134 results about "Temperature cycling" patented technology

The invention discloses an H-bridge key equipment service life and system reliability evaluation method and system for a cascade network construction type energy storage system, and belongs to the technical field of power system automation. The method comprises the following steps: firstly, extracting task profile parameters under multiple time scales, and constructing a time sequence feature model; secondly, estimating a hot spot temperature sequence of the IGBT device and the capacitor based on a multilayer feedforward neural network; then, in combination with a continuous extreme point paired temperature cycle extraction method and a Miner linear cumulative damage criterion, the damage factor and the residual life of the device are evaluated; then, task profile samples are expanded based on a generative adversarial network with gradient penalty, and life distribution and reliability indexes of key devices under different profiles are calculated; and finally, based on H-bridge series structure mapping device level information, constructing a system level reliability model, obtaining system failure rate, average fault-free operation time and a reliability function, and realizing health state perception and reliability quantitative evaluation of the energy storage system.

The invention relates to a preparation, regulation and control method of a thermoplastic elastomer encapsulating material in the technical field of new materials, which comprises the following steps: realizing an in-situ reaction process by controlling the concentration and reaction temperature of reactive functional groups in the encapsulating material according to an interface reaction rate constant and active group distribution density; if the reaction conversion rate reaches a preset value, a chemically bonded interface bonding layer is formed; monitoring the stress distribution state in the rubber coating layer by adopting a stress analysis algorithm, and when detecting that local stress concentration exceeds the yield strength of the material, dispersing a stress concentration area by adjusting the length of a flexible chain segment and the density of a rigid cross-linking point in a cross-linking network; and deformation data and a bonding strength change trend of the interface bonding layer in the temperature cycling process are obtained, if the bonding strength attenuation rate exceeds a preset threshold value, a dynamic cross-linking mechanism is activated, and the dynamic equilibrium state of interface bonding is maintained through fracture and recombination of a reversible covalent bond.

The invention provides a preparation method and application of ceramic slurry for high-temperature bonding of aluminum nitride ceramics, and relates to the technical field of high-temperature ceramic materials.The preparation method comprises the following steps that firstly, an organic carrier is prepared, a polymer binder, an organic solvent, a plasticizer and a dispersing agent are weighed according to the weight ratio and stirred at the temperature of 60-70 DEG C till complete dissolution and clarification are achieved for use; 2, an inorganic functional phase is prepared, aluminum nitride powder, yttrium oxide powder and alkaline earth metal oxide powder are weighed according to the weight proportion and placed in a ball milling tank to be evenly mixed, the obtained ceramic slurry serves as a bonding layer, the tolerable temperature can reach 1000 DEG C or above and is far higher than that of metal brazing filler metal, and the ceramic slurry is suitable for severe environments such as aerospace and high-temperature sensors. The main components of the bonding layer are consistent with the base material, and the thermal expansion coefficient is highly matched, so that the thermal stress can be greatly relieved, and the failure of the device caused by thermal fatigue in the temperature cycle is avoided.

The invention provides a photovoltaic power station full power hour deviation prediction method, which belongs to the technical field of photovoltaic power stations, and comprises the following steps: establishing a component nonlinear attenuation model by collecting multi-physical field environmental parameters, identifying temperature cycle and freeze-thaw cycle, and calculating an acceleration factor and a damage index; an attenuation compensation coefficient is introduced according to attenuation rate deviation to correct component power, a total-station subarray topology network model is constructed, a maximum-flow minimum-cut algorithm is applied to identify a power transmission bottleneck, and direct-current side voltage and reactive compensation configuration are optimized to balance power flow between subarrays; a space-time diagram convolutional network and a gating circulation unit are used for extracting space topological characteristics and a time sequence evolution rule, a prediction result is corrected by applying a hysteresis compensation coefficient according to irradiance change characteristics, and the technical problem that the prediction accuracy of the full power generation hours of the photovoltaic power station is insufficient is solved.

