21 results about "Microscopic Inspection" patented technology

The invention relates to a strain gauge patch microscopic inspection device and method based on multi-modal fusion, the device comprises an imaging device, an illumination and optical assembly and an auxiliary module, and the imaging device comprises a visible light camera, a polarization camera and an infrared camera. According to the invention, high-precision measurement requirements and challenges of complex industrial scenes are fully considered, and the method has the characteristics of multi-modal fusion, high-precision identification and dynamic self-adaption; a visible light-polarized light-thermal imaging multi-mode cooperative detection technology based on deep learning is used as a core method, and position deviation, adhesive layer defects and a curing state of a strain gauge are used as core monitoring indexes, so that the comprehensiveness and reliability of detection are remarkably improved; cross-modal feature fusion is realized through a cross attention mechanism and LSTM time sequence modeling, adaptive polarization illumination and online feedback control are combined, the method can adapt to various materials, deployment is simple and convenient, real-time detection is supported, and a guarantee is provided for high-reliability measurement in the field of precision manufacturing.

The invention discloses multifunctional wafer detection equipment. The equipment comprises an edge detection module, a robot, two sets of macroscopic detection units arranged in parallel and a microcosmic detection assembly. The robot is arranged on the side of the edge detection module to transfer the wafer. Each macroscopic detection unit comprises a transfer mechanism, a wafer rotating and transferring mechanism, an external clamping mechanism, an internal clamping mechanism and a photographing module. Wherein the transfer mechanism is used for receiving wafers from the robot; the working range of the rotary wafer transfer mechanism covers the transfer mechanism, the external clamping mechanism, the internal clamping mechanism and the microscopic detection assembly, and is responsible for efficiently transferring wafers among the transfer mechanism, the external clamping mechanism, the internal clamping mechanism and the microscopic detection assembly; the external clamping mechanism and the internal clamping mechanism which are adjacently arranged can carry out wafer handover; and the photographing module is used for photographing the wafer fixed by the internal clamping mechanism. By optimizing layout and automatic circulation, efficient integration and continuous proceeding of wafer edge detection, macroscopic detection and microcosmic detection are achieved, and the detection efficiency and the automation level are remarkably improved.

Disclosed in the present invention are a conical optical illumination-based reflective scanning super-resolution optical microscopy system and method. The system comprises a sample displacement module, an optical microscopic imaging module, an annular focused beam generation module, a beam scanning module, a super-resolution focused illumination and collection module, a super-resolution optical imaging module and a computer. By means of using the advantages of annular focused beam illumination, high focusing efficiency of traditional lenses, and high beam scanning speed, high-efficiency super-resolution focused illumination with an extended depth of focus is achieved, and further traditional optical lenses can be used to achieve fast super-resolution optical microscopic imaging; fast label-free far-field super-resolution two-dimensional microscopic imaging is implemented by means of two-dimensional beam scanning; by means of performing label-free far-field super-resolution two-dimensional microscopic imaging on samples at different axial positions, super-resolution two-dimensional microscopic images of different cross sections of samples are obtained, thereby achieving three-dimensional tomography. The present invention can be applied to fast label-free super-resolution microscopic imaging of biological samples, and can also be applied to other fields such as industrial super-resolution microscopic inspection.

1. The name of this design product: Observation instrument. 2. Purpose of this design product: used for high-definition microscopic inspection and precision measurement of products. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.

This invention relates to a method for controlling the laser line length in microscopic visual inspection based on parametric calculation, belonging to the field of optical microscopic inspection technology, and includes: inputting the target laser line length L. lim The process involves: parameter calculation; adjusting the position or parameters of the cylindrical lens, convex lens, and objective lens to match the calculation results; optical path transmission: the light source emits a collimated laser, which passes sequentially through the cylindrical lens (focusing in the Y direction), the convex lens (adjusting the divergence angle in the X direction), and the objective lens (focusing on the sample surface); real-time detection: a CMOS sensor detects the actual generated laser line length and spot shape; error judgment: determining whether the actual line length meets the target line length error range (<2%): if yes, the final parameter combination and optical path configuration are output, and the process ends; if not, feedback is sent to the parameter calculation module for dynamic fine-tuning of parameters and readjustment of optical components. This invention can improve the accuracy of laser line length in scenarios such as semiconductor defect detection and biological microscopy imaging.

