Electrical interconnector for an electronic device
The electrical interconnector with an integrated grounding tab addresses space and assembly challenges by providing efficient grounding in electronic devices, reducing bulk and mechanical stress while maintaining robustness.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- VALEO ELECTRIFICATION SAS
- Filing Date
- 2025-12-19
- Publication Date
- 2026-06-25
AI Technical Summary
Existing interconnectors in electronic devices, such as vehicle on-board chargers, face challenges in providing optimal grounding solutions in limited space and complex assemblies, often requiring additional components and assembly steps that increase bulk and risk mechanical stress on PCBs.
An electrical interconnector with an integrated grounding tab, comprising a body made of insulating material and metallic grounding elements that are soldered to the electronic board and elastically deformable to contact a conductive housing, ensuring ground continuity while minimizing space and assembly complexity.
The integrated grounding tab reduces space requirements, simplifies assembly, and protects PCBs from mechanical stress by eliminating normal reaction forces, thus enhancing robustness and reducing costs.
Smart Images
Figure EP2025088504_25062026_PF_FP_ABST
Abstract
Description
[0001] DESCRIPTION
[0002] Title: Electrical interconnector for an electronic device
[0003] [1] The invention relates in particular to an electrical interconnector for an electronic device.
[0004] [2] In known electronic devices, for example in vehicle on-board chargers, several functions must be performed, as described below.
[0005] [3] Interconnectors consist of metal pins that provide an electrical connection between a wiring harness and an electronic circuit board (or PCB). These interconnectors have female contact elements fixed or soldered to the circuit board, which receive the male pins of the customer harness to establish an electrical connection.
[0006] [4] Grounding is an essential function to prevent potential differences and provide protection against electromagnetic interference (EMI). This function is often achieved using fixing screws that establish a point of contact between a dedicated trace on the circuit board and the device's metal chassis, thus playing a role in grounding.
[0007] [5] Other solutions use spring strips that establish a mechanical and electrical connection between the electronic board and the metal chassis, or dedicated cables that directly connect certain electronic components or traces of the printed circuit board to the chassis to provide grounding.
[0008] [6] These solutions are not optimal in applications where space is limited or where the assembly is complex.
[0009] [7] The invention aims in particular to address these grounding problems.
[0010] [8] The invention thus relates to an electrical interconnector for an electronic device such as an on-board vehicle charger, the electrical interconnector comprising:
[0011] - a body made of insulating material, particularly plastic,
[0012] - one or more electrical contact elements, in particular of the male or female type, arranged in said body and configured to transmit electrical signals or power,
[0013] - at least one grounding tab, in particular metallic, integral with said body, said grounding tab being configured to be, on the one hand, fixed, in particular soldered, to an electronic board, in particular in contact with a grounding trace of said electronic board, and, on the other hand, in contact with a conductive portion of a cover or metallic housing of the electronic device, thereby ensuring ground continuity between the electronic board and said cover or housing. The electronic device is advantageously itself connected to the vehicle's ground.
[0014] [9] According to one aspect of the invention, the grounding tab comprises:
[0015] - a first section configured to be fixed, in particular soldered, onto the electronic board and in particular in contact with a grounding trace of said electronic board, the soldering being in a plane normal to the electronic board, possibly a second section extending from the first section and in particular inclined with respect to it, this second section being in particular elastically deformable,
[0016] - a third section configured to be brought into contact, in particular with elastic deformation, with the conductive portion of a cover or a metal casing of the electronic device, where appropriate the third section extending the second section.
[0017]
[0010] According to one aspect of the invention, the first section is fixed perpendicularly to the electronic board.
[0018]
[0011] According to one aspect of the invention, the second section is inclined relative to the first section, forming in particular a right angle.
[0019]
[0012] This is suitable when the electrical interconnector is placed perpendicular to the cover. However, the angles between the different sections could be distributed differently, depending on the configuration of the different elements.
[0020]
[0013] According to one aspect of the invention, the third section is extended by the second section, configured to come into contact with a conductive portion of a metal cover or housing, with elastic deformation at least at the moment of contact. The elastic deformation can persist over time.
[0021]
[0014] In one embodiment, the grounding tab comprises only the first and third sections joined and perpendicular to each other, the second section being absent. This is suitable when the electrical interconnector is placed parallel to the cover.
[0022]
[0015] Integrating the grounding tab within the electrical interconnector minimizes the space required on the electronic board. Indeed, the grounding tab's footprint is small, thus avoiding additional bulk.