The invention discloses an automatic testing and screening method for electronic components, which relates to the technical field of electronic engineering and microelectronics and comprises the following steps: generating a multi-dimensional stress field through a temperature control module, a humidity control module and an electromagnetic interference simulation module; calling a preset extreme working condition combination sequence based on the target application scene of the component; under a dynamic coupling environment, dominant parameters and recessive parameters including a dielectric relaxation spectrum, a carrier mobility transient response and a thermoacoustic emission signal are synchronously collected; inputting the hidden parameter time sequence data into physical failure models including an electrochemical corrosion model and a thermal mechanical fatigue model; dynamically adjusting the passing threshold of the test item according to the model output; the step of applying accelerated degradation excitation to the screened component comprises the following steps of: circulating a set temperature for a set number of times; applying a bias voltage-temperature stress; and repeating the step S2 to monitor the implicit parameter drift amount, and eliminating the device with out-of-tolerance drift. The device guarantee is provided for the fields of new energy automobiles, aerospace electronics and the like.

The invention provides a temperature cycle endurance test method, device and equipment and a storage medium, relates to the technical field of vehicles, and is used for accurately calculating the temperature cycle number of a motor controller. The method comprises the following steps: acquiring cooling liquid temperature-time data of motor controllers of a plurality of vehicles; based on the cooling liquid temperature-time data of the motor controller of each vehicle, determining temperature difference-cycle number data of the motor controller of each vehicle; based on the temperature difference-cycle number data of the motor controller of each vehicle, the equivalent temperature cycle number corresponding to each vehicle in the temperature cycle endurance test is determined; determining a target temperature cycle index in the temperature cycle endurance test based on the equivalent temperature cycle index corresponding to each of the plurality of vehicles; and performing a temperature cycle endurance test on the test vehicle based on the target temperature cycle number.

According to embodiments, a modified freeze-drying apparatus and methods of use are provided herein for providing variable power heating for precise control of material temperatures during freeze-drying. The apparatus may provide a vacuum pump and variable current heater trays for receiving the material, freezing the material, creating a vacuum, progressively increasing the heater tray temperature without causing temperature cycling, deactivating the tray heater, repressurizing the apparatus, and removing the freeze-dried material.

The invention relates to the field of intelligent sensors, and discloses a method for manufacturing a sensitive core of a six-dimensional pressure sensor of a robot based on glass micro-melting, which comprises the following steps of: calculating the deflection of a flat diaphragm corresponding to a glass micro-melting structure so as to analyze the structural strain characteristic of the sensitive core under the action of pressure; calculating the gas viscosity coefficient of the sensitive core body under the dynamic load condition, and calculating the pressed film damping amount of the sensitive core body; performing a temperature cycle test on the sensitive core, collecting thermal zero drift data in the test process, and analyzing the temperature drift stability of the sensitive core; carrying out calibration test on the sensitive core body to obtain non-linearity data, and evaluating the measurement precision of the sensitive core body; and performing optimization processing on the sensitive core body manufacturing process to obtain an optimization result. The manufacturing process stability of the sensitive core body of the six-dimensional pressure sensor of the robot can be improved.

The invention relates to the technical field of data storage, and discloses a high-low temperature intelligent start-stop test method for a solid state disk, which comprises the following steps: acquiring a to-be-tested solid state disk, and preprocessing the to-be-tested solid state disk; performing a high-temperature starting test on the preprocessed solid state disk to be tested, and evaluating according to a test result to obtain the high-temperature starting performance of the solid state disk to be tested; performing a low-temperature starting test on the preprocessed solid state disk to be tested, and evaluating according to a test result to obtain the low-temperature starting performance of the solid state disk to be tested; and setting a temperature circulation curve in the incubator based on the high-temperature starting performance and the low-temperature starting performance, performing high-low-temperature circulation starting and stopping testing on the processed solid state disk to be tested based on the temperature circulation curve, and monitoring and recording a current change waveform of each high-low-temperature circulation starting and stopping testing. According to the invention, the actual use scene of a user in an extreme environment is comprehensively simulated, and the accuracy and reliability of a test result are improved.

Thermal control devices and methods to provide improved control, speed and efficiency in temperature cycling are provided herein. Such thermal control device and methods can include one or more active elements, such a thermoelectric cooler device, that is controlled by an algorithm that regulates a temperature distribution of an adjacent reaction-vessel according to a temperature distribution command trajectory and estimated reaction-vessel temperature distribution. Some embodiments include two active elements that are bilaterally applied to opposing sides of the reaction-vessel. In some embodiments, the estimated reaction-vessel temperature is determined based on a state of power electronics of the element and a temperature output of one or more sensors of a portion of the element and / or an ambient environment of the reaction-vessel. Methods of calibration of such systems utilizing a thermal calibrator as a proxy for the reaction-vessel are also provided herein.

