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789 results about "Laser heating" patented technology

Method for achieving high-melting-point material 3D printing through nanometer ink together with laser melting

The invention discloses a method for preparing the nanometer ink through ceramics, metal, semiconductors, glass and other high-melting-point materials, carrying out 3D printing and utilizing the laser heating sintering in the process of printing to obtain 3D devices formed by combining the ceramics, the metal, the semiconductors and other composite. The method comprises the first step of processing raw materials needed to prepare the device into nanometer particles of 1-500nm, the second step of preparing the particles into ink jet printing ink, the third step of carrying out 3D printing by utilizing an improved ordinary ink printer and adopting the laser heating sintering in the process of printing, and the fourth step of achieving the melting and sintering molding of the nanometer particles. According to the method, micron-level precision devices with any complex shape can be directly prepared, the high surface energy of the nanometer particles is utilized, the sintering temperature is lowered, high density is achieved, and a superior property is obtained. The method can be used for manufacturing automobile metal ceramic composite pistons, aviation engine tail pipes, and ceramic bearings and ceramal composite precise components of watches and other precision instruments and for directly printing a circuit board.
Owner:南京鼎科纳米技术研究所有限公司

Laser heating rivetless riveting device

The invention relates to a laser heating rivetless riveting device in the technical field of automobile manufacturing. The laser heating rivetless riveting device comprises a compound punch pin, a compound blank holder, a compound lower die and a laser control system, wherein, the compound punch pin is sheathed with the compound blank holder, and the compound punch pin, a workpiece and the lower die are arranged coaxially from top to bottom; hollow circular holes are formed at the center parts of the compound punch pin and the compound lower die; optical fiber tubes and concave lenses are arranged in the hollow circular holes; grooves are formed in the surfaces of the compound blank holder and the compound lower die in contact with a panel veneer, and are used for laying out thermistors that are lead wires; and the lead wires are connected with a laser control system. The laser heating rivetless riveting device heats a forming area of riveting material through laser before riveting forming so as to improve the forming performance of material, prevents fragile material from being easy to crack and fracture during the riveting process, reduces the plastic deformation resistance of material at the same time, enables the panel veneer to deform fully during the forming process, is easy to get a rivet joint with better quality, and reduces the requirements on riveting force and rigidity of riveting equipment at the same time along with the reduction of plastic deformation resistance of material.
Owner:JILIN UNIV

Single-chip magnetic sensor, and laser heating-assisted annealing apparatus thereof and laser heating-assisted annealing method thereof

The invention discloses a single-chip magnetic sensor, and a laser heating-assisted annealing apparatus thereof and a laser heating-assisted annealing method thereof. The laser heating-assisted annealing method comprises the following steps: (a), annealing is carried out on a magnetic thin film in a strong magnetic field, so that magnetic moments on a pinning layer of the magnetic thin film are towards a same direction; (b), the magnetic thin film is fixedly disposed on a clamp of a movable platform; (c), a laser source is opened to emit a laser beam, which is attenuated through an optical attenuator; the direction of the attenuated laser beam is changed through a reflective mirror; and the laser beam with the changed direction is focused into a light spot by a focusing objective lens; (d), the movable platform is moved, in order that the focused light spot of the laser beam is aimed at the magnetic thin film so as to enable the magnetic thin film to be heated by the laser beam; (e), a magnetic field intensity of an electromagnet arranged on the movable platform is adjusted, so that a magnetic domain of the heating area of the magnetic thin film can be overturned; and (f), the magnetic thin film is cut into slices, and the slices of the cut magnetic thin film are bound into one.
Owner:MULTIDIMENSION TECH CO LTD

Laser packaged glass powder sealing material for photoelectric device packaging

The invention discloses a laser packaged glass powder sealing material for photoelectric device packaging, and belongs to the technical field of photoelectric device packaging. The sealing material is a combined material of laser packaged glass powder and high-temperature non-conductive ceramic powder added according to the proportion of 5 to 15%. All elements in the sealing material are easily available, so that the cost is low. The softening point of the packaged glass powder has the temperature of 420 to 450 DEG C and the coefficient of thermal expansion of 75*10 <-7>/DEG C. In the packaging of glass, the selection range of laser heating equipment is wider, the laser packaged glass powder sealing material adapts to various different packaging manners, the cost is lowered, and the efficiency is improved; the added ceramic powder plays a role in supporting frit bands, and the frit bands have relatively low flowability in packaging, the packaged bands are closer to the distribution of the frits in sedimentation, the displacement deformation generated in the frit heating process is easy to control to enable the packaged bands to be regular; the frit bands have no great displacement deformation, no remark air holes exit in the packaged bands, and the erosion of oxygen and moisture is blocked by the effective airtight.
Owner:SHANGHAI UNIV

Laser heating assisted turning device and method

The invention provides a laser heating assisted turning device and method. The laser heating assisted turning device comprises a turning device body, a laser device, a non-contact temperature measuring device and a control device, wherein a tool and a workpiece are fixed to the turning device body, the tool is detachably connected with the turning device body, the laser device is used for heating the workpiece through laser, the non-contact temperature measuring device is used for acquiring the temperature at the cutting position of the workpiece in real time, and the control device is used for comparing data of an optimum temperature field stored in the control device with temperature data acquired by the non-contact temperature measuring device in real time and controlling the laser device to adjust laser parameters so as to achieve the optimum temperature field if difference exists. The laser heating assisted turning device has the advantages that the laser parameters are adjusted in a data matching mode so that the temperature field at the cutting position of the workpiece can be always consistent to the optimum temperature field, the cutting performed in the temperature field makes the service life of the tool longest, the machined surface quality of the workpiece is the best, and the turning efficiency is the highest.
Owner:HARBIN INST OF TECH
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