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165results about How to "Mechanical stability" patented technology
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Suture anchor and suture anchor installation tool
A sterile suture anchor comprising a body with a distal end, tapered planar side walls and a dome shaped proximal end, a cross section of said body forming a triangular shape with at least one rounded end; and a suture aperture transversely cut through the body being dimensioned to hold at least one suture. An insertion tool for inserting the suture anchor through a substantially cylindrical bore hole in a live human bone and causing the suture anchor to be anchored comprises a handle, a hollow tube secured to the handle and a driver rod slidably mounted in the tube. The driver rod has a distal end defining an angled cam which engages a suture anchor mounted in said tube and rotates the suture anchor into a desired position for insertion into human tissue. A finger driver assembly is mounted on the handle and is secured to the driver and so that movement of the finger driver assembly causes the driver rod to be moved within the hollow tube causing the driver rod cam end to engage the suture anchor and turn the suture anchor in a predetermined orientation for anchoring in the bore hole.
Owner:MUSCULOSKELETAL TRANSPLANT FOUND INC
Method for Fabricating Array-Molded Package-On-Package
InactiveUS20080284045A1Low-cost and simplifyImprove testability and thus yieldLiquid surface applicatorsSemiconductor/solid-state device detailsContact padEngineering
A method and apparatus for fabricating a semiconductor device are disclosed. The method attaches semiconductor chips (130) on a sheet-like insulating substrate (101) integral with two or more patterned layers of conductive lines and vias and with contact pads (103) in pad locations. A mold is provided, which has a top portion (210) with metal protrusions (202) at locations matching the pad locations. The protrusions are shaped as truncated cones of a height suitable to approach the pad metal surface in the closed mold cavity. The substrate and the chip are loaded onto the bottom mold portion (310); the mold is closed by clamping the top portion onto the bottom portion so that the protrusions are aligned with the contact pads, approaching the pad surface. After pressuring encapsulation compound into the cavity, the mold is opened; the encapsulated device has apertures to the pad locations. Any residual compound formed on the pads is removed by laser, plasma, or chemical to expose the metal surface.
Owner:TEXAS INSTR INC
Use of roll compacted pyrogenically produced silicon dioxide in pharmaceutical compositions
Owner:EVONIK DEGUSSA GMBH
3-Dimensional NOR Memory Array Architecture and Methods for Fabrication Thereof
ActiveUS20180366489A1Low costFacilitates etching stepSemiconductor/solid-state device detailsSolid-state devicesElectrical resistance and conductanceResist
A method addresses low cost, low resistance metal interconnects and mechanical stability in a high aspect ratio structure. According to the various implementations disclosed herein, a replacement metal process, which defers the need for a metal etching step in the fabrication process until after all patterned photoresist is no longer present. Under this process, the conductive sublayers may be both thick and numerous. The present invention also provides for a strut structure which facilitates etching steps on high aspect ratio structures, which enhances mechanical stability in a high aspect ratio memory stack
Owner:SUNRISE MEMORY CORP
Method of laser welding a flexible circuit board with a metal contact
InactiveUS6919529B2Easy to carryLow costPrinted circuit assemblingLine/current collector detailsElectrical conductorFlexible circuits
A method for producing an electrical circuit between a flexible circuit board (1) is described, with single-sided access and a metallic contact partner (8), such that the contact partner (8) reaches the metallic conductor strip (4) of the circuit board (1) through an access opening (6) in the unit. The circuit board (1) is thus irradiated with laser light (9) in a region opposite the access opening (6) causing a welded connection between the contact partner (8) and the conductor strip (4) to be formed.
Owner:CONTINENTAL AUTOMOTIVE GMBH
Surge suppressor with increased surge current capability
InactiveUS20060146458A1Improve abilitiesImprove passive intermodulation performanceEmergency protective arrangement detailsAntennas earthing switches associationCapacitanceElectrical conductor
A surge suppressor configured to receive signals from a coaxial line having a signal carrying inner conductor and a grounded outer conductor. The surge suppressor includes an inner conductor exhibiting capacitance and configured to connect to the coaxial line inner conductor, an outer conductor configured to connect to the coaxial line outer conductor and to ground, and an inductor formed of a wire encapsulated in an encapsulating material electrically coupling the inner conductor and the outer conductor. RF signals in the surge suppressor's operating bandwidth pass through the surge suppressor relatively unimpeded while electrical surges will be diverted through the inductor to the outer conductor, and therefore to ground, and possible residual pulses will be blocked from passing through the surge suppressor by the capacitance.