The invention belongs to the technical field of pipeline welding, and particularly discloses a welding prediction method and device suitable for a new energy natural gas pipeline. The method comprises the following steps: acquiring a load spectrum containing pressure fluctuation, temperature cycle and hydrogen partial pressure change; setting a target fatigue life threshold value; calculating a three-dimensional residual stress field through a thermal-mechanical coupling finite element model; the load spectrums are superposed, a critical plane method is combined with a Smith-Watson-Topper damage model to calculate the fatigue crack initiation life, and a hydrogen environment correction factor is introduced to quantify the hydrogen influence; with the standard reaching of the fatigue life as the constraint, welding parameters are optimized through an improved non-dominated sorting genetic algorithm; and outputting the optimal parameters to a welding system. According to the method, the problem that traditional welding parameter design lacks dynamic load and hydrogen environment coupling prediction capacity is solved, reverse design for reversely deducing process parameters from service requirements is achieved, and the reliability of welding quality and process formulation efficiency are remarkably improved.

A double-temperature-zone heat tracing device power stability test device disclosed by the present invention comprises a test box and a heat tracing band, the inner side of the test box is provided with a conveying mechanism, the conveying mechanism is provided with two loading plates capable of lifting and moving, and the tops of the two loading plates are symmetrically provided with overturning clamping assemblies. Correction assemblies are arranged on the two loading plates, each correction assembly comprises a plurality of fixing rings, the multiple fixing rings move in the length direction of the heat tracing band, correction sliding rings are arranged on the inner sides of the fixing rings, and cleaning assemblies used for cleaning the surfaces of the hot plate and the cold plate are arranged at the bottoms of the hot plate and the cold plate. According to the heat tracing band overturning device, efficient and uniform overturning of a soft heat tracing band is achieved, the temperature cycle period needed by pretreatment is remarkably shortened, the contact face of the hot plate and the cold plate is cleaned and maintained through the cleaning assembly, an oxide layer is effectively removed, and the stability of the heat conduction efficiency and the accuracy of a test result in the whole long-period test process of the heat tracing band are guaranteed.

The invention relates to a full-automatic temperature cycle test system, method and equipment for an insulator and a storage medium. The full-automatic temperature cycle test system comprises a partitioned test box body, an integrated temperature control unit, a sample bearing and transferring device and an intelligent control system. The test box body is provided with a high-temperature liquid soaking area, a low-temperature liquid soaking area and a high-temperature gas heating area, and accurate temperature field regulation and control are realized through the circulating water temperature control unit and the heating device; the sample bearing device is provided with a three-dimensional positioning mechanism and is driven by a servo system to automatically transfer in a temperature range; the control system is based on a touch screen and PLC architecture, and integrates the functions of parameter setting, flow execution, real-time monitoring and remote communication. According to the scheme, full-process automation of the insulator temperature test is realized, and the test efficiency and the data reliability are remarkably improved.

This invention discloses a through-silicon via (TSV) capable of suppressing copper extrusion and its fabrication method. The invention utilizes magnetron sputtering to deposit a certain thickness of ZrW at the bottom of the TSV. 2‑x Mo x After depositing an O8 thin film, followed by electroplating a copper layer of a certain thickness, the above steps are repeated to deposit multiple layers of ZrW in the middle of the Cu. 2‑x Mo x O8 thin film; while ZrW 2‑x Mo x O8 is a material with a negative coefficient of thermal expansion, which is -4.3 × 10⁻⁶. ‑6 to -7.7×10 ‑6 K ‑1 This material contracts rather than expands when heated. During heat treatment (e.g., annealing) or temperature cycling of through-silicon vias (TSVs), Cu expands, while ZrW... 2‑x Mo x The O8 material shrinks rather than expands, which can partially offset the thermally induced stress caused by the mismatch in the coefficients of thermal expansion between the constituent materials of the through-silicon via (TSV). Therefore, the TSV fabricated by the method of this invention can improve the reliability of copper-filled TSVs while allowing for optimized device performance (e.g., allowing for higher temperature annealing of copper).

