321 results about "Mechanical reliability" patented technology

In a stacked chip configuration, and manufacturing methods thereof, the gap between a lower and an upper chip is filled completely using a relatively simple process that eliminates voids between the lower and upper chips and the cracking and delamination problems associated with such voids. The present invention is applicable to both chip-level bonding and wafer-level bonding approaches. A photosensitive polymer layer is applied to a first chip, or wafer, prior to stacking the chips or stacking the wafers. The photosensitive polymer layer is partially cured, so that the photosensitive polymer layer is made to be structurally stable, while retaining its adhesive properties. The second chip, or wafer, is stacked, aligned, and bonded to the first chip, or wafer, and the photosensitive polymer layer is then cured to fully bond the first and second chips, or wafers. In this manner, adhesion between chips/wafers is greatly improved, while providing complete gap fill. In addition, mechanical reliability is improved, alleviating the problems associated with cracking and delamination, and leading to an improvement in device yield and device reliability.

In a conventional display device comprising a sub-display, the display device is increased in thickness and in the number of components as the number of displays is increased. In the present invention, a dual emission display device is used so that either surface of a display is used as a main display or a sub-display. Accordingly, the display device can be reduced in thickness and in the number of components. Further, mechanical reliability can be enhanced when the invention is applied to a tablet PC, a video camera and the like.

A light emitting display and a method of manufacturing the same, wherein the light emitting display includes a first substrate on which a plurality of light emitting devices is formed, a second substrate provided to face the first substrate, a dam member provided between the first substrate and the second substrate to surround the plurality of light emitting devices, an inorganic sealing material provided between the first substrate and the second substrate on an outer circumference of the dam member to attach the first substrate and the second substrate to each other, and a filling material provided on an internal side of the dam member to cover the plurality of light emitting devices. The inorganic sealing material effectively shields moisture or oxygen and/or increases the life of the light emitting display. The filling material fills the space between the substrates to improve mechanical reliability.

Surface mount packages having pre-applied underfill thereon and methods of fabricating and using such packages are provided. Supplying customers with packages having pre-applied underfill enhances the thermal and mechanical reliability of surface mount packages and also, mitigates the customers' needs for additional cost, tooling, man-power, and process operations relating to the application and curing of underfill material.

The invention discloses a real time residual life prediction method of a gear, and belongs to the technical field of mechanical reliability. The method comprises following implementation steps of 1, using a sensor to monitor degeneration of the power gear in real time; 2, carrying out feature extraction to the fatigue state of the gear; carrying out degeneration evaluation to the wear degeneration performance of the gear; 3, building a parameter variable gear degeneration state space model; 4, detecting a sudden change state point in the degeneration process of the gear; 5, correcting a prediction model according to the detected sudden change point information; carrying out state evaluation again; and 6, predicting the residual life of the gear according to the gear state evaluation and a gear fault threshold value. The method has the advantages that the accuracy of predicting the degeneration state and the real time residual life of the gear can be effectively improved, thus providing the basis for preventative maintenance of the gear.

A system for inspecting a flexible device is provided, which is used for performing a performance inspection on a flexible device in a bending state, or after the flexible device has finished bending test so as to obtain a mechanical reliability. The inspecting system includes: at least one bending unit with at least one curvature; a conveyor unit used for conveying the flexible device so that a portion of the flexible device is passed through the bending unit and is bent into a bending portion; an inspecting unit performs a performance inspection on the flexible device. The performance inspection includes electrical, optical, or opto-electric inspection, and an inspection result can be recorded, displayed or both. The inspected flexible devices may be a flexible display device with complete or incomplete electrode thereon. In addition, a method for inspecting a flexible device is also provided.

The present invention relates to a solar collecting and utilizing device comprising: a paraboloidal mirror for collecting the sunlight and converging it as a facula, a sunlight collector, a solar storage and conversion device, and a solar tracking equipment, wherein, said solar tracking equipment comprises implementing mechanical parts and photoelectrical control parts; said sunlight collector includes a light guider which converts the facula into substantially parallel light beams and reflects them in a desired direction, and a curved surface condenser mirror which receives the substantially parallel light beams reflected from the sunlight guider and converges them into solar storage and conversion device; said light guider includes a light guider mirror for point focusing the light beams. The present invention provides a device which can enhance highly the solar collection density, centralize the energy conversion/utilizing points, simplify the sunlight tracking mechanism, improve the mechanical reliability of the whole system, and lower the investment and the cost of operation.