Owner:HUBERSUHNER AG
Local ESD protection for low-capacitance applications
ActiveUS20060050453A1Easy to manufactureImprove electrical performanceSolid-state devicesDiodeCapacitanceEngineering
A semiconductor device for locally protecting an integrated circuit input / output (I / O) pad (301) against ESD events, when the I / O pad is located between a power pad (303) and a ground potential pad (305a). A first diode (311) and a second diode (312) are connected in series, the anode (311b) of the series connected to the I / O pad and the cathode (312a) connected to the power pad. A third diode (304) has its anode (304b) tied to the ground pad and its cathode (304a) tied to the I / O pad. A string (320) of at least one diode has its anode (321b) connected to the series between the first and second diode (node 313), isolated from the I / O pad, and its cathode (323a) connected to the ground pad. The string (320) may comprise three or more diodes.
Owner:TEXAS INSTR INC
Method for fabricating electro-optic light modulator
InactiveUS20050077005A1Improve mechanical stabilityImprove surface flatnessLayered product treatmentHollow inflatable ballsPolyesterAdhesive
In an electro-optic light modulator requiring an electro-optical sensor material such as polymer dispersed liquid crystal, or PDLC is directly coated on an optical glass substrate with a transparent electrode, such as indium tin oxide (ITO) and an optional layer of passivation coating such as silicon dioxide (SiO2) on its surface. A thin layer of polymeric adhesive is coated on top of PDLC layer and then this two-layer coating is laminated with a dielectric mirror on a polyester film (Mylar™) preferably with the assistance of a vacuum.
Owner:PHOTON DYNAMICS
Flow chamber
ActiveUS20050019231A1Simple and inexpensive manufacturing modeMechanical stabilitySamplingMaterial analysis by optical meansRoundingPlastic materials
A flow chamber (1) made of plastics as an object carrier for light-microscopic examinations comprised at least one channel (4) in a base plate (2), said channel having a width of 0.01 to 20 mm and a height of 0.01 to 5 mm. One liquid reservoir (3, 3′) each is connected to the inlet and outlet opening (6, 6′) of the channel, whereby a communicating system is generated. The bottom and / or the cover of this chamber is made of a high-class plastic material and may be functionalized. The inlet and outlet portions of the channel may be formed by a rounding (7) of the channel edges or by a surface treatment in a manner that drop formation is prevented and the flow is therefore not obstructed. In a method of sample preparation for light-optical microscopic examinations, a sample flow is generated by a system of communicating pipes, in that a reservoir of a solution with the sample is connected via a third channel with at least one further reservoir and the filling level of the reservoirs differs at the beginning of the examination.
Owner:IBIDI
Optical Sensor Unit for Evanescence Wave Spectroscopy
ActiveUS20110090484A1Improve transmittanceFavorable analysisRadiation pyrometryCladded optical fibreAnalyteSpectroscopy
Optical sensor unit for infra red evanescence wave spectroscopy (IR-EWS) analysis of chemical and biological substances in an analyte, comprising a waveguide with a sensor surface to be put into contact with the analyte, wherein the sensor surface is provided with an affinity enhancing layer. There is further provided a method of producing an optical sensor unit.
Owner:ADAMANTIS AB
Electronic device having floating panel
InactiveUS20130342484A1Haptic feedback can be maximizedMechanical stabilityInput/output for user-computer interactionDigital data processing detailsEngineeringDisplay device
Disclosed is an electronic device having a floating panel. The electronic device includes a display bracket; a panel provided on the front side of the display bracket and configured to sense a touch input and to provide visual information; an actuator provided on the panel, and configured to provide a haptic signal corresponding to the touch input; an elastic member provided between the panel and the display bracket, and configured to elastically support the panel to float in a state in which the panel is spaced from the display bracket; and a stopper configured to fix the panel, which is lifted and supported by the elastic member, to the display bracket in a floating state.
Owner:SAMSUNG ELECTRONICS CO LTD
Medical composite material and preparing method thereof
The invention discloses a medical composite material and a preparing method thereof. The medical composite material comprises a base material and a degradable fiber material, wherein the base material is a cross-linking-type degradable polymer material which is of a three-dimensional network structure. The medical composite material has the mechanical strength higher than that of a linear high polymer material, and is easy to store, fracture can be avoided, and the requirements of high-strength medical devices can be met. In addition, the cross-linking-type polymer base material has the relative-low molecular weight and the simple and easy synthesis and preparing method and processing technology, and the technical problem that high-molecular-weight linear polymer is difficult in preparing and processing is solved.