To provide an Al bonding wire that exhibits excellent temperature cycling reliability and favorable bondability. The Al bonding wire contains 3.0 mass% or more and 10.0 mass% or less of Si, and an average diameter of a Si phase in a cross-section (L-section) in a central axis direction including a wire center axis of the Al alloy bonding wire is equal to or greater than 0.8 µm and equal to or less than 5.5 µm.

The application discloses an electronic product temperature cycle life test system based on data analysis and relates to the technical field of electronic product testing, solves the technical problem that the prior art cannot extract a harsh scene and integrate it into a temperature cycle scheme for temperature cycle test in combination with the use scene of an electronic product, and specifically relates to a use scene joint analysis unit which performs life test analysis on an electronic product in combination with the use scene of the electronic product, extracts a harsh scene and integrates it into a temperature cycle scheme for temperature cycle test, and tests the electronic product under a simulated use scene; a material failure analysis unit which performs material failure analysis on the electronic product; a material welding failure risk determination unit which determines the material welding failure risk of the electronic product and controls the material connection of the electronic product in a timely manner; and a micro deformation analysis unit which performs micro deformation analysis on the electronic product and ensures the usability of the connection of the overall material.

This invention relates to a thermal unit for temperature management of a dPCR thermal cycler, and also to a thermal unit for a device for simultaneously thermally cycling multiple biological samples, also known as temperature cycling, such a device itself, and a method for simultaneously thermally cycling multiple biological samples using such a device and thermal unit. The thermal unit has at least one heat block (3) and a cooling structure (2), the heat block (3) comprising at least one thermoelectric transducer (31) and a heat transfer plate (33) attached to the thermoelectric transducer (31) for dissipating heat energy from the thermoelectric transducer (31), and the cooling structure (2) comprising a radiator (21), at least one fan (221), and exhaust pipes (24a, 24b).

The application discloses a kind of low temperature extremely cold environment under optical fiber coating detection equipment and method, belong to coating detection technical field, comprising: obtaining temperature cycle times, coating thickness, heating gradient and other detection condition data, and coating adhesion, shrinkage, cracking length and other performance data;Construct detection condition evaluation model output detection condition coefficient;Based on detection condition, coating performance analysis model is established to output performance evaluation coefficient;Combined with the content of silicon dioxide nanoparticles and polyether polyurethane data, material analysis model is output material analysis coefficient;If the coefficient exceeds the preset threshold, then determine that the coating is unqualified and generate target formulation parameters.The application solves the technical problems of coating performance quantification evaluation and formulation precise optimization under extreme environment, significantly improves detection efficiency and reliability.

The invention provides a method and a system for testing the reliability of a built-in sensor for active defense of a converter transformer. The method comprises the following steps: performing a performance baseline test on the sensor; performing a sensor temperature cycle test, and checking the to-be-tested sensor and the sealing ring; the sensor is installed on the test tool, preset static pressure and preset high-temperature stress are applied to the sensor, the sensor to be tested is observed, and test signal response information of the sensor to be tested is detected; performing structural integrity detection on the sensor; and testing the equivalent height again to obtain the signal stability of the sensor. According to the invention, a three-in-one reliability evaluation system of ''performance baseline test-high and low temperature alternating test-accelerated aging test'' is constructed to evaluate the sealing performance, the structural stability and the signal consistency of the sensor under long-term operation conditions of high temperature, oil immersion and the like; and the structural integrity, the signal stability and the sealing reliability of the sensor under extreme working conditions such as oil immersion and high temperature are ensured.

The present application relates to the field of test device, and provides a partitioned contact temperature cycle test bench for seal material performance, including a temperature control device, a support device and a drive device, where the temperature control device includes a first thermostatic module and a second thermostatic module, the first thermostatic module is provided with a first thermal conduction surface, the second thermostatic module is provided with a second thermal conduction surface, the first thermal conduction surface and the second thermal conduction surface enclose a receive cavity, and temperature of the first thermostatic module is different from temperature of the second thermostatic module; the support device supports a piece to be tested, the support device is rotatably provided in the receive cavity, the support device is provided with a thermal conduction portion, the thermal conduction portion is in contact with the piece to be tested, and the thermal conduction portion is in contact with any one of the first thermal conduction surface and the second thermal conduction surface; and the drive device drives the support device to rotate relative to the temperature control device. Such an arrangement solves the problem in the related art that the temperature cycle test device cannot alternately change rapidly in a wide temperature range.

