According to the
tin dispensing device and method, a positioning module, a heating module and a
temperature control module are integrated on the same device body, the periphery of a
solder paste pipe is coaxially sleeved with a heating module body, heating pipes and temperature collecting units are arranged in the heating module body in pairs, and the positioning module is matched with the
solder paste pipes of different models; according to the device, the temperature collecting unit is arranged to be attached to a heating
pipe heat source, after a
tin dispensing device power source is started, a temperature controller can obtain a temperature feedback
signal within 0.1 s and correct output power in real time,
tin paste temperature steady-state fluctuation is compressed to be within + / -0.1 DEG C, a closed-loop constant-temperature field attached to the
pipe wall is formed, and therefore the temperature of the tin dispensing device can be controlled. And the risk of point leakage caused by needle head blockage at low temperature or low
viscosity at high temperature is avoided, the tin points are ensured to be consistent in size, the problems that a traditional external sensor is lagged in adjustment, non-uniform in heating and free of
solder paste washing, no tin is discharged, and no tin is stained are solved, and the yield, the efficiency and the
automation level of the tin dispensing procedure in IGBT packaging are remarkably improved.