The present application provides a non-destructive analysis system and method for chip packaging conditions based on microscopic inspection, which relates to the field of intelligent analysis. It first obtains the original visible light image and original infrared image sequence and performs image preprocessing and spatial registration to ensure that information from different light sources and different depths can be spatially correlated. Then, the key visual features representing the surface state and internal structure of the chip are extracted, refined and enhanced to improve the discrimination ability and robustness. Finally, these processed and enhanced surface and internal features are organically integrated, and a trained intelligent classifier is used to automatically identify and judge the packaging status of the chip, giving a specific category (such as normal, void, crack, etc.) and its reliability, thereby achieving the evaluation of its packaging quality without destroying the chip.

The invention provides an automatic detection and classification device and method for tiny objects in a water sample, the detection and classification device comprises a microscopic observation assembly, an observation cartridge, an upper computer and a man-machine interaction unit, and the microscopic observation assembly comprises a rack, an objective lens switching unit and a camera; the rack is provided with a three-axis workbench used for placing an observation cartridge. The objective lens switching unit comprises an objective lens frame, a rotating tower, a first transmission mechanism and a first driving device; the objective lens frame is mounted on the rack; the rotating tower is rotationally mounted on the objective lens frame, and n objective lenses are uniformly distributed on the rotating tower in the circumferential direction; the first transmission mechanism is respectively connected with the rotating tower and the first driving device; the camera is mounted on the rack; the upper computer is in electric signal connection with the first driving device and the camera; and the man-machine interaction unit is connected with the upper computer. According to different types of tiny objects, the objective lenses with the corresponding multiples are switched, automatic microscopic examination of the tiny objects is achieved through the device, the observation efficiency is greatly improved, and the labor cost and the time cost are reduced.

1. Name of the product in this design: Spinneret microscopic inspection machine. 2. Purpose of this design: To inspect the micropores of the spinneret to determine whether they are blocked, whether their shape is normal, and whether there are defects such as impurities, carbonization, or damage. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

This invention provides a method for inspecting optical films, enabling high-precision and efficient inspection and determining the location information of defects in the thickness direction of the optical film. The invention includes a macroscopic inspection step using a first imaging mechanism and a microscopic inspection step using a second imaging mechanism. In the microscopic inspection step, based on the defect location information determined in the macroscopic inspection step, the position of the imaging field of the second imaging mechanism is controlled in a manner capable of capturing images of the defect. The focal position of the second imaging mechanism is moved to multiple locations in the thickness direction of the optical film, and images are captured at each location, thereby generating multiple captured images. An evaluation object region relative to the defect and its vicinity is determined in the composite image obtained by combining the multiple captured images. Based on the brightness values ​​within the same pixel region as the evaluation object region, a focused image is determined among the multiple captured images, and detailed information about the defect is obtained based on the focused image.

The invention discloses an insertion loss measurement method and system for a prefabricated optical cable high-density optical fiber connector, and relates to the technical field of optical cable loss prediction.The method comprises the steps that end face cleaning is conducted on a connector to be measured in the factory leaving stage, and a factory leaving baseline certificate is generated and stored; carrying out a wet accelerated aging test, and collecting corresponding wet insertion loss, OTDR, an end face image and a sensor time sequence as wet characteristics; calculating a theoretical coupling loss baseline by using a physical coupling model and taking optical fiber parameters as input; constructing an underwater optical cable insertion loss prediction model, and predicting a final connector loss value of a wet state additional loss residual error by taking the wet state characteristics and the image characteristics as input; establishing a life distribution model, and carrying a wetting judgment strategy to judge whether a wetting event occurs or not; and triggering the wet accelerated degradation sub-model. According to the method, the problem of multi-band deletion of samples in training data due to difficulty in frequent sampling or end face microscopic examination after seabed deployment is solved.

This application belongs to the field of smart water technology and relates to a pipeline leak detection method. The method includes: dividing the water supply network into zones to obtain target monitoring areas; deploying capsule robots to the target monitoring areas for dynamic inspection to obtain target survey data; the capsule robots are equipped with at least a pressure sensor, an ultrasonic flow sensor, and a camera; performing multi-source data fusion processing based on the target survey data and the target monitoring areas to obtain the target pipeline leak location; using the capsule robots to accurately locate the target pipeline leak location to obtain pipeline leak coordinates; performing leak detection based on the pipeline leak coordinates to obtain leak information; and uploading the leak information to a maintenance platform for leak alarm. This application combines macroscopic monitoring of DMA zones with microscopic inspection by capsule robots to achieve sub-meter-level positioning of leak points, reducing the false alarm rate of leak detection and improving inspection efficiency.