The invention relates to a sectional type air bag used for plugging a lead hole of a temperature circulation box, and belongs to the field of spacecraft part and assembly level single machine thermal tests. The n segmented air chambers are uniformly arranged in an inner cavity of the air bag main body; an inflation valve is arranged on the side wall of the middle of the airbag body. The air chamber inflation flow channel is an annular flow channel; the air chamber inflation flow channel is arranged in an inner cavity of the air bag body, and the n segmented air chambers are arranged in the middle of the air chamber inflation flow channel. The top of the segmented air chamber is communicated with the air chamber inflation flow channel through an air inlet in the upper part of the air chamber; the bottom of the segmented air chamber is communicated with the air chamber inflation flow channel through an air inlet in the lower part of the air chamber; an air chamber double-layer sealing edge is arranged on the periphery of the air chamber inflation flow channel to realize sealing; according to the invention, the temperature box lead hole still has good sealing performance under the condition that multiple types of leads are led out, the applicability of the temperature box under the condition of complex wiring is improved, the stability of a temperature cycle test of the temperature box can be ensured, meanwhile, the humidity is ensured to meet the requirement, and the plugging efficiency and reliability are improved.

The embodiments described herein generally relate to processing chambers incorporating a small thermal mass, which enable efficient temperature cycling for supercritical drying processes. The chambers generally include a body, a liner, and an isolation element that enables the liner to exhibit a small thermal mass relative to the body. The chambers are also configured with suitable equipment for generating and / or maintaining a supercritical fluid within a processing volume of the chamber.

The present application relates to the field of concrete material performance test analysis, and discloses a kind of concrete interface transition zone linear expansion coefficient measuring device and method, the device includes water circulation heating mechanism and measuring mechanism;Water circulation heating mechanism includes heating cylinder, water inlet pipe, water outlet pipe, test baffle and adjustable temperature cold and hot integrated circulating water machine, adjustable temperature cold and hot integrated circulating water machine is communicated with the heating cavity on heating cylinder by water inlet pipe and water outlet pipe;Test baffle is sealed in the opening of heating cylinder and is connected with measuring mechanism.The method is used for simulating temperature change in actual engineering by adjustable temperature cold and hot integrated circulating water machine regulation and control heating cylinder temperature, temperature cycle to cavity aggregate-cement mortar combination test piece, by multi-interface superposition amplification overall deformation effect, eliminate accidental error caused by single interface measurement, realize the accurate determination of interface transition zone linear expansion coefficient, provide key technical reference for concrete mesoscopic temperature cracking mechanism research and anti-cracking design.

The application discloses a kind of thermomechanical fatigue crack propagation rate test methods, the present application utilizes DCPD method to sample electric potential is calibrated: first, calibrate crack length a and the corresponding relation curve a-U of electric potential U, multiple crack lengths need to be calibrated;Second, calibrate the corresponding relation curve U-t of electric potential U and time t under temperature cycle of each crack length;Finally, through thermomechanical fatigue (TMF) experiment, the real-time corresponding relation curve U-t of electric potential U and time t in crack propagation process is obtained, time t is converted into cycle number N, is substituted into a-U and obtains a-N relationship curve. Meanwhile, another group of a-N curve is obtained by using long-focus microscope visual method. The crack propagation data obtained by visual method is used to correct and modify the a-N curve data obtained by DCPD measurement, so as to realize accurate and efficient measurement of thermomechanical fatigue crack propagation rate.

This invention provides an organic sealing and protective composite material for power equipment and its preparation method, belonging to the field of polymer material preparation technology. The organic sealing and protective composite material for power equipment provided by this invention includes an electric field conducting layer and an electroactive sealing layer disposed on the surface of the electric field conducting layer. This invention converts the electric field during power equipment operation into a driving force for actively compensating for interfacial thermal mismatch. The electric field is introduced into the electroactive sealing layer through the electric field conducting layer, causing it to undergo electrostrictive deformation, thereby filling the interfacial micro-gap caused by temperature changes in real time. This fundamentally solves the problem of gas-phase water permeation caused by the repeated opening and closing of interfacial micro-gap under temperature cycling.