Owner:上海发微医用材料有限公司
Advanced solid acid electrolyte composites
InactiveUS20070128491A1Increase heightImprove mechanical propertiesSolid electrolytesIon-exchanger regenerationFuel cellsHydrogen atom
Solid acid / surface-hydrogen-containing secondary component electrolyte composites, methods of synthesizing such materials, electrochemical device incorporating such materials, and uses of such materials in fuel cells, membrane reactors and hydrogen separations are provided. The stable electrolyte composite material comprises a solid acid component capable of undergoing rotational disorder of oxyanion groups and capable of extended operation at a wide temperature range and a secondary compound with surface hydrogen atoms, which when intimately mixed, results in a composite material with improved conductivity, mechanical and thermal properties, when compared to pure solid acid compound.
Owner:CALIFORNIA INST OF TECH
Biodegradable scaffolds
InactiveUS20130184835A1Optimal mechanical characteristicEnhance healing processBiocidePowder deliveryActive agentBiodegradable scaffold
In some embodiments, the present invention provides compositions that comprise: (1) a biodegradable polymer matrix; and (2) at least one biodegradable reinforcing particle that is dispersed in the matrix. In some embodiments, the biodegradable reinforcing particle is selected from the group consisting of porous oxide particles and porous semiconductor particles. In additional embodiments, the compositions of the present invention further comprise a (3) porogen particle that is also dispersed in the matrix. In further embodiments, the compositions of the present invention are also associated with one or more active agents. In various embodiments, the active agents are associated with the biodegradable polymer matrix, the biodegradable reinforcing particle, and / or the porogen particle. In various embodiments, the compositions of the present invention may be utilized as scaffolds, such as scaffolds for treating bone defects. Further embodiments of the present invention pertain to methods of making the compositions of the present invention.
Owner:BOARD OF RGT THE UNIV OF TEXAS SYST
Method of producing effervescent tablets and effervescent tablet
InactiveUS6066335AShort dissolution timeEasy to producePharmaceutical delivery mechanismWood working apparatusEffervescent tabletBleach
A method of producing mechanically stable effervescent tablets with a high dissolving velocity and an according effervescent tablet are described. The effervescent tablets consist of at least one active substance or of a combination of active substances, of at least one binder, of possibly carriers as sweeteners, flavors, colorings, scents, softeners, bleaches, and of sherbets. In producing, propylglycol or glycerin is used as a binder for the effervescent tablets, and the active substances or the combination of active substances and possibly carriers are mixed with the binder. Afterwards, the sherbets are added to this mixture in an air-conditioned room. Then, the mixture including the sherbets is formed into tablets.
Owner:DIPL CHEM HORST MACHOCZEK +1
Whole-Body Coil Arrangement for an Open Magnetic Resonance Scanner for Use With a Second Diagnostic and/or Therapeutic Modality
ActiveUS20110043207A1Suitability manufactureMechanical stabilityTomographyElectric/magnetic detectionElectrical conductorWhole body
A whole-body coil arrangement for an open magnetic resonance scanner for use with a second diagnostic and / or therapeutic modality is proposed. The whole-body coil arrangement includes at least one coil conductor and a radio-frequency shield. The whole-body coil arrangement is embodied at least in part as essentially transparent to the second modality.
Owner:SIEMENS HEALTHCARE GMBH
Light-emitting unit and method of producing the same
InactiveUS20070115687A1Flexibility in designMechanical stabilityCoupling light guidesReflectorsSolid-stateLight guide
A light-emitting unit comprising a solid state light source mounted on a leadframe and a lightguide into which the solid state light source is to in-couple light into its light guiding direction. The solid state light source and at least a part of the leadframe are molded with a molded material, wherein the molding material forms at least a part of the lightguide.
Owner:TPO HONG KONG HLDG
Local ESD Protection for Low-Capicitance Applications
ActiveUS20070284666A1Improve electrical performanceImprove reliabilitySemiconductor/solid-state device detailsSolid-state devicesCapacitanceSemiconductor
Owner:TEXAS INSTR INC
Mouldable biodegradable polymer
ActiveUS8569402B2Improve hydrophobicityImprove water resistanceFireproof paintsSynthetic resin layered productsMolten statePolyethylene oxide
A biodegradable injection moldable polymer having the composition a) from 50 to 85% by weight of a starch and or a modified high amylose starch b) from 4 to 13% by weight of a water soluble polymer selected from polyvinylacetate, polyvinyl alcohol and copolymers of ethylene and vinylalcohol which have a melting point compatible with the molten state of the starch components c) from 10 to 35% by weight of a polyol plasticizer d) from 0.5 to 10% of a polyethylene oxide or polyethylene glycol e) from 0 to 1.5% by weight of a C12-22 fatty acid or salt and f) from 0.25% to 3% of a food grade emulsifier. The polymers are suitable for biodegradable, flushable tampon applicators and other medical or industrial products where flushability and bio degradability are desirable.
