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225results about How to "Improve testability" patented technology

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and / or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.
Owner:CAPITALSOURCE FINANCE

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and / or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.
Owner:CAPITALSOURCE FINANCE

Apparatus and method for frequency expansion of reference clock signal

The invention provides a device for spreading spectrum of a reference clock signal and a method thereof, wherein, the device comprises a divider which is used for receiving an M value and an N value, generating a first floating point decimal according to the M value and the N value, and sending the first floating point decimal to a spread spectrum control generator; the spread spectrum control generator which is used for receiving the first floating point decimal from the divider and the reference clock signal from an analog circuit, generating a second floating point decimal for spreading the spectrum according to the first floating point decimal, the reference clock signal and modulation frequency, and sending the second floating point decimal to a delta sigma modulator; the delta sigma modulator which is used for generating a first integer distribution according to the second floating point decimal and sending the first integer distribution to the analog circuit; and the analog circuit which is used for sending the external reference clock signal to the spread spectrum control generator, generating a first frequency division clock signal according to the first integer distribution, and comparing and adjusting phases of the first frequency division clock signal, and spreading the spectrum of the reference clock signal.
Owner:ANALOGIX CHINA SEMICON

Method and system for estimating circuit board corrosion risk

The present invention relates to the testing technology field of electronic equipments, especially to a method and system used for assessing circuit boards corrosion risks. According to the method, the surface insulation resistance values of circuit boards are measured and are compared with the corrosion risks discrimination mapping of the circuit boards to get the corrosion risk levels of circuit boards. The present invention also provides a system used for quickly on-site assessing the circuit boards corrosion risks, which comprises a circuit board, a testing module and a discrimination module, wherein the testing module is used for measuring the surface insulation resistance value of the circuit board and sending the measured value to the discrimination module, the discrimination module is used for comparing the surface insulation resistance value measured with the corrosion risks discrimination mapping to get the corrosion risk level of the circuit board. By using surface insulation resistance values easily got on-site to indicate the circuit boards corrosion risks, the present invention is capable of quickly on-site assessing the corrosion risk of a circuit of a board, and then exhibits excellent effect about adopting some protection measures of the circuit board in time.
Owner:HUAWEI TECH CO LTD
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