The invention discloses a TGV glass substrate through hole quality detection method, which comprises the following steps: by means of quick photographing of a 2.5 D imager and image J auxiliary image analysis, acquiring corresponding first magnification factor area images of each area divided on a TGV glass substrate according to a first magnification factor, and splicing the first magnification factor area images into a TGV glass substrate whole image; the method comprises the following steps: acquiring a TGV glass substrate image, simultaneously acquiring corresponding second magnification factor area images for each area with a second magnification factor, and performing through hole quality difference analysis on the TGV glass substrate image and each second magnification factor area image, thereby realizing rapid positioning and extraction of defective areas with unqualified through holes. Therefore, a more precise instrument can be adopted to carry out secondary reinspection on a problem area subsequently, the technical problems that the traditional microscopic detection and roundness instrument detection are low in testing speed and the quality detection of the whole through hole of the TGV glass substrate cannot be realized at the same time are solved, the TGV process development is helped to rapidly position a problem point, and the process development efficiency is improved.

The invention relates to a device for microscopically illuminating a sample with a laser for emitting illuminating light, comprising an illuminating beam path with a microscope objective for directing the illuminating light into a sample plane on or in the sample, wherein the illuminating beam path has at least one spatial light modulator for manipulating the illuminating light, and comprising a control unit for controlling at least the spatial light modulator. According to the invention, the device is characterized in that the illuminating beam path has a phase device for at least partially canceling a spatial coherence of the illuminating light. The invention also relates to a method for microscopically illuminating a sample, a microscope, and a method for microscopy.

The utility model discloses a microscopic contour detection terminal and system, and relates to the technical field of precision detection. The microscopic contour detection terminal comprises a shell and a bottom plate connected with the shell, a mounting cavity is formed between the shell and the bottom plate, a 3D area-array camera, an optical microscope, a microscopic camera and a power supply are arranged in the mounting cavity, and the power supply is connected with the 3D area-array camera and the microscopic camera through power lines; a lens of the 3D area-array camera faces the bottom plate, a lens hole corresponding to the lens is formed in the bottom plate, a lens of the microscopic camera is connected with an eyepiece of the optical microscope, an objective lens of the optical microscope faces the bottom plate, and a light through hole corresponding to the objective lens is formed in the bottom plate. The advantages of a 3D area-array camera, an optical microscope and a microscopic camera are combined, microscopic inspection can be performed on a sample on site and in a laboratory, the micron-level detection precision is achieved, the high-precision requirement is met, optical microscopic detection and three-dimensional size detection of the sample can be completed, and quantitative and qualitative analysis is achieved.

This invention provides an integrated wafer inspection device, including a worktable, a Y-axis moving module, a stage, a primary inspection camera, and a secondary inspection camera. The Y-axis moving module is positioned above the worktable, and the stage is located at the output end of the Y-axis moving module. The stage is used to load wafers and is equipped with a positioning mechanism that positions the wafer by pressing down on the edge ring of the wafer's top surface. The primary and secondary inspection cameras are positioned along the conveying direction of the Y-axis moving module. The primary inspection camera is used for initial wafer inspection and marking defect locations. The secondary inspection camera magnifies and re-inspects each defect location marked by the primary inspection camera, identifying the defect type and status. This invention integrates macroscopic and microscopic inspection, automatically detecting and identifying appearance defects with good inspection results and high efficiency.

1. Name of the product in this design: Light guide device. 2. Purpose of this design: This design is used to provide illumination for the area being examined during microscopic inspection. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design.

