The invention relates to establishment for a test device and a test method for the bending fracture performance of thin-film materials, in particular to an in situ evaluation system and a method of the mechanical reliability of a layer or a plurality of layers of thin-film materials with the micron to nanometer thickness on a flexible electronic substrate. The system comprises a high-precision micrometer caliper, a balance spring, a translational slide block, a freely supported beam fixed end, a freely supported beam movable end, and the like, wherein a composite beam comprising the micrometer caliper and a flexible substrate exerts precise and controllable step displacement to implement freely supported beam bending experiments; real-time exerted strain corresponding to a freely supported beam span is computed according to parameters and geometrical relationship of the freely supported beam span, sample sizes, and the like; and the bending fracture performance and critical cracking strain of the kind of thin film are tested and evaluated by combining in situ microscopic observation and subsequent scanning electron microscope characterization. The invention does not need to consider the electroconductibility of the thin-film materials, and is still adaptable for non-conductive thin-film materials. The experiment operation is simple and fast, in situ real-time positioning observation and analysis can be carried out on samples.