A highly reliable electronic device and a method for manufacturing the same are provided, the electronic device preventing entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generating no soldering defects nor solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode.
The structure is formed of Cu-baked electrode layers 6a and 6b primarily composed of Cu, Cu plating layers 7a and 7b which are formed on the Cu-baked electrode layers 6a and 6b and which are processed by a recrystallization treatment, and upper-side plating layers 9a and 9b formed on the Cu plating layers 7a and 7b.
After the Cu plating layers 7a and 7b are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers 7a and 7b are recrystallized to a temperature at which glass contained in a conductive paste is not softened (both inclusive), so that the Cu plating layers 7a and 7b are recrystallized.