Owner:PLANTIC TECH
Novel composite membrane
InactiveUS20020053544A1Good choiceMechanical stabilitySemi-permeable membranesWater/sewage treatment bu osmosis/dialysisWater insolubleAlginic acid
A composite membrane is provided having a first layer and a second layer, the first layer comprising an alginic acid or a salt of alginic acid, or a salt of a derivative of an alginic acid, and the second layer comprising a non-porous polymer with at least one hydrophilic functional group and adapted to provide mechanical support and reinforcement of the first layer. The second layer is selectively water permeable and can comprise water insoluble polymers such as chitosan, chitosan derivatives and cellulose derivatives. The second layer can also comprise water soluble polymers so long as such polymers are adequately crosslinked. Where the second layer comprises chitosan, each of the alginic acid or the salt of an alginic acid or the salt of a derivative of an alginic acid of the first layer and the chitosan of the second layer can be crosslinked separately by immersing in a formaldehyde solution. The thickness of the first layer is from about 0.5 microns to about 20 microns. The thickness of the second layer is from about 1.0 microns to about 40 microns. The ratio of the thickness of the first layer to the second layer is from about 1:1 to 1:5.
Owner:UNIVERSITY OF WATERLOO
Vented rotor
InactiveUS7934586B1Increase airflowMechanical stabilityBraking drumsBraking discsEngineeringMechanical engineering
A disc brake rotor having a central hat portion for coupling a rotor to a vehicle wheel for rotation about a central axis, an inboard brakeplate for receiving a first friction surface and an outboard brakeplate for receiving a second friction surface. A plurality of L-shaped rib members extends from the hat for coupling the inboard brakeplate to the hat and a second plurality of L-shaped members radially extend from the hat for coupling the outboard brakeplate to the hat. First plurality of ribs is longer than the second plurality of ribs. The second set L-shaped members is located intermediate of the edges of the inboard and outboard pluralities to enhance the heat transfer of the braking operation.
Owner:ROBERT BOSCH CORP +1
Package, subassembly and methods of manufacturing thereof
InactiveCN101213661AReduce thicknessLower assembly costsSemiconductor/solid-state device detailsSolid-state devicesSemiconductorElectrical interconnect
The assembly (100) of the invention includes at least one semiconductor device (30) provided with bonding pads (32), a package (40), an interconnect element (20) and a heat sink (90). Such an element consists of a system of electrical interconnections (12) and is at least substantially covered on a first side (1) by a thermally conductive electrically insulating layer (11) and is provided on a second side (2) with electrical isolation (13) such that The isolation (13) and thermally conductive layer (11) electrically isolate the electrical interconnections (12) from each other. At least one device in the package (40) and heat sink (90) has a contact surface with the interconnect element (20) substantially over the entire side (1, 2) to which the device (40, 90) is attached Extend above.
Owner:KONINKLIJKE PHILIPS ELECTRONICS NV
Surge suppressor with increased surge current capability
InactiveUS7170728B2Improve abilitiesImprove passive intermodulation performanceEmergency protective arrangement detailsAntennas earthing switches associationCapacitanceElectrical conductor
A surge suppressor configured to receive signals from a coaxial line having a signal carrying inner conductor and a grounded outer conductor. The surge suppressor includes an inner conductor exhibiting capacitance and configured to connect to the coaxial line inner conductor, an outer conductor configured to connect to the coaxial line outer conductor and to ground, and an inductor formed of a wire encapsulated in an encapsulating material electrically coupling the inner conductor and the outer conductor. RF signals in the surge suppressor's operating bandwidth pass through the surge suppressor relatively unimpeded while electrical surges will be diverted through the inductor to the outer conductor, and therefore to ground, and possible residual pulses will be blocked from passing through the surge suppressor by the capacitance.
