225results about How to "Improve testability" patented technology

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and / or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.

A testing device for a semiconductor storage device suppresses the increase in the circuit size, provides for facilitated accommodation to a test with frequent changes in the test pattern, and improves testability of the semiconductor storage device. A plurality of holding circuits are provided holding write data for memory cells of a memory cell array. (Original) The write data from the holding circuits are written in the memory cells of the selected address. A plurality of comparators are supplied with data read out from the memory cells and with data held by the holding circuits as expectation data to compare the readout data and the expectation data. The non-inverted or inverted value of the write data held by the holding circuits is output as the write data to the memory cells and as expectation data to the comparators depending on the value of the inversion control signal.

An improved semiconductor device package is manufactured by attaching semiconductor chips (130) on an insulating substrate (101) having contact pads (103). A mold is provided, which has a top portion (210) with metal protrusions (202) at locations matching the pad locations. The protrusions are shaped as truncated cones. The substrate and the chips are loaded onto the bottom mold portion (310); the mold is closed by clamping the top portion onto the bottom portion so that the protrusions approach the contact pads. Encapsulation compound is introduced into the cavity and the protrusions create apertures through the encapsulation compound towards the pad locations.