The invention provides a test method and device of a protection module, electronic equipment and a storage medium, thermal cycle processing is performed on a temperature monitoring element according to a temperature cycle period, and the temperature monitoring element is wrapped by the protection module; acquiring first thickness data and stress data of an outer protection sleeve in the protection module, and acquiring second thickness data of a sealing device in the protection module; and inputting the first thickness data, the second thickness data and the stress data into a state prediction model to predict the stress change and the thickness change of the protection module in a preset duration, and generating test data of the protection module. Compared with the prior art, the operation reliability of the temperature monitoring element can be improved, and the cost of the whole life cycle can be reduced through precise maintenance and design upgrading.

The invention relates to the technical field of joint module testing, in particular to an on-load comprehensive testing system for an integrated joint module, a main body is composed of an incubator and a main control system, a testing circuit and a sensor array are integrated in the incubator, and the testing circuit is connected with an electrical interface of the joint module to be tested; the sensor array comprises a temperature sensor and a torque sensor; the main control system is configured to execute an automatic scheduling program and a sensor compensation program, match a test task according to a temperature cycle stage matching rule base, and control the test circuit according to the test task; in the process of the temperature environment simulation task and the test task, when the temperature circulation stage is in the cooling stage, first dynamic compensation is carried out on the reading of the temperature sensor; and when the test task comprises the step of applying the load to the joint module, performing second dynamic compensation on the reading of the torque sensor. Parallelization and dynamic scheduling of the test process are realized, and meanwhile, the problem of weak dynamic interference suppression capability in the prior art is solved.

The application provides an environmental coefficient calculation method and device for electronic components under a preset temperature vibration environment. The method comprises the following steps: constructing a finite element model according to the structure parameters of a component to be predicted; performing temperature cycle simulation on the finite element model, and calculating temperature cycle damage according to the result of the temperature cycle simulation and the Miner law; performing random vibration simulation on the finite element model with a preset temperature cycle condition as a prestress, and calculating random vibration damage according to the result of the random vibration simulation and the Miner law; superimposing the temperature cycle damage and the random vibration damage, and calculating the total life of the component to be predicted according to the result of the damage superposition and the Miner law; and removing the influence of the packaging factor in the failure rate based on the total life and an electronic device reliability prediction manual, so as to obtain the environmental coefficient of the component to be predicted under the preset temperature cycle condition, and improve the accuracy and reliability of the failure rate prediction of the electronic component.

The invention discloses a high-reliability chip bonding film, a preparation method thereof and application of the high-reliability chip bonding film in storage packaging, and relates to the technical field of electronic packaging materials. The chip bonding film is prepared from the following components in parts by mass: 30 to 40 parts of spherical silicon dioxide, 10 to 20 parts of phenoxy resin, 10 to 20 parts of acrylic epoxy resin, 10 to 15 parts of polyurethane modified epoxy resin, 3 to 6 parts of active epoxy diluent, 8 to 16 parts of phenolic aldehyde curing agent and 0.8 to 1.2 parts of accelerant, by adjusting the proportion of all the components and the synergistic effect of all the components, the strain capacity and moisture absorption resistance at high temperature are remarkably improved while excellent heat resistance is successfully maintained, so that high interface bonding strength can still be maintained after a harsh temperature cycle test; and the problem of packaging failure caused by brittle rupture and moisture absorption of the material is effectively solved.

A method for coating high-aspect-ratio (HAR) and high-surface-area (HSA) substrates via atomic layer deposition (ALD) wherein the temperature of the substrate is varied cyclically during the ALD process. An exemplary temperature schedule for each ALD cycle includes at least one predetermined lower temperature during a diffusion / reaction stage of the cycle, where the lower temperature prevents decomposition of the ALD precursors and further prevents other side reactions, and further includes at least one predetermined higher temperature during a purge stage of the cycle, where the higher temperature enables rapid purging of excess precursor and / or byproducts produced during the reaction stage of the cycle. The prevention of side reactions ensures that the ALD coating is uniform and has the desired composition with minimal impurities, and the rapid purging ensures reasonable total process time.