0022] It should be emphasized that the power module of the power assembly of the invention is a gateless module. Once connected to the power module, the gate forms the second stage, which is therefore located above the power module. It is thus understood that, being outside the power module, the gate does not affect the positioning of the connection pads. The power module of the invention therefore offers more space in the substrate plane for arranging the connection groups (power sections and signal board) along an X-axis of the substrate plane and for positioning a greater number of transistors along a Y-axis of the substrate plane, perpendicular to the X-axis.

[0023] According to an optional feature of the invention, the second face of at least one connection pad, preferably of each of the connection pads connected to the signal card, has a degree of freedom in translation about an axis perpendicular to the plane of the substrate. In other words, such a connection pad exhibits elasticity in a direction perpendicular to the faces of the connection pad. This makes it possible to keep the two faces of the connection pad parallel to each other when the connection pad is compressed in this direction. This is also referred to as a deformable pad.

[0024] According to an optional feature of the invention, the second face of at least one connection pad, preferably of each of the connection pads connected to the power sections, is at a constant distance from the first face of said connection pad. Such a connection pad is also called a rigid pillar. The rigid pillar does not deform. It is advantageously cylindrical but can take the form of any other polyhedron.

[0025] According to an optional feature of the invention, the first face of at least one connection pad is connected to the signal board by means including electrically conductive bonding, welding, or brazing. By using such electrically conductive means, the electrical connection of the connection pads to the power portion or signal board to which they are associated is ensured.

[0026] The invention also relates to a current converter, in particular DC / DC or AC / DC, comprising a power assembly as described above, an electronic board comprising electrically connected connection pins to the connection terminals of the interconnector of the power assembly, and a heat sink on which at least one power assembly is disposed.

[0027] Thanks to the power assembly of the invention, the connection grid is separated from the power module. The connection grid is integrated into the interconnector which manages customer inputs and outputs. This combination allows for both more available space in the substrate's XY plane for transistor placement and greater flexibility in routing connection lines. Furthermore, separating the power and signal lines within the power module from the conductive elements within the interconnector allows for a single type of power module to be used for various applications. The adaptation of input and output connections to the customer interface is performed at the interconnector. As a result, the invention offers a compact and standardized power module suitable for any intended application.

[0028] The invention also relates to a motor vehicle comprising such a power converter.

[0029] Other features and advantages of the invention will become apparent from the following description on the one hand, and from several illustrative and non-limiting examples of embodiments given with reference to the accompanying schematic drawings on the other hand, in which:

[0030] [Fig. 1] represents a view of an example of a power module to which an interconnector according to the invention can be connected;

[0031] [Fig.2] represents an external view of the power module housing of the [Fig.1]

[0032] [Fig.3] represents a view of a power module connected to a grid of connection of the interconnector of the invention;

[0033] [Fig.4] represents a view of the power assembly comprising a module of power and the interconnector of the invention.

[0034] The features, variants, and different embodiments of the invention, as described or as they will be presented in the detailed description that follows, can be combined in various ways, provided that they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of features described hereafter in isolation from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0035] For the sake of clarity, the same elements are designated by the same references in the different figures.

[0036] Fig. 1 represents a view of an example of a power module 1 to which an interconnector according to the invention can be connected.

[0037] The invention relates specifically to an interconnector 50 (visible in [Fig. 4]) intended to be electrically connected to a power module, for example the The interconnector 50 comprises a power module 1 illustrated in [Fig. 1] and an electronic board and / or busbar-type power conductors. According to the invention, the interconnector 50 comprises a connection grid 111 including electrically conductive elements 102, 202, among which at least one electrically conductive signal track 102 and at least one power conductor 202 are included. Each of the conductive elements includes, at a first end, a connection pad 1023 for electrical connection to the power module 1 and, at a second end, a connection terminal 2023 for electrical connection to the electronic board or the power conductors. The interconnector 50 further comprises an enclosure 51 partially overmolded around the electrically conductive elements 102, 202. The connection pads 1023 and the connection terminals 2023 are arranged outside the enclosure 51.In other words, the 1023 connection ranges and the 2023 connection terminals are free, meaning they are not integrated into the overmolding. This means they are accessible for making an electrical connection.

