118 results about "Contact temperature" patented technology

This non-contact temperature measuring device comprises: a light emitting unit (light source (18a)) that emits measurement light (L1) toward a front surface (Wa) of a measured object; a light receiving unit (light receiving sensor (18b)) that receives reflected light (L2A) of the measurement light (L1) reflected by the front surface (Wa) and reflected light (L2B) of the measurement light (L1) reflected by a rear surface (Wb) on the opposite side to the front surface (Wa), and outputs a light reception signal; a thickness calculating unit (18c) that calculates a second thickness on the basis of the light reception signal output from the light receiving unit, where the actual thickness of the measured object is defined as a first thickness (thickness (Lv)), and a thickness obtained by multiplying the first thickness by the refractive index of the measured object is defined as the second thickness (Lopt)); a measured object information acquiring unit (wafer information acquiring unit (34)) that acquires measured object information (wafer information (29)); and a temperature calculating unit (36) that calculates the temperature of the measured object on the basis of the second thickness and the measured object information.

The invention belongs to the technical field of special alloy hot rolling, and particularly relates to a refined subsection cooling method and device for a titanium plate hot mill roller. Comprising the steps that S1, a temperature field distribution function of a roller during rolling and a temperature field distribution function of the surface of the roller during cooling are obtained; s2, a heat exchange coefficient distribution function of the heat exchange coefficient required by the roller in the axial direction of the roller is obtained; s3, a distribution function of the cooling water flow in the axial direction of the roller is obtained; s4, according to the distribution function of the cooling water flow in the axial direction of the roller, the roller is divided into a plurality of cooling sections in the axial direction of the roller, and different cooling sections correspond to different cooling water flow difference threshold values; and S5, a non-contact temperature sensor is arranged at the center position of each cooling section, an independent roller cooling mechanism is configured for each cooling section, and the flow of cooling water is adjusted. Independent cooling control over different cooling sections of the roller is achieved, and the plate shape quality of a titanium plate is improved.

Thermal imaging may be used for obtaining measurements of a tribological testing apparatus including a contact temperature. For example a method of calculating a contact temperature may include: introducing a testing sample into a contact zone of a tribological testing apparatus; engaging a testing operation of the tribological testing apparatus; measuring a contact emission of a testing surface of the tribological testing apparatus with an infrared camera; and calculating a contact temperature of the testing sample in the contact zone from the contact emission; wherein the tribological testing apparatus has a carbon coating on the testing surface of the contact zone, wherein the carbon coating has a first infrared emissivity, wherein the testing sample has a second infrared emissivity, and wherein the first infrared emissivity is within + / −20% of the second infrared emissivity.

The invention relates to the technical field of concrete engineering, and discloses a mass concrete temperature control system, method and device and a storage medium, and the system comprises a multi-dimensional sensor module which is used for collecting the contact temperature of each temperature measurement point and transmitting the contact temperature to a controller; the non-contact monitoring module is used for collecting the non-contact temperature of a preset area of the mass concrete and transmitting the non-contact temperature to the controller; the controller is used for performing temperature analysis according to the contact temperature and the non-contact temperature of the mass concrete, generating three-dimensional temperature field distribution of the mass concrete, predicting a temperature change trend of a future preset time period according to the three-dimensional temperature field distribution, and generating a temperature adjusting instruction according to the temperature change trend; and the temperature adjusting module is used for adjusting the temperature of the concrete with the abnormal temperature change trend according to the temperature adjusting instruction. The crack risk of mass concrete caused by temperature change is effectively controlled, the engineering quality is guaranteed, and the construction intelligent level and the management efficiency are improved.

An apparatus for non-contacting measurement of the temperatures of rotatable elements, such as prism elements of a Risley prism assembly, includes IR emissive patches applied to radially outward facing surfaces of the rotatable elements, reflective surfaces configured to axially reflect black body IR radiation emitted by the patches, IR sensors located behind the rotatable elements and configured to sense the reflected black body radiation, and a controller configured to receive data from the IR sensors and determine therefrom the temperatures of the rotatable elements. In embodiments, none of the IR sensors extends radially beyond a housing of the rotatable elements, and in some embodiments the IR sensors do not extend radially beyond a diameter of a largest of the rotatable elements. The apparatus can further include patches oriented axially rearward and associated IR sensors.