[0016] Furthermore, the grounding tab is integrated into the interconnector without requiring any additional operations during the assembly process within the electronic device. This makes the invention process-neutral, while reducing the costs associated with the integration steps.
[0023]
[0017] Furthermore, the invention does not involve any significant modification of the overall design, with a minimal impact on the design of the electronic devices, for example with the addition of a boss on the cover or the metal housing to ensure a ground contact with the grounding tab.
[0024]
[0018] Another advantage of the invention lies in the fact that the grounding tab is configured to make contact with the top cover rather than with the opposite main casting. This configuration eliminates reaction forces in a direction normal to the plane of the PCB, thus preventing the risk of PCB bending. This helps protect the solder joints of surrounding components from mechanical stress.
[0025]
[0019] According to one aspect of the invention, the grounding tab is configured to be held in the body of the electrical interconnector by at least one clipping tab.
[0026]
[0020] According to one aspect of the invention, the elastic clipping tab is configured to retract when the grounding tab is inserted into a cavity in the body, and then to resume an extended shape after passing through a shoulder of the cavity, so as to immobilize the grounding tab in said cavity.
[0027]
[0021] According to one aspect of the invention, the grounding tab includes a positioning lug configured to rest against a side of the cavity of the electrical interconnector body.
[0028]
[0022] For example, the grounding tab is inserted into the body of the electrical interconnector from one face of the body, while the electrical contact elements are inserted from an opposite face. Alternatively, the grounding tab is inserted into the body of the electrical interconnector from one face of the body, and the electrical contact elements are also inserted from this first face.
[0029]
[0023] According to one aspect of the invention, the cavity which receives the grounding tab passes through the body between two opposite faces.
[0030]
[0024] In another embodiment of the invention, the grounding tab is integrated into the body of the electrical interconnector, by being overmolded in a material of the body or by being press-fitted into the body of the electrical interconnector.
[0031]
[0025] According to one aspect of the invention, the third section of the grounding tab is elastically deformable in order to ensure reliable contact with the cover or metal housing, even in the case of mechanical tolerances.
[0032]
[0026] According to one aspect of the invention, the grounding tab comprises a second section extending parallel to a face of the body of the electrical interconnector, and protected by two walls formed by the body of the electrical interconnector.
[0033]
[0027] According to one aspect of the invention, the walls and a base connecting the two walls are made of the same insulating material as the rest of the body of the electrical interconnector, and are configured to protect the grounding tab against damage during transport or assembly.
[0034]
[0028] According to one aspect of the invention, the contact portion on the metal cover or housing is formed by a boss on the cover or housing, said boss being, for example, in contact with the third section of the grounding tab. This contact could be made with a casting.
[0035]
[0029] According to one aspect of the invention, the first section of the grounding tab is fixed in an orifice of the electronic board in contact with a dedicated grounding track.
[0036]
[0030] According to one aspect of the invention, the electrical interconnector includes one or more grounding tabs configured to establish multiple grounding points between the electronic board and a cover or a metal housing.
[0037]
[0031] The invention also relates to an electronic device, in particular an on-board vehicle charger, comprising:
[0038] - an electronic card,
[0039] - an electrical interconnector as described above, fixed to said electronic board,
[0040] - a metal cover or housing configured to make contact with the grounding tab of the electrical interconnector.
[0041]
[0032] According to one aspect of the invention, the metal cover or housing includes a conductive protrusion / boss configured to locally bear against the grounding tab.
[0042]
[0033] According to one aspect of the invention, the grounding tab defines a metallic contact, soldered onto the electronic board, and distinct from the female type electrical contact elements, said tab being configured to ensure a ground connection between the electronic board and a metallic cover or housing.
[0043]
[0034] According to one aspect of the invention, the grounding tab is soldered onto the electronic board in the same way as female type electrical contact elements.
[0044]
[0035] Thus the grounding tab makes it possible to merge the connection and grounding functions within the same component.
[0045]
[0036] According to one aspect of the invention, the electrical harness associated with the electronic device includes a male interconnector fixed to a main housing of the device, configured to be inserted into the female contact elements of the electrical interconnector, said female contact elements being integral with the electronic board.
[0046]
[0037] According to one aspect of the invention, the grounding tab is made from a cut metal strip, the shape of the tab being obtained by cutting and folding.
[0047]
[0038] According to one aspect of the invention, the grounding tab is configured with a clipping tab formed by cutting and folding on a longitudinal edge of the tab.