[0038] Before describing the interconnector of the invention in more detail, and to understand the advantages of such an interconnector, an example of a power module 1 to which the interconnector 50 can be connected will be described. It should be noted that the power module is an example of an application. The principle of the invention applies similarly to other forms and components of power modules.

[0039] The power module 1 is intended to be connected to a connection grid 111. The power module 1 comprises a power board 101 including a power module substrate 1011, and two power portions 1012 arranged on the substrate 1011. The substrate 1011 forms the main support for the power module 1. The power module 1 includes a signal board 11 mounted on the power board 101. The signal board 11 is electrically connected to the power board 101.

[0040] The power module 1 comprises electrically conductive connection pads 12, 22. Each connection pad 12, 22 comprises a first face 121, 221 and a second face 122, 222, parallel to the first face 121, 221. The first face 121, 221 is connected to one of the power portions 1012 and the signal board 11. The second face 122, 222 is intended to be electrically connected to the connection grid 111. The substrate 1011 extending in an XY plane, the connection pads 122, 222 extend along a Z-axis perpendicular to the XY plane of the substrate 1011.

[0041] The power module 1 includes a housing 13 (visible in [Fig.2]) enclosing the power board 101, the signal board 11 and the connection pads 12, 22. According to one embodiment, the encapsulation material of the housing 13 is an epoxy resin.

[0042] The second face 122, 222 of the connection pads 12, 22 is flush with a top surface of the housing 13. In other words, the second face 122, 222 is located in the plane of a top surface of the housing 13 of the power module 1. The second face 122, 222 is free so as to allow an electrical connection with the connection grid.

[0043] It should be noted that such a power module 1 does not include the connection grid within the housing. It thus provides a connection to the power sections 1012 and to the signal board 11, which is located on the upper surface of the housing 13. This arrangement is particularly advantageous since the power module does not include the connection grid 111 within its housing 13. The connection grid forms part of the interconnector of the invention, which will be described below. The connection between the connection grid 111 and the power board 101 is made via the connection pads, the second face of which is accessible on the upper surface of the housing. There are no electrically conductive traces 102 to be provided within the housing 13. This avoids the need for specific molds with complex resin flow within the mold during the resin injection phase to coat the housing.

[0044] Such a power module 1 thus has power and signal connections which extend along the Z axis perpendicular to the XY plane of the substrate.

[0045] According to an optional variant of the power module, and as illustrated in [Fig.1], the two power portions 1012 are arranged on either side of the signal card 11. The power portions 1012 are flat strips directly arranged on the substrate 1011, parallel to each other and coplanar. Put another way, the signal card 11 is interposed between the two power sections 1012. The signal card 11 is placed on the power card 101 in a central position and the two power sections 1012 are placed on the power card 101, each being adjacent to the signal card 11. The two power sections 1012 and the signal card 11 thus form three parallel alternating bands: a first power section 1012 placed contiguous to the signal card 11, itself placed contiguous to the second power section 1012.This distribution of power portions around the signal map, forming parallel bands, is symbolized by means of dotted lines on [Fig. 1].

[0046] According to the embodiment illustrated in [Fig.1], the power card includes power portions 1012 which are either at potential B, or at potential B+ or at Phase potential.

[0047] The power board 101 also includes at least one power transistor 131, 132. On the power module 1 of [Fig. 1], eight transistors are shown: four are on a first power portion and four others are on a The second power portion. Of course, a different number of transistors and / or a different arrangement does not deviate from the scope of the invention. Power transistors enable the conversion of direct current into a polyphase current system and vice versa. This could be, for example, an insulated-gate field-effect transistor, or MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor, according to Anglo-Saxon terminology).

[0048] In a known manner, each transistor 131, 132 is connected by electrical connection means 133, 134 to a power portion 1012 and the signal board 11.

[0049] Each power portion 1012 is intended to be electrically connected to at least one electrically conductive track of the connecting grid via at least one connecting pad 22. The connecting pads 22, arranged between the power portions 1012 and the connecting grid, serve to transmit power between the power portions 1012 and the electrically conductive tracks of the connecting grid. In [Fig. 1], the connecting pads 22 are cylindrical in shape. This representation is not limiting. The connecting pads can be of various shapes such as cubes, parallelepipeds, or any other volumetric shape.