The invention discloses a switch cabinet circuit breaker contact temperature measuring and calculating method, system and device and a medium, mainly relates to the technical field of contact temperature measuring and calculating, and aims to solve the problem that in the prior art, a temperature sensor is usually arranged on the surface of a pole close to a contact, but is affected by the heat transfer process and the environment temperature, so that the contact temperature cannot be measured. And the surface temperature of the pole cannot accurately reflect the real temperature of the contact. Comprising the following steps: importing a simulation model into electromagnetic simulation software, selecting an eddy current field solver, and configuring material electromagnetic attribute parameters of each component; determining resistance parameter data corresponding to the contact resistance, and obtaining an ohmic loss value generated by each component; selecting a thermal simulation module in the electromagnetic simulation software, configuring thermal attribute parameters of materials corresponding to the parts, setting the environment temperature as a preset initial temperature, setting outer surface convection heat transfer coefficients corresponding to the parts on the basis of the preset initial temperature, and further performing simulation to obtain specific temperature rise values of the parts in the simulation model.

The invention relates to the technical field of ferrous metallurgy high-temperature metering, in particular to a converter continuous temperature measuring method, according to the method, temperature measurement is completed through a continuous temperature measuring device, the continuous temperature measuring device comprises a temperature measuring thermocouple, a thermocouple seating brick and a temperature measuring displayer, a temperature measuring calculation program is arranged in the temperature measuring displayer, and the thermocouple seating brick is arranged in the temperature measuring displayer. The method has the advantages that the advantages of non-contact temperature measurement and contact temperature measurement are combined, measurement defects are made up in a theoretical calculation mode, continuous temperature measurement of the converter is achieved, the temperature measurement efficiency is high, the temperature measurement accuracy is high, and the temperature measurement accuracy is high. And the temperature measuring device is long in service life.

The utility model discloses a hot pressing die of a hot press for processing TPU heels, and relates to the field of processing of heels. The device comprises a hot press, the hot press comprises a rack base, an upper die is arranged in a mountain room in the rack, and the device is provided with mounting grooves, film type pressure sensors, extension plates, adjusting grooves and infrared temperature sensors, the film type pressure sensors are mounted in the mounting grooves in the two sides of a heel support, and the extension plates are mounted in the adjusting grooves. The pressure distribution between the mold and the TPU material can be accurately monitored in real time, the precision of pressure control is improved, the detection head is aligned to the pressing position of the heel pressing block and the heel support, non-contact temperature measurement is achieved, the actual temperature of the mold and the TPU material can be monitored in real time, the response speed is high, the precision is high, temperature setting can be adjusted in time, and the service life of the mold is prolonged. And poor molding and material physical property damage caused by overheating or insufficient temperature are prevented.

The invention provides a non-contact temperature measurement method and system for a collector ring of a generator, and the method comprises the steps: calibrating a material sample sampled on site, determining the emissivity of the material of the collector ring of the generator, and setting the emissivity of a temperature measurement probe; a laser emitting unit is additionally arranged in a temperature measuring probe, the temperature measuring probe is installed on a special installation support, and aiming light rays emitted by the laser emitting unit are used for positioning the measuring position of infrared temperature measuring light rays; a target measuring point of the collecting ring is positioned by the temperature measuring probe through multiple adjustment tests in combination with the laser emitting unit and the mounting bracket; and controlling the temperature measuring probe to measure the temperature of the target measuring point at the positioning position according to the set emissivity. According to the method, the emissivity of the temperature measurement probe is set according to the determined emissivity of the measured collecting ring, and the temperature measurement probe can accurately position the measurement part in combination with the laser aiming light and the designed special mounting bracket, so that the temperature measurement accuracy of the collecting ring is improved.

