The invention belongs to the field of
electronic information material science, and particularly relates to a preparation method of high-density and low-temperature curing conductive
silver paste. The conductive
silver paste is obtained by compounding three kinds of spherical silver
powder with different sizes according to a silver
powder proportion calculated in a sphere close packing mode, compounding the silver
powder with an organic carrier, a
solvent and an auxiliary agent, and curing at 120-140 DEG C. According to the invention, a spherical silver powder stacking model based on three fixed spherical silver powder sizes and highest density is constructed for compounding to improve the compactness and the
conductivity, an
organic solvent with a
boiling point of 120-140 DEG C is preferably selected as a
solvent phase to reduce the curing temperature, the preparation process is optimized, the nano silver powder added firstly is used as an anti-
settling agent, and the nano silver powder added firstly is used as an anti-
settling agent; the stability of the
system is improved; aiming at the problems of low resin content and poor bending resistance of high-density
silver paste,
cardanol-based
epoxy resin with a tough
side chain is selected as an additive, a novel silver paste material with high bending resistance,
high density and low-temperature curing is successfully prepared, and the comprehensive performance of the novel silver paste material is far better than that of traditional silver paste of the same type.