[0050] The signal card 11 is electrically connected to the power card 101. The signal card 11 is connected to the various power transistors of the power card 101 by the connection means 134 in order to send the signals enabling the control of the power transistors.

[0051] Electrically connected terminals 12 are present on the signal card 11. These terminals 12 allow electrical control signals to be transmitted between the signal card 11 and the outside of the power module 1.

[0052] The arrangement of the two power portions 1012 around the signal card 11 has the advantage of avoiding power line crossings above the substrate.

[0053] In such a module, the power and signal connections extend upwards from the power substrate, i.e., from the substrate and perpendicular to the plane of the substrate, possibly assembled in three groups and molded without a connection grid with the upper surface outside the housing of the power module. A first group forms an output contact on one side of the module via a power portion 1012 (for example, the phase), a second group forms a signal contact in the middle of the substrate via the signal board, a third group forms all the power input and output contacts on a second side (for example, B+, B-, phase).

[0054] The design of the power module is simplified since it is not impacted by specific interfaces and can be the same between all applications for traction inverters, with a significant reduction in development costs.

[0055] It is understood from the foregoing that the interconnector, the subject of the invention, is intended to cooperate with such a power module. As will be shown below, an interconnector 50 comprising the connection grid allows for a simplified design of such a power module and facilitates adaptation of the interface between the power module and the electronic board or any other customer interface. It follows that the invention makes it possible to adapt the interconnector to connection requirements and thus offers the possibility of a compact and standardized power module regardless of the subsequent application envisaged. In other words, the interconnector accommodates all variants of customer interfaces. It allows for a high degree of modularity in the application of a standardized power module.

[0056] In a variant of the power module 1, the second face 122 of at least one connection pad 12 connected to the signal card 11 has one degree of freedom in translation about a Z-axis perpendicular to the XY plane of the substrate 1011. The first face 121 and the second face 122 are connected by elastic deformation means. The elastic deformation means of the connection pads 12 are arranged so as to ensure the parallelism of the first and second faces 121, 122 when these means are deformed along a Z-direction perpendicular to the surfaces of the first and second faces 121, 122.

[0057] The connection pads 12 are elastically deformable. These pads therefore exhibit a certain elasticity which allows them to compensate for the vertical play (along the Z axis) in the relative positioning of the power module and the interconnector.

[0058] The first face 121 of at least one connection pad 12 is electrically connected to the signal card 11. The connection is made by an electrically conductive means such as welding, for example laser or ultrasonic welding, brazing, electrically conductive gluing or any other equivalent means.

[0059] In a variant of the power module 1, the second face 222 of at least one connection pad 22 connected to the power portions 1012 is at a constant distance from the first face 221 of said connection pad 222. In other words, the connection pad 22 is a rigid pillar.

[0060] Figure 2 shows an external view of the power module housing of Figure 1. This view highlights the substrate 1011, which supports the power module 1, and the encapsulation by the housing 13 of all the elements constituting the power module. It can also be seen that the second faces 122, 222 are flush with the upper surface of the housing 13. Thus, it is sufficient to place the interconnector 50 of the invention on the upper surface of the housing 13 to allow the connection of the power module's inputs / outputs. The interconnector 50 is intended to cooperate with any power module comprising second faces 122, 222 on the upper surface of the power module's housing 13. second faces constituting the electrical connection points between the interconnector connection grid and the power portions and the signal board of the power module.

[0061] Figure 3 shows a view of a power module connected to a connection grid 111 of the interconnector 50 of the invention. In this view, and in order to clearly show the electrical connections at the second faces 122, 222, the enclosure 51 is not shown. The connection grid 111 comprises the electrically conductive elements 102, 202. We see here two types of conductive elements. One type of conductive element is formed by the electrically conductive signal traces 102, intended to be connected to the electronic board for controlling the module. The electronic board may be of the PCB type. The other type of conductive element is formed by the power conductors 202 intended to be connected to the power conductors, in particular the busbars, which may carry AC or DC current for the power connections of the module.