The invention discloses a contact and non-contact combined temperature rise data testing method, which relates to the field of temperature testing, and is characterized in that a contact temperature measurement result is corrected by using a temperature rise rate in non-contact temperature measurement according to contact and non-contact temperature measurement characteristics, and a non-contact temperature measurement result is corrected by using temperature rise data obtained by the contact temperature measurement. The influence of the thermal resistance between the test sensor and the tested object on the contact temperature measurement response rate and the influence of the test distance, the surface thermal emissivity of the tested object, smoke dust and the like on the non-contact temperature measurement precision are reduced, and a high-response accurate temperature test result is obtained.

A semiconductor manufacturing apparatus for processing one or more workpieces is provided. The device includes one or more components exposed to radio frequency energy or heat, and one or more optical contact temperature sensors disposed on the one or more components. A method for measuring a temperature of a component of a semiconductor manufacturing apparatus is also provided.

This connector 1 comprises: a terminal (10); a terminal holder (20); a contact temperature sensor (50); and a sensor holder (40) that holds the temperature sensor (50) and is mounted on the terminal (10). The sensor holder (40) has a terminal mounting part (42) attached to the terminal (10), a sensor retainer (49) that holds the temperature sensor (50) in a position that does not touch the terminal (10), and a heat transfer unit (41b) that transfers heat from the terminal mounting part (42) to the sensor retainer (49).

The utility model belongs to the technical field of test wire harnesses, particularly relates to an EOL test wire harness for monitoring contact temperature rise by test equipment, and aims to solve the problem that the temperature rise process is difficult to monitor in the test process of the EOL test wire harness provided by the background technology, and provides the following scheme: the EOL test wire harness comprises a connector frame body, one side of the inner wall of the connector frame body is fixedly connected with electrode plates which are symmetrically distributed, and the other side of the inner wall of the connector frame body is fixedly connected with a cable. According to the EOL test wire harness, the two layers of inner sheaths and the threaded pipe are additionally arranged outside the cable, so that the abrasion of the wire harness in the back-and-forth test process is reduced, the strength of the wire harness is improved, the service life of the EOL test wire harness is prolonged, and in a temperature rise monitoring mechanism, once the problem of poor contact occurs in the test process, the EOL test wire harness cannot be damaged. When a fire occurs, high temperature is generated near the first wiring terminal and the second wiring terminal and is sensed by the thermistor, so that the temperature change can be monitored in real time, the effect of timely early warning is achieved, and the possibility of fire occurrence is reduced.

1. The name of the design product: non-contact temperature sensor shell. 2. The use of the design product: used as a non-contact temperature sensor shell. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: Design 1 perspective view 1. 5. Design 1 is designated as the basic design.

An apparatus for non-contacting measurement of the temperatures of rotatable elements, such as prism elements of a Risley prism assembly, includes IR emissive patches applied to radially outward facing surfaces of the rotatable elements, reflective surfaces configured to axially reflect black body IR radiation emitted by the patches, IR sensors located behind the rotatable elements and configured to sense the reflected black body radiation, and a controller configured to receive data from the IR sensors and determine therefrom the temperatures of the rotatable elements. In embodiments, none of the IR sensors extends radially beyond a housing of the rotatable elements, and in some embodiments the IR sensors do not extend radially beyond a diameter of a largest of the rotatable elements. The apparatus can further include patches oriented axially rearward and associated IR sensors.

The invention relates to a temperature detection device and a silicon water temperature detection system. The movable part is provided with two opposite ends in the lengthwise direction of the movable part, and one end of the movable part is rotatably mounted on the main body part; the driving piece is in transmission connection with the main body piece and the movable piece, and the driving piece is used for driving the movable piece to rotate relative to the main body piece; and the temperature measuring assembly is mounted at the other end of the movable part, and a non-contact temperature sensor is arranged on the temperature measuring assembly. Through a non-contact temperature measurement mode, direct contact between the temperature sensor and high-temperature silicon water can be avoided, the sensor is prevented from being damaged due to direct contact with the high-temperature silicon water, and the service life of equipment is prolonged. The temperature sensor is driven by the driving part to realize multi-angle and multi-area detection of the silicon water, different positions of the silicon water in the ladle can be covered, local temperature difference can be effectively captured, complete data support is provided for judging the temperature uniformity of the silicon water, and process misjudgment caused by local data deviation is avoided.