[0048]
[0039] The invention further relates to a grounding method for an electronic device comprising the step of lowering a cover onto an electronic board equipped with an electrical interconnector as mentioned above, so that a conductive portion of the cover comes locally into contact with the grounding tab or so that the grounding tab comes into contact with a metallic cratering part of the cover or the housing.
[0049]
[0040] The invention further relates to an electronic device, in particular of the high voltage or low voltage type, comprising an interconnector according to the invention.
[0050]
[0041] The electronic device is of any type, including high voltage or low voltage type, in which an electronic board (or PCB) is to be assembled perpendicular to another, and is subjected to a force (insertion or otherwise).
[0051]
[0042] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and several exemplary embodiments given by way of illustration and not limitation with reference to the accompanying schematic drawings on the other hand, in which:
[0052]
[0043] [Fig. 1] Figure 1 schematically represents, in perspective, an electronic device according to an example of an embodiment of the invention;
[0044] [Fig. 2] Figure 2 is a view inside the electronic device of Figure 1;
[0053]
[0045] [Fig. 3] Figure 3 is an enlarged view of part of Figure 2;
[0054]
[0046] [Fig. 4] Figure 4 shows the electrical interconnector on the electronic board of the electronic device of Figure 1;
[0055]
[0047] [Fig. 5] Figure 5 shows in isolation the electrical interconnector of Figure 4;
[0056]
[0048] [Fig. 6] Figure 6 shows a cross-section of the electronic device of Figure 1;
[0057]
[0049] [Fig. 7] Figure 7 shows a detail of the electrical interconnector of Figure 5;
[0058]
[0050] [Fig. 8] Figure 8 shows a cross-section of the electrical interconnector of Figure 5.
[0059]
[0051] The features, variants, and different embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of features, described hereafter in isolation from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.
[0060]
[0052] Figure 1 shows an electronic assembly 1 comprising an on-board charger 2 suitable for assembly with an external module (not shown) which is here a power distribution unit (or "Power Distribution Unit" in English for PDU).
[0061]
[0053] The on-board charger 2 is configured to convert the alternating current available on the electrical network into direct current capable of charging the vehicle's battery.
[0062]
[0054] The on-board charger 2 comprises a main housing 5, which is here a cast part, and a plurality of electronic boards housed in the main housing 5, as will be described later.
[0063]
[0055] The on-board charger 2 further includes a cover 7, which is here a cast part, configured to close the main housing 5.
[0064]
[0056] The cover 7, generally in the form of a plate with reinforcing ribs on its inner face, is configured to receive, on its outer face 9, the external module.
[0065]
[0057] Among the electronic boards housed in the main housing 5, there is a main electronic board 10, configured to be arranged substantially horizontally when the electronic assembly 1 is in place on the vehicle, as illustrated for example in Figures 2 and 3.
[0066]
[0058] This main electronic board 10 extends globally in a plane P1 defined by axes X and Y. A Z axis forms a right-handed orthonormal trihedron with the axes X and Y.
[0059] The main electronic board 10 comprises a first planar substrate 11 (here in FR4) on which slots 12 and 14 are formed, as will be described below.
[0067]
[0060] Among the electronic boards housed in the main casing 5, there is also a transverse electronic board 15, configured to be arranged substantially vertically, comprising a second flat substrate 16 (here in FR4) with protrusions 17 in the plane P2 (defined by the X and Z axes) of the second flat substrate
[0068] 16.
[0069]
[0061] The transverse electronic card 15 is a card configured to link different equipment / components for the exchange of data between them. Such a card is notably called a "Gateway" in English.
[0070]
[0062] The outgrowths 17 are in the form of an elongated tongue, in the plane P2 of this second substrate 16. The tongue has a substantially rectangular perimeter.
[0071]
[0063] Each protrusion 17 is configured to be inserted into the slot 12 of the first substrate 11 of the main electronic board 10 so as to form a substantially right-angled connection between the first substrate 11 of the main electronic board 10 and the second substrate 16 of the transverse electronic board 15.
[0072]
[0064] The transverse electronic card 15 carries an electrical interconnector 19, here a signal interconnector, with holes to receive signal pins.