[0062] Each of the conductive elements 102, 202 has two ends. At one end is a connection pad 1023. The connection pad is electrically connected to the power module 1. More precisely, the connection pad 1023 of a conductive element is connected to a second face of a connection pad. At the other end is a connection terminal 2023 intended to be electrically connected to the electronic board, typically to a connection pin of an electronic device constituting the customer interface.

[0063] As can be seen in [Fig. 2], the upper surface of the power module 1 exposes the second faces 122, 222 of the connection pads. These second faces, flush with the upper surface of the housing 13, are the connection point between the connection grid and the power portions 1012 and the signal card 11.

[0064] The end 1023 (the connection range) of an electrically conductive track 102 can then be connected to a second face of a connection pad by laser welding or by ultrasonic welding.

[0065] According to one possible embodiment shown in [Fig. 3] by way of example, at least one electrically conductive track 102 comprises a first part 1021 having a planar shape and a second part 1022 comprising the connection area 1023. The second part may have a three-dimensional shape. The first part 1021 extends along an axis intersecting, preferably perpendicular, a surface of the connection area 1023.

[0066] The connection area 1023 of the second part 1022 of the electrically conductive track 102 is flush with an outer surface of the housing 13. It is the connection area 1023 that is welded to its associated second face. This is one embodiment, and the invention is by no means limited to this configuration. of tracks 102. Within the framework of the invention, other forms of tracks 102 are conceivable.

[0067] Similar to the electrically conductive tracks 102, the connection grid also includes conductors 202 associated with the power portions 1012. Each conductor 202 also has a connection area 1023 and a connection terminal 2023. The connection area 1023 is intended to be in contact with, and soldered to, a second face 222 of the power module. The connection terminal 2023 is intended to be electrically connected to the auxiliary device (customer interface).

[0068] It is clear from the description of the invention that the interconnector 50 offers a high degree of adaptability in the connections between the power module and the customer interface. It is sufficient to adapt the routing of its electrically conductive traces 102 and its conductors 202 to electrically connect the power portions and the signal board of the power module to the connection pins of the customer interface. Such an interconnector 50 provides the necessary adjustment between a standardized power module and the connection pins of the customer device. The interconnector 50 has the advantage of being easily adaptable to the positioning of the connection pins. It is sufficient to modify the connection terminals 2023, and possibly the routing of the conductive elements 102 and 202, and to overmold the conductive elements to obtain an interconnector compatible with the customer device.

[0069] Figure 4 shows a view of the power assembly 150 comprising a power module 1 and interconnector 50 of the invention. The power assembly 150 comprises an interconnector 50 as described above and a power module also described above.

[0070] In the power assembly 150, the second face 122, 222 of the connection pads 12, 22 is flush with a top surface of the housing 13 and, for each connection pad 12, 22, a connection range 1023 of the interconnector 50 is electrically connected to a second face of one of the connection pads 12, 22.

[0071] In a variant of the power module described above, the connecting pads 12 have one degree of freedom in translation along the Z-axis between its two faces 121, 122. In other words, the connecting pads 12 are elastically deformable. These pads therefore exhibit a certain elasticity that allows them to compensate for vertical play along the Z-axis when a force is applied to them. This means that the assembly of the interconnector on the power module allows for vertical compensation at the level of the connecting pads 12 to ensure the connection in the interconnector 50. Thanks to the elasticity of the connecting pads 12, even in the presence of a positioning error, the connection between the connection areas 1023 and the second faces 102 is guaranteed.

[0072] As can be seen in [Fig. 4], the interconnector 50 is perforated. The perforations 52 (or through-holes 52) correspond to the access points of the connection ranges 1013 of the conductive elements. Once the interconnector 50 is positioned on the upper surface of the housing 13 of the power module, the perforations 52 become cavities since the lower face of the interconnector conforms to the shape of the upper surface of the housing 13 so as to form a power assembly with a substantially flat upper surface.

[0073] Depending on the configuration of the customer interface device, metallic parts, for example a circuit board support, may be positioned near the interconnector. Such a configuration presents a risk to electrical insulation, in particular the electrical insulation distance, which must be greater than a predefined distance, for example, greater than 4 mm (millimeters) for a voltage of 800 V DC.