1. Name of the Design Product: Infrared Thermal Imager. 2. Use of the Design Product: For non-contact temperature measurement. 3. Design Key Points of the Design Product: Lies in the shape. 4. Picture or Photograph Most Indicating the Design Key Points: 3D View 1 of Design 2. 5. Design 2 is designated as the basic design.

The present invention relates to a system and method for non-contact temperature measurement of a portion (3') of an object (3) coated with a layer of a luminescent material from the zinc oxide family. Using a light source (1) emitting in a wavelength range covering at least partially a range between 360 and 480 nm, and means for measuring light intensity as a function of wavelength (5) covering at least part of the range of the light source (1), the light intensity is measured as a function of the wavelength of radiation scattered by the portion of the object. Then, from the measurement of the light intensity as a function of wavelength, a value of at least one parameter is determined, and the temperature of the portion (3') of the object (3) is determined from the value of the parameter and a predetermined lookup table. Figure 2 to be published

The utility model discloses a temperature sensing assembly, an overtemperature prompting device and an internet data center system, and relates to the technical field of object temperature detection. The device comprises a temperature probe, one side of the temperature probe is provided with an elastic member, one side of the elastic member is provided with a mounting plate, and the mounting plate is provided with a fixing member on one side of the temperature probe; wherein the fixing piece is used for assisting in fixing the position of the temperature probe; the elastic piece comprises a guide rod, the guide rod penetrates through the guide hole of the mounting plate to be connected with a first limiting block, and the outer side of the guide rod is sleeved with a second spring; wherein one side of the spring II is in contact with one side of the mounting plate, and the other side of the spring II is in contact with one side of the temperature probe. Therefore, the tightness of the contact between the contact temperature sensor and the measured object is ensured.

To provide a non-contact temperature measuring device and a non-contact temperature measuring method that can simply and accurately execute measurement of the temperature of an object to be measured.SOLUTION: A non-contact temperature measuring device comprises: a light emitting unit (light source 18a) that emits measurement light LA toward a front face Wa; a light receiving unit (light receiving sensor 18b) that receives reflected light L2A of measurement light L1 reflected on the front face Wa, and reflected light L2B of the measurement light L1 reflected on a rear face Wb on the opposite side of the front face Wa of an object to be measured, and outputs a light reception signal; a thickness calculation unit 18c that, when the actual thickness of the object to be measured is defined as a first thickness (thickness Lv) and a thickness obtained by multiplying the first thickness by the refractive index of the object to be measured as a second thickness (thickness Lopt), calculates the second thickness on the basis of the light reception signal output from the light receiving unit; an object-to-be-measured information acquisition unit (wafer information acquisition unit 34) that acquires object-to-be-measured information (wafer information 29); and a temperature calculation unit 36 that calculates the temperature of the object to be measured on the basis of the second thickness and the object-to-be-measured information.SELECTED DRAWING: Figure 3

The invention relates to the field of semiconductor growth, and discloses a material growth temperature optimization method, device, equipment, program product and system, and the method comprises the steps: obtaining a preset growth temperature curve of a target material; at the at least one target growth time node, irradiating the target material growing on the substrate by using an electron beam to form a starting point of the defect in the target material; when the growth of the target material is finished, information of the defect corresponding to the target growth time node is obtained, and the information comprises the size and the shape of the defect; based on the information of the defect, the state of the set temperature corresponding to the target growth time node is determined, and the state comprises the high set temperature and the low set temperature; and based on the state, adjusting a set temperature corresponding to the target growth time node until the temperature of the growth surface of the target material on the substrate is stabilized at the target growth temperature. The problems that existing non-contact temperature control measurement is poor in repeatability and surface temperature judgment is not direct enough can be solved.