The utility model discloses a uniform lighting device for industrial microscopic detection, which comprises three LED (light-emitting diode) light sources with the size of a light-emitting surface being 1.14 mm * 1.14 mm; the light distribution lens is composed of an annular cylinder and a polygonal cylinder. Three rectangular pyramid-shaped recesses are formed in the bottom of the polygonal cylinder, and the bottom surfaces of the recesses are square; the top surface of the annular cylinder is provided with three aspheric recesses, and the sections of the aspheric recesses are circular; and the LED light source is fixed on the bottom surface of the rectangular pyramid-shaped recess. The lens is designed to be a quarter annular cylinder, compared with a traditional rectangular lens, the size is reduced, the lens is matched with an industrial microscopic detection system packaging space with the diameter smaller than or equal to 50 mm, the lens has the advantages of being large in field angle and high in uniformity on a target surface through the synergistic effect of a bottom rectangular pyramid concave part and a top aspheric concave part, and the optical performance is improved; through the positioning columns and the heat dissipation grooves, the installation offset error is reduced, and the assembly stability is high.

The invention relates to the technical field of manual slide reading, and discloses a pre-marking positioning glass slide for fluorescence in situ hybridization detection and a positioning method.The pre-marking positioning glass slide comprises a glass slide body, a first marking area is fixed to the upper surface of the glass slide body, and a second marking area is fixed to the upper surface of the glass slide body; a first marking area is fixed on the upper surface of the glass slide body, a second marking area is fixed on the upper surface of the glass slide body, a third marking area is fixed on the upper surface of the glass slide body, and the first marking area, the second marking area and the third marking area are used for achieving accurate positioning during later microscopy. S2, collecting a to-be-detected image through a microscopic system, and carrying out image preprocessing and feature extraction on the to-be-detected image; the three mark areas located at different positions are preset and fixed on the surface of the glass slide body, a stable and recognizable space reference system is constructed, the technical problem that images are difficult to automatically match and analyze in the later period is solved, and the glass slide is particularly suitable for AI auxiliary recognition scenes.

This invention relates to the field of powder metallurgy technology, and in particular to a method for purifying the cladding of powder metallurgy alloys. The process flow of this invention is as follows: high-pressure pre-cleaning, pre-vibration to remove impurities, high-pressure pure water cleaning, microscopic inspection, negative pressure drying, and oven drying. This invention uses pre-cleaning and pre-vibration combined with high-pressure water cleaning to efficiently complete the cladding purification process. It also includes a quantitative inspection method to ensure the effectiveness of the cladding purification process. Furthermore, the use of high-pressure water replaces the use of hazardous chemicals such as alcohol, reducing safety hazard management risks. The combination of negative pressure drying and oven drying improves drying efficiency. This invention is highly efficient, provides excellent purification results, and is suitable for replacing hazardous chemical control in the treatment of powder metallurgy cladding, where high purity and processing speed requirements are specified.

This invention discloses a fully automated spinneret microscopic inspection system and method. The system includes an inspection device with a frame platform. An inspection area is set on the frame platform. A rotating mechanism and a surrounding robotic arm, a blow-suction device, and a line scan camera array are installed on one side of the inspection area. A material tray is placed in the inspection area. The rotating mechanism has several hollowed-out areas for placing spinnerets. After the rotating mechanism rotates at a constant speed, the hollowed-out areas serve as a loading station, a unloading station, a blow-suction cleaning station, and a photographic inspection station. The blow-suction device cleans the micropores of the spinneret. The line scan camera array acquires images of the spinneret and detects the state of each micropore based on machine vision and machine learning methods. The robotic arm picks up the spinneret to be inspected and places it at the loading station, and removes the inspected spinneret from the unloading station and returns it to its original position on the material tray. This invention effectively improves the automation level of spinneret inspection, reduces human intervention, increases inspection efficiency, and reduces inspection costs.

The utility model relates to the field of wafer processing equipment, in particular to wafer detection equipment, which comprises a detection unit, an overturning unit, a second moving unit and a third moving unit, a second suction piece is arranged at the output end of the second moving unit, and a third suction piece is arranged at the output end of the third moving unit. The outer diameter of the third suction part is smaller than the inner diameter of the second suction part, and the inner diameter of the third suction part is larger than the outer diameter of the first containing disc. The shapes, sizes and positions of a second suction part and a third suction part are designed and reasonably arranged, so that the movement tracks of the second suction part, the third suction part and a placement disc I have overlapped parts due to limited space in a wafer transfer process in a macroscopic detection link and between macroscopic detection and microscopic detection, and the movement tracks of the second suction part, the third suction part and the placement disc II are not overlapped due to limited space. And the wafers are not easy to interfere with each other and are prevented from being damaged.