Unsealing method for flip-chip packaging device

Abstract

A related unsealing method for a flip-chip packaging device comprises the following steps: S100) performing X-ray detection on the device, so as to obtain a device X-ray photograph; S200) performing device inlaying; S300) performing grinding on the inlayed device by taking the X-ray photograph as a reference; S400) performing acid dropping and cleaning on the ground device; S500) performing microscope detection, returning to the step S400) is the chip surface residue is detected, and stopping until the chip surface etching is clean. The beneficial effects comprise that the method is applicable to all flip-chip packaging devices at present, and comprises sealing, ceramic packaging and plastic packaging; through X-ray detection, the chip welding spot layout is determined, the grinding ending point can be precisely determined, and insufficient grinding and excessive grinding are both avoided; and through the process of manually dropping an acid and performing microscope detection and dropping the acid again, the etching degree is strictly controlled, the unsealing quality is guaranteed, and the welding spots and boding spots of a chip are prevented from being automatically excessively corroded.

Description

technical field [0001] The invention belongs to the technical field of detection of semiconductor integrated circuits, and in particular relates to a method for unsealing a flip-chip packaging device. Background technique [0002] Flip-chip packaging is an advanced form of semiconductor integrated circuit packaging. Its specific operation method is to create solder joints on the chip, and then flip the chip and solder it to the substrate. Since this packaging form can greatly increase the input and output (I / O) port density of the device and reduce the size and weight of the device, and simplifies the process to reduce the cost and reduce the parasitic effect of the package, it is used in the integrated circuit Packaging is used more and more widely. [0003] However, the structure of chip undercut brings difficulties to destructive physical analysis (DPA) detection and failure analysis (FA) of electronic components. Because these two types of tests need to unpack the devi...

AI Technical Summary

Problems solved by technology

[0006] 1. The existing methods are only for plastic-encapsulated devices, and cannot solve the problem of unsealing sealed devices

[0007] 2. For multi-chip devices (more than two chips are assembled in the same tooling), the chip solder joints are easily treated as substrate through holes, resulting in excessive grinding and failure of unsealing

[0008] 3. The existing method relies heavily on the experience of the operator, and the problem of insufficient or excessive grinding is prone to occur when grinding the sample, resulting in the failure of unsealing

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