The present application relates to the field of test device, and provides a partitioned contact temperature cycle test bench for seal material performance, including a temperature control device, a support device and a drive device, where the temperature control device includes a first thermostatic module and a second thermostatic module, the first thermostatic module is provided with a first thermal conduction surface, the second thermostatic module is provided with a second thermal conduction surface, the first thermal conduction surface and the second thermal conduction surface enclose a receive cavity, and temperature of the first thermostatic module is different from temperature of the second thermostatic module; the support device supports a piece to be tested, the support device is rotatably provided in the receive cavity, the support device is provided with a thermal conduction portion, the thermal conduction portion is in contact with the piece to be tested, and the thermal conduction portion is in contact with any one of the first thermal conduction surface and the second thermal conduction surface; and the drive device drives the support device to rotate relative to the temperature control device. Such an arrangement solves the problem in the related art that the temperature cycle test device cannot alternately change rapidly in a wide temperature range.

The invention discloses a temperature measurement module, a temperature measurement device and a measurement method, and the temperature measurement module comprises an information collection module which comprises a temperature detection unit which is used for carrying out the contact-type temperature detection of a wafer; the coding unit is coupled with the temperature detection unit and is used for coding the analog electric signal corresponding to the temperature measurement result detected by the temperature detection unit into temperature information capable of being locally stored or a temperature signal capable of being wirelessly transmitted; and the far-end information receiving module and the information acquisition module are independently arranged, and the far-end information receiving module comprises a processing unit and is used for acquiring the temperature information stored locally or decoding the temperature signal into a temperature measurement result. According to the embodiment of the invention, the information acquisition module and the far-end information receiving module are independently arranged, and the temperature information of the wafer moving between different processing stations can be obtained, so that the integrity and accuracy of the obtained wafer temperature information are improved.

The present invention discloses a railway switch contact cover and operating method, which primarily addresses the current problems of high contact resistance and high rotational resistance of the moving contact caused by wear particles, dust, oil stains, and the like in the contact area between the moving contact ring and the static contact ring. The implementation method is as follows: first, the moving contact ring self-cleaning system is used to clean the switch's mobile contacts; second, the contact temperature control system is used to adjust the temperature of the contact area to prevent condensation; and finally, a contact resistance detection device is used to monitor the real-time changes in contact resistance, significantly reducing the maintenance and servicing workload for maintenance personnel on the switch's contacts. This railway switch contact cover and operating method has a simple structure and can clean foreign matter from its own contact ring area, thereby reducing contact resistance, reducing resistance to the moving contact ring coming out, preventing contact obstruction, and ensuring reliable connection of the contact circuit.

The invention provides a non-contact thermal diffusivity measurement method and device of an anisotropic thin film material, and relates to the technical field of thermal diffusivity measurement of thin film materials. The method comprises the following steps: performing beam expansion and shaping on continuously emitted stable laser, and performing dynamic beam shaping and focusing to obtain a laser beam form with variable spatial distribution; meanwhile, the center of the annular heating spot is accurately aligned with the geometric center of the film sample, and the size of the annular heat source is adjusted. A non-contact temperature sensing array is adopted, infrared radiation is synchronously sampled, space-time temperature distribution data of the surface of a film sample is obtained, a thermal simulation algorithm and a machine learning model are input, fitting and dynamic comparison optimization parameters are carried out, and a final anisotropic thermal diffusivity value is obtained through inversion. The method has the advantages of non-contact, quick response, accurate characterization and inversion of in-plane anisotropic thermal diffusivity parameters of the material and the like, and solves the problems of poor sample applicability, local high temperature points, high cost and the like.

To provide a fixation device that can achieve stable temperature control even right after a heating start of a fixing member.SOLUTION: According to an embodiment, a fixation device has: a fixing member; a heat source; a non-contact temperature sensor; a contact temperature sensor; a memory; and a controller. The memory is configured to store an ordinary correction value for making a detection temperature of the non-contact temperature sensor approximate to an actual temperature of the fixing member, and an additional correction value to set in responce to an average value of the detection temperature of the non-contact temperature sensor in a first period from print processing including fixation processing starts to a prescribed time. The controller is configured to control the heat source on the basis of a value correcting the detection temperature of the non-contact temperature sensor using the additional correction value in addition to the ordinary correction value in the first period, and control the heat source on the basis of a value correcting the detection temperature of the non-contact temperature sensor using the ordinary correction value in a second period after the first period has gone by.SELECTED DRAWING: Figure 3