[0073]
[0065] The connections formed by the cooperation of the slots 12 and the protrusions 17 allow for counter-support or force transfer of the transverse electronic board 15, which carries the electrical interconnector 19, against bending of this electronic board during the insertion or removal operations of a connector base 500 onto the electrical interconnector 19 carried by the transverse electronic board 15. Indeed, during the assembly of the electronic assembly on an assembly line, a force is then transmitted to the transverse electronic board 15 in the direction normal to the plane P2 of this transverse electronic board 15. This direction of force can lead to a bending phenomenon that can cause breakage of the solder joints of neighboring electronic components.
[0074]
[0066] Thanks to the bonds formed by the cooperation of the slots 12 and the outgrowths
[0075] 17, the force induced by connecting a connector base to the interconnector of the transverse circuit board 15 is transmitted to the main circuit board 10 (which is positioned like the upper circuit board 10), in the direction of its plane. This direction is very favorable in terms of robustness and, since this main circuit board 10 is advantageously screwed to a main housing (or main casing) at several points, the deformation of this main circuit board 10 (or upper circuit board) is well below the permissible limits.
[0076]
[0067] In the example described, the first substrate 11 of the main electronic board 10 includes two slots 12, aligned with each other, and the second substrate 16 of the transverse electronic board 15 includes two protrusions 17 in the plane P2 of the second substrate 16 and each of the protrusions 17 is configured to be inserted into one of the slots of the first substrate 11.
[0077]
[0068] In an unrepresented variant, the first substrate 11 of the main electronic board 10 includes a single slot for a single protrusion of the second substrate 16.
[0078]
[0069] In the example described, the two slots 12 are identical to each other. In an unshown variant, said at least two slots are different, for example of different lengths.
[0079]
[0070] In the example described, the two protrusions 17 are identical to each other. In an unshown variant, said at least two protrusions 17 are different, for example of different lengths.
[0080]
[0071] The slots 12 have an elongated shape, which is substantially parallel to a straight edge 20 of the first substrate 11.
[0081]
[0072] The slots 12 are obtained for example by machining.
[0082]
[0073] Each slot 12 has, in the elongation direction along the X axis, a dimension greater than the dimension of the protrusion 17 measured in this elongation direction X so that the insertion of the protrusion 17 into the slot 12 can be made with a clearance in this elongation direction X.
[0083]
[0074] This set allows flexible relative positioning in the elongation direction X of the slot 12 because the protrusion 17 has a smaller dimension than that of the slot 12.
[0084]
[0075] The protrusions 17 extend along the edge 20 of the transverse electronic card 15.
[0085]
[0076] The outgrowths 17 are formed by cut or machined extensions of the second substrate 16.
[0086]
[0077] In the described example, the electrical interconnector 19 is carried by the transverse electronic board 15 and the protrusions 17 extend along the edge 20 of the second substrate 16 of this transverse electronic board 15, over a length of this edge 20 which covers the ZE area in which the electrical interconnector 19 is located.
[0078] Thus, the bending of the transverse electronic board 15 is limited in the ZE area which is stressed during the insertion or removal of a connector base on the electrical interconnector 19 of the transverse electronic board 15.
[0087]
[0079] The first substrate 11 of the main electronic board 10 includes, in addition to elongated slots 12, an additional slot 14, placed between two elongated slots 12, and this additional slot 14 is configured to receive a finger 23 formed on the second substrate 16 of the transverse electronic board 15.
[0088]
[0080] Thus, the two electronic boards can be linked by three connections, two of the connections being formed by the elongated slots 12 and the protrusions 17, and the third connection being formed by the additional slot 14 and the finger 23 inserted therein. The sum of these three connections makes it possible to eliminate three degrees of freedom.
[0089]
[0081] The additional slot 14 has a dimension measured in the elongation direction X of the elongated slots which is smaller than the dimension of each slot 12 in this elongation direction X.
[0090]
[0082] In other words, the additional slot 14 has a lower elongation than the neighboring elongated slots 12.
[0091]
[0083] The aforementioned elongated slots 12 have a transverse dimension measured along the Y axis perpendicular to the elongation direction X which is equal to the thickness of the tabs 17 which are inserted therein so that the resulting connection has a degree of freedom along the X axis and not along the Y axis.
[0092]
[0084] The additional slot 14 with smaller elongation dimensions has a transverse dimension along the Y axis which is greater than the thickness of the finger 23 inserted in this additional slot 14 so that the connection formed by this additional slot 14 and the finger 23 inserted therein allows precise referencing (or positioning) along the X axis and allows play along the Y axis.
[0093]
[0085] Thus, the combination of the elongated slots and the additional slot allows precise referencing of the two electronic cards 10, 15 to each other along the X and Y axes. The additional slot 14 does not participate in the holding, but allows for positioning.
