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192 results about "Optical routing" patented technology

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and / or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.
Owner:CAPITALSOURCE FINANCE

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and/or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.
Owner:CAPITALSOURCE FINANCE

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and / or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.
Owner:CAPITALSOURCE FINANCE

Data center network system and data communication method based on software definition

The invention provides a data center network system and data communication method based on software definition and relates to the technical field of cloud calculating data centers. The data center network system structurally comprises a core electric switch, an optical router, a top-of-rack switch, servers, a control module, an optical carrier wave distribution unit and a multi-wavelength light source subsystem. In data communication, communication optical carrier waves are allocated according to the address of the destination server of data and the traffic of the data; the data are sent to the top-of-rack switch after being packaged by the source server; the control module determines and selects an electric switching path or an optical routing path to forward the data according to the address of the destination server and the traffic characteristics of the data information and the corresponding routing algorithm. The top-of-rack switch performs light modulation on the data according to instructions of the control module and forwards the data to the corresponding electric switching or optical routing path. The data center network system and data communication method based on software definition have very good energy saving effect, are low in construction cost and improve the management efficiency of a data center network and the performance of the network.
Owner:CHONGQING UNIV

Centralized monitoring method for optical cable resource

ActiveCN102412895APerfect monitoring methodScientific monitoring methodTransmission monitoring/testing/fault-measurement systemsFailure rateComputer module
The invention discloses a centralized monitoring method for the optical cable resource. The method comprises the following steps of: 1, establishing an optical cable section; 2, establishing optical routing; 3, forming optical cable network topology; 4, setting a monitoring module for a network; 5, selecting a monitoring mode, skipping to a step 5.1 in a roll-call monitoring mode, skipping to a step 5.2 in an automatic periodic monitoring mode, and skipping to a step 5.3 in a barrier alarm monitoring mode; 5.1, performing roll-call monitoring at the optical cable section; 5.2, automatically and periodically monitoring the optical cable section; 5.3, performing barrier alarm monitoring at the optical cable section; 6, monitoring central analysis testing data, judging whether a fault occurs, skipping to a step 7 if the fault occurs, and skipping to the step 5 if no fault occurs; 7, assigning a person to maintain the failed optical cable section; and 8, monitoring the maintained optical cable section by using the monitoring module, and skipping to the step 5. In the method, online monitoring, analysis and real-time fault alarm are performed on a communication optical cable and communication equipment, so that the line communication and maintenance efficiencies are increased, the line failure rate is lowered, and the fault time is shortened.
Owner:SHANGHAI MUNICIPAL ELECTRIC POWER CO +1
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