The utility model relates to the technical field of sculpture processing equipment, in particular to an efficient coloring device for sculpture processing, which comprises a device main body, a bearing plate and a cylinder are respectively arranged at the bottom end in the device main body, a mounting seat is fixedly mounted at the top of the bearing plate, and a mounting cavity is formed in the mounting seat; a bearing disc is arranged at the top of the mounting base, a mounting groove is formed in the surface of the top of the bearing disc, an electric push rod is fixedly mounted on the rear side of the interior of the mounting groove, a clamping push block is fixedly arranged at the telescopic end of the electric push rod, and a spray gun is fixedly mounted on the right side of the device body; a temperature adjusting mechanism is arranged on the front side of the device main body, and through the arrangement of the efficient coloring device for sculpture processing, the purpose of adjusting the internal temperature of the device main body is achieved, a proper contact temperature between a sculpture and pigment is achieved, the coloring effect of the device on the sculpture is improved, and the processing quality of the sculpture is guaranteed.

The invention relates to the technical field of testing, in particular to a contact thermal resistance testing method and a thermal resistance testing device.The contact thermal resistance testing method comprises the following steps that S1, a heating piece with the preset temperature T2 DEG C is attached to the upper portion of a to-be-tested element, and a detection piece for measuring the contact temperature T1 DEG C and the heat flux Q is attached to the lower portion of the to-be-tested element; s2, measuring the numerical value of the interface thermal resistance Rimp by using a Fourier formula Rimp = (T1-T2) / Q; s3, inputting the heat conductivity coefficient lambda of the to-be-detected element, the macroscopic contact area S between the to-be-detected element and the detection piece and the thickness L of the to-be-detected element into a computer together, and calculating by using a formula Rimpp = 1 / lambda S * L + Rcon; s4, testing the interface thermal resistance Rimp under different thicknesses through a three-point method, and further obtaining the contact thermal resistance Rcon when L is equal to 0 through a linear regression method; 5, the slope of linear regression in the step 4 is 1 / lambda S, and the numerical value of the heat conductivity coefficient lambda of the material is obtained through inverse deduction.

The utility model relates to a contact temperature measurement sensor structure based on the RFID technology. The contact temperature measurement sensor structure comprises a shell, a metal base, an elastic sheet, an RFID temperature measurement circuit and a screw. Wherein a temperature probe is arranged on the RFID temperature measurement circuit, a probe slot is formed in the metal base, the RFID temperature measurement circuit is clamped between the shell and the metal base, the probe slot is used for accommodating the temperature probe, and the shell, the metal base, the elastic sheet and the RFID temperature measurement circuit are fixed into a whole through the screws. The contact temperature measurement sensor is small in structural size and convenient to mount and dismount, and is simple and convenient to dismount due to the fact that the buckle type mounting mode does not need redundant tools for mounting.

The utility model relates to a contact type temperature sensor, which belongs to the technical field of temperature sensors and comprises a mounting vertical plate, a plurality of sensor bodies are arranged on one side of the mounting vertical plate in a penetrating manner, a temperature measuring contact head is fixedly mounted at one end of each sensor body, and a flexible contact assembly is arranged at the other end of each sensor body. The flexible contact assembly comprises a limiting tail plate which is in threaded connection with one end, far away from the temperature measuring contact head, of the sensor body, the surface of the sensor body is sleeved with a flexible spring, and one side of the flexible spring is in contact with one side of the mounting vertical plate. According to the contact type temperature sensor, the through mounting hole is formed in one side of the mounting vertical plate, the corresponding number of sensor bodies are arranged in the through mounting hole in a penetrating mode according to needs, the temperature measuring contact head is pressed towards the detection surface through the flexible spring, the temperature measuring contact head is made to make contact with the irregular detection surface, and the detection accuracy is improved through multi-point detection.