The invention relates to establishment for a test device and a test method for the bending fracture performance of thin-film materials, in particular to an in situ evaluation system and a method of the mechanical reliability of a layer or a plurality of layers of thin-film materials with the micron to nanometer thickness on a flexible electronic substrate. The system comprises a high-precision micrometer caliper, a balance spring, a translational slide block, a freely supported beam fixed end, a freely supported beam movable end, and the like, wherein a composite beam comprising the micrometer caliper and a flexible substrate exerts precise and controllable step displacement to implement freely supported beam bending experiments; real-time exerted strain corresponding to a freely supported beam span is computed according to parameters and geometrical relationship of the freely supported beam span, sample sizes, and the like; and the bending fracture performance and critical cracking strain of the kind of thin film are tested and evaluated by combining in situ microscopic observation and subsequent scanning electron microscope characterization. The invention does not need to consider the electroconductibility of the thin-film materials, and is still adaptable for non-conductive thin-film materials. The experiment operation is simple and fast, in situ real-time positioning observation and analysis can be carried out on samples.

An organic light emitting diode (OLED) display device, which can use a non-emission surface of an encapsulation substrate to reflect light, can prevent a voltage applied to a cathode from dropping, and has improved mechanical reliability, and a method of manufacturing the same. The OLED display device includes a substrate; a first electrode disposed on the substrate; an organic layer disposed on the first electrode; a second electrode disposed on the organic layer; a conductive material layer disposed on the second electrode; a metal layer disposed on the conductive material layer; an encapsulation substrate disposed on the metal layer; and an encapsulant to combine the substrate with an encapsulation substrate.

The invention relates to a method and a system for testing the reliability of a load switch, and is characterized in that the method comprises the following steps that (1) a test system is connected with the load switch to be tested; (2) the load switch to be tested and the system are connected; (3) a pulse power module is set; (4) a subsystem sends out a pulse excitation signal; and (5) an alarm ending signal is sent out. The system comprises a control subsystem, an actual load subsystem and a temperature and humidity subsystem. According to the scheme provided by the invention, the reliability of a single-phase load switch and a three-phase load switch can be tested; the time and contact resistance are tested automatically, and stopping conditions are judged automatically; an alarm function is realized and the safety is high; mechanical reliability and electric reliability tests can be carried out automatically without manual operation, and the stability is good; and the wiring is simple and the verification time is saved.

This invention relates to flexible element test system to test the property of flexible elements for property test, wherein, the test system comprises at least one bent unit and one curve rate; the drive unit is to move the flexible display element to be bent on one part through bent unit; test unit is to test the flexible unit; the property test comprises electricity, light test and record the test result for display.

The invention relates to a piezoelectric pipe water flow electric generator, and belongs to the technical field of electric generation. A fluid cavity and an energy capturing cavity are formed in a body, an inlet and an outlet are formed in the side wall of the fluid cavity, and a lower cover is installed at the end of the side wall of the fluid cavity; an upper cover is installed at the end of the side wall of the energy capturing cavity, a circuit board and transducers with magnetic blocks installed at the ends are installed on two steps on the inner side of the side wall of the energy capturing cavity, and each transducer is formed by two bent piezoelectric vibrators; a boss is arranged on a partition plate of the body and provided with guide grooves, a bearing hole and a cavity, and the magnetic blocks are arranged in the guide grooves of the boss; a main shaft is installed on the lower cover and the boss through bearings and provided with a magnetic ring and an impeller, and the magnetic blocks and the magnetic ring are installed in the mode that polarity-opposite magnetic poles are close. The piezoelectric pipe water flow electric generator has the advantages that the pre-bent piezoelectric vibrators are stimulated through non-contact magnetic coupling to be deformed for electric generation, movement parts are sealed in the fluid cavity, leakage is avoided, and a circuit system is high in running stability; piezoelectric plates only bear pressure stress, so that the mechanical reliability is high; the multiple piezoelectric vibrators are stimulated by the magnetic ring at the same time, the electric generation capacity is high, and noise is avoided.