[0094]
[0086] Positioning along the Z axis is done by pressing the two electronic cards 10, 15 against each other at 90 degrees.
[0095]
[0087] The finger 23 has chamfers. This allows for a pre-guiding function via these chamfers and positioning along the Y direction.
[0096]
[0088] The main housing 5 also contains a main electronic board 30, called the lower main electronic board.
[0089] The electrical interconnector 19 will now be described in more detail. This comprises:
[0097] - a body 101 made of insulating material, in particular a plastic material,
[0098] - several electrical contact elements 102 (see figure 7), here of the female type, in the form of pins, arranged in said body 101 and configured to transmit electrical signals,
[0099] - a metallic grounding tab 103, integral with said body 101.
[0100]
[0090] Said grounding tab 103 is configured to be, on the one hand, fixed, being soldered, on the transverse electronic board 15, in contact with a grounding track of said electronic board 15, and, on the other hand, in contact with a conductive portion 106 (see figure 6) of a cover 7 of the electronic device, making it possible to ensure ground continuity between the electronic board 15 and said cover 7.
[0101]
[0091] As illustrated in Figure 7, the grounding tab 103 comprises:
[0102] - a first section 110 configured to be fixed, being soldered, on the electronic board 15 and in particular in contact with the grounding track of said electronic board 15, the solder being in a plane normal to the electronic board 15, a second section 111 extending from the first section 110 and being inclined relative to it, this second section 111 being elastically deformable, a third section 112 configured to be in contact, in particular with elastic deformation, with the conductive portion 106 of a cover 7.
[0103]
[0092] The first section 110 is fixed perpendicularly to the electronic card 15.
[0104]
[0093] The second section 111 is inclined relative to the first section 110, forming substantially a right angle.
[0105]
[0094] This is suitable when the electrical interconnector 19 is placed perpendicular to the cover 7.
[0106]
[0095] The third section 112 is extended by the second section 111, being configured to come into contact with a conductive portion 106 of the cover 7, with elastic deformation at the time of contact.
[0107]
[0096] In an unillustrated variant, the grounding tab 103 comprises only the first section 110 and the third section 112 joined and perpendicular to each other, the second section 111 being absent. This is suitable when the electrical interconnector 19 is placed parallel to the cover 7.
[0097] The grounding tab 103 is configured to be held in the body 101 of the electrical interconnector 19 by at least one elastic clipping tab 113.
[0108]
[0098] As can be seen in Figure 8, the clipping tab 113 is configured to retract when the grounding tab 103 is inserted into a cavity 115 of the body 101, and then to resume an extended shape after passing through a shoulder 116 of the cavity 115, so as to immobilize the grounding tab 103 in said cavity 115.
[0109]
[0099] The grounding tab 103 includes a positioning tab 117 configured to bear against a flank 118 of the cavity 115 of the body 101 of the electrical interconnector 19.
[0110]
[0100] For example, the grounding tab 103 is inserted into the body 101 of the electrical interconnector 19 from a first face 119 of the body 101, while the electrical contact elements 102 are inserted from an opposite face 120.
[0111]
[0101] The cavity 115 which receives the grounding tab 103 passes through the body 101 between two opposite faces 119 and 120.
[0112]
[0102] In another embodiment of the invention not shown, the grounding tab 103 is integrated into the body 101 of the electrical interconnector 19, by being overmolded in a material of the body 101 or by being press-fitted into the body 101 of the electrical interconnector 19.
[0113]
[0103] The third section 112 of the grounding tab 103 is elastically deformable to ensure reliable contact with the cover 7, even in the case of mechanical tolerances.
[0114]
[0104] The second section 111 extending parallel to a facade formed by the first face 119 of the body 101 of the electrical interconnector 19, and protected by two walls 122 formed by the body 101 of the electrical interconnector 19, as illustrated in Figure 5.
[0115]
[0105] The walls 122 and a base 123 connecting the two walls 122 are made of the same insulating material as the rest of the body 101 of the electrical interconnector 19, and are configured to protect the grounding tab 103 against damage during transport or assembly.
[0116]
[0106] The conductive contact portion 106 on the cover 7 is formed by a boss / column of the cover 7, said boss 125 coming into contact with the third section 112 of the grounding tab 103.
[0107] The first section 110 of the grounding tab 103 is fixed in an orifice of the electronic board 15 in contact with a dedicated grounding track 105.
