The invention provides an electroplating method for a double-side and multilayer flexible printed circuit board, which sequentially comprises the following steps of copper foil cutting, mechanical drilling of a first through hole, hole blackening, primary dry film pressing, primary exposure, primary development, pattern electroplating, chemical grinding, secondary dry film pressing, secondary exposure, secondary development, circuit etching and dry film removal. The pattern electroplating comprises the processes that a copper-clad plate is in contact with electroplating liquid, a copper layer is plated between positions without dry film coverage including the first through hole and circuit patterns, and the copper layer is not plated and covered on the surface of a circuit pattern without the dry film coverage. The circuit etching comprises the processes that the copper-clad plate is in contact with etching liquid, and the circuit patterns are etched onto the surface of the copper-clad plate. The electroplating method has the advantages that the circuit patterns are formed during the electroplating exposure, the copper plating is adopted between circuits so that products become hard, the products can be preferably protected, the folding crease is prevented, and the circuit defects can be obviously avoided. The method only adopts once dry film removal, the cost is reduced, the delivery speed is accelerated, simultaneously, the folding crease is also prevented, and the qualification rate of finished products is improved.