A semiconductor device is provided in which, while an organic semiconductor layer is sufficiently protected by a protective film, it is possible to prevent delamination at the protective film interface, thereby achieving good characteristics and improving yield due to improvement in mechanical reliability. A semiconductor device (1a) includes an organic semiconductor layer (13) formed by patterning on a substrate (3), and a protective film (15) formed by patterning on the substrate (3) in such a state as to cover an exposed surface including a side wall of the organic semiconductor layer (13). An insulating partition wall (11) having an opening (11a) is disposed on the substrate (3), and the organic semiconductor layer (13) is formed by patterning, in a state of being divided by the partition wall (11), on the bottom of the opening (11a) of the partition wall (11). Furthermore, the protective film (15) is disposed in such a state as to fill the inside of the opening (11a) of the partition wall (11).

The invention discloses an expanded square cabin. The left side and the right side of a fixing cabin body are symmetrically provided with expanded cabin bodies respectively. Containing spaces for containing the expanded cabin bodies are formed between the fixing cabin body and the expanded cabin bodies. Each expanded cabin body is of a folding and telescopic structure and comprises side plates arranged on the left side and the right side, vertical plates arranged on the front side and the rear side, an expanded plate arranged on the upper portion and a bottom plate arranged at the bottom. Middle plates are arranged between the expanded plates on the left sides and the right sides of the upper portions. The side plates, the vertical plates, the expanded plates, the bottom plates and the middle plates are connected with one another, and the fixing cabin body and the expanded cabin bodies are connected to form a square structure. The bottom plates are provided with heating membranes. An aluminum alloy frame and a composite plate structure are adopted for the expanded square cabin, and the expanded square cabin has the advantages of being light in weight, large in expansion space, high in mechanical reliability, high in hidden performance, capable of insulating sound and heat, fast to assemble and the like and is suitable for severe enrolments, such as rainstorm, snow and sandstorm.

In laminated chip structure and manufacturing method thereof, relative simple technology is used for fully filling the clearance between upper chip and lower chip thereby eliminating the clearance and preventing problems of fracture and stripping in relation of the clearance. The invention can be used in bonding method of chip level and wafer level. Before laminating chips or wafers, photosensitive polymer layer is applied on a first chip or wafer. The photosensitive polymer layer is partly solidified in order to stabilize structure thereof and keep adhesiveness performance thereof. A second chip or wafer is laminated, aligned and bonded to the first chip or wafer, and then the photosensitive polymer layer is solidified to completely bond the first and the second chips or wafers. In this manner, the adhesiveness between chips/wafers is greatly improved as well as clearance is fully filled. In addition, mechanical reliability is improved and mismatch of CTE is reduced, and warpage, fracture and stripping related problems can be reduced, thus, the rate of finished products and reliability can be improved.

The invention relates to a self-powered oil and gas pipeline monitoring device based on fluid power generation, and belongs to the field of oil and gas pipeline monitoring. A cone frustum is arranged on a pipeline, a spindle with an impeller and a magnetic ring is mounted in a stepped hole of the cone frustum, the magnetic ring is placed in a shaft sleeve mounted at the end of an inner cylinder wall, a pressure sensor and a flow sensor are embedded into a bottom plate of the cone frustum, a circuit board with a signal transmitting module is mounted on the inner side of an outer cylinder wall, a cylinder is welded at the end of the outer cylinder wall, a wedge block and a magnetic block are riveted at two ends of a piezoelectric vibrator with an arc projection, the magnetic block is arranged in a radial guide groove of the shaft sleeve, the wedge block is arranged in a dovetail groove of the cylinder and pressed at the end of the outer cylinder wall through an end cover, and the magnetic block always bears suction from the magnetic ring when the spindle rotates. The self-powered oil and gas pipeline monitoring device has the advantages that a non-contact magnet coupling method excites the pre-bend piezoelectric vibrator to stretch and deform to generate electricity, motion components are sealed in a pipeline, leakage is avoided, the running reliability of a circuit is high, a piezoelectric plate only bears pressure stress and is high in reliability, and the magnetic ring simultaneously excites a plurality of piezoelectric vibrators and is high in power generating capacity and free of noise.