[0117]
[0108] The grounding tab 103 defines a metallic contact 130, soldered onto the electronic board 15, and distinct from the female type electrical contact elements 102, said tab 103 being configured to ensure a ground connection between the electronic board 15 and the cover 7.
[0118]
[0109] The grounding tab 103 is soldered onto the electronic board 15 in the same way as the female type electrical contact elements 102.
[0119]
[0110] The electrical harness includes a male connector 500 (see figure 1) fixed to the main housing 5 of the device, configured to be inserted into the female contact elements 102 of the electrical interconnector 19, said female contact elements 102 being integral with the electronic board 15.
[0120]
[0111] The grounding tab 103 is made from a cut metal strip 134, the shape of the tab 103 being obtained by cutting and folding.
[0121]
[0112] The grounding tab 103 is configured with a clipping tab 113 formed by cutting and folding on a longitudinal edge 135 of the tab 103.
[0122]
[0113] The grounding method includes the step of lowering a cover 7 onto an electronic card 15 equipped with an electrical interconnector 19, so that a conductive portion of the cover 7 comes locally into contact with the grounding tab 103.
Claims
DEMANDS
1. Electrical interconnector (19) for an electronic device such as an on-board vehicle charger (2), the electrical interconnector (19) comprising: - a body (101) made of insulating material, in particular a plastic material, - one or more electrical contact elements (102), in particular of the male or female type, disposed in said body (101) and configured to transmit electrical signals or power, - at least one grounding tab (103), in particular metallic, attached to said body (101), said grounding tab (103) being configured to be, on the one hand, fixed, in particular soldered, to an electronic board (15), in particular in contact with a grounding track of said electronic board (15), and, on the other hand, in contact with a conductive portion (106) of a cover (7) or a metallic housing of the electronic device, making it possible to ensure ground continuity between the electronic board (15) and said cover (7) or housing.
2. Interconnector according to the preceding claim, wherein the grounding tab (103) comprises: - a first section (110) configured to be fixed, in particular soldered, onto the electronic board (15) and in particular in contact with a grounding track of said electronic board (15), the soldering being in a plane normal to the electronic board (15), optionally a second section (111) extending from the first section (110) and in particular inclined with respect to it, this second section (111) being in particular elastically deformable, - a third section (112) configured to be brought into contact, in particular with elastic deformation, with the conductive portion (106) of a cover (7) or a metal housing of the electronic device, where appropriate the third section (112) extending the second section (111).
3. Interconnector according to the preceding claim, wherein the first section (110) is fixed perpendicularly to the electronic card (15).
4. Interconnector according to any one of claims 2 and 3, wherein the third section (112) is extended by the second section (111), configured to come into contact with a conductive portion (106) of a cover (7) or a metal housing, with elastic deformation at least at the moment of contact.
5. interconnector according to any one of the preceding claims, wherein the grounding tab (103) is configured to be held in the body (101) of the electrical interconnector (19) by at least one clipping tab (113), and in particular the elastic clipping tab (113) is configured to retract when the grounding tab (103) is inserted into a cavity (115) of the body (101), and then to resume an extended shape after passing through a shoulder (116) of the cavity (115), so as to immobilize the grounding tab (103) in said cavity (115).
6. Interconnector according to any one of claims 1 to 4, wherein the grounding tab (103) is integrated into the body (101) of the electrical interconnector (19), by being overmolded into a material of the body (101) or by being press-fitted into the body (101) of the electrical interconnector (19).
7. Interconnector according to any one of the preceding claims, wherein the grounding tab (103) comprises a second section (111) extending parallel to a face of the body (101) of the electrical interconnector (19), and protected by two walls (122) formed by the body (101) of the electrical interconnector (19).
8. An electronic device, in particular an on-board charger (2) for a vehicle, comprising: - an electronic card (15), - an electrical interconnector (19) according to one of the preceding claims fixed on said electronic card (15), - a cover (7) or a metal housing configured to be made in contact with the grounding tab (103) of the electrical interconnector (19).
9. Electronic device according to the preceding claim, wherein the cover (7) or metal housing includes a conductive protrusion / bump configured to locally bear against the grounding tab (103).
10. A grounding method for an electronic device comprising the step of lowering a cover (7) onto an electronic board (15) equipped with an electrical interconnector (19) according to any one of the preceding claims, such that a conductive portion (106) of the cover (7) locally contacts the grounding tab (103) or such that the grounding tab (103) come into contact with a metallic cratering part of the lid (7) or the casing.