[0074] In one embodiment of the invention, the interconnector 50 may include an insulating material (for example, an insulating gel or an epoxy resin) in at least one, and preferably each, of the cavities 52 formed in the interconnector, in order to guarantee the required insulation distance and comply with the insulation rules.

[0075] The invention also relates to a current converter, in particular DC / DC or AC / DC, comprising a power assembly 150 as described above, an electronic board comprising connection pins electrically connected to the connection terminals of the interconnector 50 of the power assembly 150, and a heat sink on which at least one power assembly 150 is disposed. The heat sink ensures the dissipation of heat produced by the power module(s) of the power assembly 150.

[0076] In one variant, the current converter may include an interconnector, per power module or per group of at least two power modules.

[0077] Of course, the invention is not limited to the examples just described, and many modifications can be made to these examples without departing from the scope of the invention. In particular, the features of different embodiments of the invention can be combined to carry out the invention, provided that these embodiments are not incompatible with each other.

Claims

Demands

1. Interconnector (50) intended to be electrically connected to a power module (1) and to an electronic board and / or to power connectors, characterized in that it comprises: - a connection grid (111) comprising electrically conductive elements (102, 202) among which at least one electrically conductive signal track (102) and at least one power conductor (202), each of the conductive elements comprising, at a first end, a connection area (1023) intended to be electrically connected to the power module (1) and, at a second end, a connection terminal (2023) intended to be electrically connected to the electronic board and / or to the power conductors, - an enclosure (51) partially overmolded around the electrically conductive elements (102, 202), the connection areas (1023) and the connection terminals (2023) being disposed outside the enclosure (51).

2. Interconnector (50) according to claim 1, wherein the connection ranges (1023) are parallel to each other.

3. Interconnector (50) according to claim 1 or 2, wherein the at least one electrically conductive track (102) comprises a first part (1021) having a planar shape and a second part (1022) comprising the connection area (1023), the first part (1021) extending along a secant axis, preferably perpendicular, to a surface of the connection area (1023).

4. A power assembly (150) comprising an interconnector (50) according to any one of claims 1 to 3, and at least one power module (1) comprising: - A power board (101) comprising a power module substrate (1011), two power portions (1012) disposed on the substrate (1011), - A signal board (11) mounted on the power board (101), - Electrically conductive connection pads (12, 22), each connection pad (12, 22) comprising a first face (121, 221) and a second face (122, 222) parallel to the first face (121, 221), the first face (121, 221) being connected to one of the power portions (1012) and the signal card (11), - A housing (13) enclosing the power card (101), the signal card (11) and the connection pads (12, 22), the second face (122, 222) of the connection pads (12, 22) being flush with a top surface of the housing (13) and, for each connection pad (12, 22), a connection range (1023) of the interconnector (50) being electrically connected to a second face of one of the connection pads (12, 22).

5. Power assembly (150) according to claim 4, wherein the two power portions (1012) are arranged on either side of the signal card (11).

6. Power assembly (150) according to claim 4 or 5, wherein the second face (122) of at least one connection pad (12), preferably of each of the connection pads connected to the signal card (11), has a degree of freedom in translation about an axis (Z) perpendicular to the plane (XY) of the substrate (1011).

7. Power assembly (150) according to any one of claims 4 to 6, wherein the second face (222) of at least one connecting pad (22), preferably of each of the connecting pads connected to the power portions (1012), is at a constant distance from the first face (221) of said connecting pad (222).

8. Power assembly (150) according to any one of claims 4 to 7, wherein the first face (121) of at least one connection pad (12) is connected to the signal board (11) by means taken from electrically conductive bonding, welding or brazing.

9. Current converter, in particular DC / DC or AC / DC, comprising a power assembly (150) according to any one of claims 4 to 8, an electronic board comprising electrically connected connection pins to the connection terminals of the interconnector (50) of the power assembly (150), and a heat sink on which at least one power assembly is disposed.

10. Motor vehicle comprising a current converter according to any one of claims 8 to 9.

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