Owner:HUBERSUHNER AG
Integration of microstrip antenna with CMOS transceiver
ActiveUS20110260943A1Low costLow interconnectionSimultaneous aerial operationsRadiating elements structural formsMicrostrip patch antennaCMOS
A monolithic antenna element comprises a microstrip patch antenna and a ground plane, with a substrate between the patch antenna and the ground plane. A feeding via extends from the ground plane layer through the substrate to the patch antenna, connecting to the antenna distal from lateral edges of the antenna. A coplanar waveguide (CPW) feed line is formed in the ground plane layer, and interrupts and is electrically distinct from the ground plane. The CPW extends from a lateral edge of the ground layer to the feeding via. The antenna can be flip chip bonded to a CMOS die, reducing cost of millimetre wave transceivers, e.g. 57-64 GHz. The antenna is fabricated using standard PCB technology and a single substrate for the antenna. Antenna arrays can be fabricated. Appropriately designed antenna feeds, flip chip interconnects and antenna shape provide suitably broad antenna bandwidth, with relatively high efficiency.
Owner:ADVANCED MICRO DEVICES INC +1
Liquid filter
ActiveCN102781542AEasy to navigateSimple technologyMembrane filtersFiltration separationFilter materialMechanical engineering
Owner:HENGST WALTER
3-dimensional NOR memory array architecture and methods for fabrication thereof
ActiveUS10608011B2Facilitates etching stepImprove mechanical stabilitySemiconductor/solid-state device detailsSolid-state devicesMetal interconnectMechanical stability
A method addresses low cost, low resistance metal interconnects and mechanical stability in a high aspect ratio structure. According to the various implementations disclosed herein, a replacement metal process, which defers the need for a metal etching step in the fabrication process until after all patterned photoresist is no longer present. Under this process, the conductive sublayers may be both thick and numerous. The present invention also provides for a strut structure which facilitates etching steps on high aspect ratio structures, which enhances mechanical stability in a high aspect ratio memory stack.
Owner:SUNRISE MEMORY CORP
Car charging plug-in connector
ActiveUS20180269619A1Easy to handleGuaranteed cost-effective operationVehicle connectorsCharging stationsEngineeringContact element
The disclosure relates to a car charging plug-in connector for an electric vehicle, comprising at least one signal contact element and at least two power contact elements. The car charging plug-in connector has a plug-in connector body and a contact carrier. The contact carrier is arranged on the plug-in side of the plug-in connector body and is fastened to the plug-in connector body in a reversible manner. Therefore, the contact carrier can be easily replaced as required, as a result of which the car charging plug-in connector can be used in a particularly cost-effective manner.
Owner:HARTING AUTOMOTIVE
Achromatic polarization devices for optical disc pickup heads
ActiveUS20060146682A1Improve optical qualityIncreased durabilityOptical beam sourcesRecord information storageManufacturing technologyLasing wavelength
Chemically-bonded laminated polymer achromatic polarization devices, such as circular polarizers, are disclosed for use in optical disc (e.g., CD / DVD) pickup heads. Chemically-bonded laminated polymer achromatic polarization devices have the benefit of providing stable retardation and optic axis over an extended wavelength range, thereby ensuring orthogonal polarization in double-pass for two or more laser wavelengths. Moreover, the chemically-bonded laminated polymer achromatic polarization devices can be symmetric in construction, such that there is no specific input and output side. This alleviates the need to produce geometries that prohibit inversion of the part when installed in the system. Manufacturing processes that produce chemically-bonded laminated polymer achromatic polarization devices, with high light efficiency, durability and robust performance in a variety of environmental conditions are disclosed.
Owner:REAID INC
Electrical connector for flat cable
InactiveUS6935888B2Easy to assembleMechanical stabilityEngagement/disengagement of coupling partsCoupling contact membersEngineeringElectrical connector
An FPC connector (10, 10′) comprises a housing (20, 20′) and a pressing member (30, 30′) mounted on the housing rotatable from an open position to a closed position. The housing defines a pair of posts (28a, 28a′) each having a protruding hook (208, 280′) and a pair of notches (24a) each having first and second slanted surfaces (244, 242). A resilient portion (24b) is defined at one side of each notch. The pressing member has a pressing body (32, 32′) having shafts (36a) and L-shaped resilient arms (34a, 34a′). The isolated portions and the first and second slanted facilitate the insertion of the shafts into the notches. The L-shaped resilient arms (34a, 34a′) are provided to engage the protruding hooks of the posts to lock the pressing member at the closed position.
Owner:HON HAI PRECISION IND CO LTD
Method for Fabricating Array-Molded Package-on-Package
InactiveUS20110165731A1Shorten the time to marketLow-cost and simplifiedSemiconductor/solid-state device detailsSolid-state devicesContact padSemiconductor chip
Owner:TEXAS INSTR INC
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