The invention discloses a multi-mode ultrasonic scanning and high-power microscopic examination fused plastic
package device
chip bonding layer layering judgment method, relates to the technical field of plastic
package device defect detection, and aims at a plastic
package device composed of a plastic package material, a
chip, a bonding layer, a back exposed substrate and a
lead frame. Firstly, the layering possibility below a
chip is preliminarily judged through front C scanning, and T scanning is synchronously used for proving abnormity; the layering condition is verified from the
depth dimension through back C scanning and B scanning, and each ultrasonic scanning mode is clear in parameter setting so as to guarantee the detection consistency; and finally, preparing a sample for the layered device, and visually confirming defects through microscopic examination of a 10000-times high-power
microscope. According to the method, multi-mode ultrasonic scanning and high-power microscopic examination are fused, theoretical analysis and actual
verification are combined, detection is comprehensive, judgment is accurate, and the method is not only suitable for chip bonding layer layering, but also can be used for defect judgment of plastic package material cavities, layering of substrates and plastic package materials and the like, and is wide in applicability.