The invention provides a non-contact
air suspension ultrathin
wafer turning device, which comprises a
machine body, two clamping jaws, an
edge detector, a displacement sensor and a
control system, and is characterized in that the two clamping jaws can move relative to the
machine body, each clamping jaw is provided with a crack for placing a
wafer, and the
edge detector is arranged in the crack; a plurality of air holes for spraying air towards the
wafer are formed in the crack, so that an air film is formed on the outer side of the wafer to enable the wafer to suspend in the crack, the
edge detector is arranged in the crack and used for monitoring the real-time position of the edge of the wafer, the displacement sensor is used for detecting the position state of the wafer, and the
control system controls the clamping jaw to rotate when the clamping jaw turns over. And calculating execution air pressure based on data of the edge
detector and the displacement sensor so as to adjust air
film pressure distribution, so that the wafer is kept at a preset position. According to the non-contact
air suspension ultrathin wafer turning device provided by the embodiment of the invention, in the wafer turning process, the
pollution risk and physical damage of the wafer can be reduced.