184 results about "Thermopile" patented technology

The invention relates to the technical field of active testing of circuit breakers, discloses an active testing method and system for a circuit breaker, and is used for solving the problem that an existing active testing method is difficult to realize self-adaptive adjustment of a threshold value. Time-frequency analysis is carried out on the contact speed signal to extract time domain and frequency domain features, and heat flow analysis of the thermopile array is combined to obtain a heat engine coupling feature vector; a thermo-electro-mechanical coupling dynamic graph with the sensors and the components as nodes and the reciprocal of thermal conductance as the edge weight is constructed, the structure is updated in real time, and node drift is predicted through a graph convolutional network; fusing the environment derating and the predicted drift amount to adaptively adjust a threshold value; extracting a thermoelectric coupling component of a contact speed fast change component and a heat flow refraction angle change rate, and generating a reversed polarity pulse compensation signal to suppress interference; time synchronization, closed-loop feedback of data and threshold adjustment results are realized through secondary alignment of IEEE1588 and the cloud, graph model node weight and threshold rules are dynamically updated, synchronization with equipment health degree is ensured, and accurate early warning and protection are realized.

The invention relates to the technical field of infrared sensors, in particular to a monolithic integrated MEMS out-of-plane thermopile chip and a preparation method thereof, and the thermopile chip comprises a substrate, and a bottom electrode, a thermocouple array, a top electrode and an optical radiation absorption layer which are sequentially arranged on the substrate; the thermocouple array is vertically arranged on the bottom electrode; the thermocouple array comprises a plurality of thermocouple pairs, and each thermocouple pair comprises an N-type thermocouple and a P-type thermocouple; the N-type thermocouple and the P-type thermocouple form a current and heat flow loop in an electric series connection and heat parallel connection mode. According to the invention, the bismuth telluride-based thermoelectric material with low thermal conductivity and high Seebeck coefficient difference is used as the thermocouple material of the out-of-plane thermopile chip, the heat conduction path of the out-of-plane thermopile chip is more direct, the temperature difference in the vertical direction can be directly utilized, and the higher response speed and high sensitivity are expected to be realized due to the more efficient thermal gradient.

The invention discloses a multi-channel high-precision three-dimensional microcalorimeter, and belongs to the technical field of microcalorimeters, the multi-channel high-precision three-dimensional microcalorimeter comprises a support block, a furnace body is arranged above the support block, a heat insulation layer is arranged in the furnace body in sequence, a heating cylinder is arranged in the heat insulation layer, a heat uniformizing block is arranged in the heating cylinder, and the heat uniformizing block is arranged in the furnace body. The device comprises a heat uniformizing block, a heat measuring cavity is formed in the heat uniformizing block, a heat uniformizing block temperature sensor is arranged at the circle center of the heat measuring cavity, a plurality of heat measuring channels are arranged in the heat measuring cavity around the circle center of the heat uniformizing block at equal intervals, the distances between every two adjacent heat measuring channels are the same, and three-dimensional thermopiles are arranged on the outer walls of the heat measuring channels in a sleeving mode. The number of the heat measuring channels is at least three. According to the multi-channel high-precision three-dimensional microcalorimeter, multiple channels are arranged, multiple groups of experiments, especially comparative experiments, can be carried out at the same time, the experiment efficiency can be greatly improved, and the research and development progress of scientific researchers is accelerated.

The invention provides a curved-surface conformal wireless passive heat flow sensor and a preparation method thereof, and belongs to the technical field of high-temperature sensors. The heat flow sensor comprises a metal wire, a silicon carbide substrate, a sensitive layer and a thermal resistance layer which are sequentially arranged from bottom to top; the sensitive layer comprises a thermopile, an inductor, a capacitor and a microstrip antenna which adopt an ink direct writing process and are made of metal, one end of the thermopile is connected with the capacitor, and the microstrip antenna and the inductor are connected with the other end of the thermopile; the thermal resistance layer is provided with at least one opening to expose a thermal junction of the thermopile; the metal wire connects the inductor and the capacitor to form a resonant circuit. The whole heat flow sensor is flexible, can be adaptively attached to the surface of a curved part, has the characteristic of high temperature resistance, realizes wireless and passive transmission of heat flow signals, and solves the problems that the lead is difficult to lead and the lead is easy to break in a high-temperature and high-rotation environment.

The invention belongs to the technical field of integrated circuit design, and particularly relates to a flexible thermoelectric flow velocity sensor for surface flow field monitoring, which comprises a flexible substrate, and a central heating circuit and a thermopile arranged on the flexible substrate, wherein the thermopile surrounds the periphery of the heating circuit, and a thermoelectric junction close to the heating circuit and a thermoelectric junction far away from the heating circuit are formed. The structure of the central heating circuit and the surrounding thermopile is adopted, the temperature difference output voltage generated by the heating circuit and the flow field is utilized to measure the flow velocity, and the use scene of the sensor is expanded through the arrangement of the flexible substrate.

The invention discloses a chromium-doped indium oxide-based high-temperature heat flux sensor and a preparation method thereof, a screen printing technology is adopted, a slurry formula and printing process parameters are optimized, a thermopile structure is accurately formed on a high-temperature-resistant ceramic substrate, and then a thermopile and a thermal resistance layer are subjected to step-by-step high-temperature sintering treatment, so that the chromium-doped indium oxide-based high-temperature heat flux sensor is obtained. And firm combination between the thin film and the substrate and densification of a microstructure are ensured. The finally prepared sensor has excellent high-temperature oxidation resistance and long-term working stability, is stable and reliable in thermoelectric output signal, meets the strict requirements of aerospace, energy power and other fields on high-temperature heat flow measurement, is suitable for heat flow monitoring in high-temperature combustion environments, high-speed pneumatic heating and other scenes, and has wide application prospects. And a reliable test means is provided for design and performance evaluation of the thermal protection system in an extreme environment.

The invention discloses a high-power thin film thermopile laser power meter and a preparation method thereof, and relates to the technical field of laser detection equipment. The high-power thin-film thermopile laser power meter comprises a thermopile chip and a heat sink packaging shell, the thermopile chip comprises a substrate, a thermopile layer is arranged on the substrate, the thermopile layer comprises a plurality of thermocouple lines, the adjacent thermocouple lines are connected in series, the thermocouple lines are distributed in a square shape, the thermocouple lines are distributed in a step shape, and the thermopile chip is connected with the heat sink packaging shell. And a cold end thermal resistance layer and a hot end thermal resistance layer are respectively arranged above the cold end and below the hot end of the thermopile layer. The structure of the thermopile is optimized, the heat transfer path in the thermopile chip is regulated and controlled, the stability of the thermopile chip in a low laser power test is improved, the preparation process is improved, and the cost is reduced. The problems that an existing thin film thermopile laser power meter is low in sensitivity and poor in stability during low-power measurement, and a thermopile chip is prone to aging and poor in stability during high-power density measurement are effectively solved.

The invention discloses a comprehensive test system and method for clothing radiation and convection heat dissipation mechanism research, and belongs to the technical field of clothing thermal performance tests.The comprehensive test system comprises a thermal dummy model, an environment control module, a data acquisition module and a signal processing module, and the thermal dummy model simulates human physiological characteristics according to requirements to adjust the body surface temperature; the partitioned thermal control units are used for independently controlling the temperature of a trunk and four limbs; the environment control module comprises a wind tunnel system and a temperature and humidity bin. The data acquisition module is composed of an infrared thermal imager array and a thermopile sensor group embedded into the surface of the dummy; the signal processing module is integrated with a multi-channel data synchronizer and an intelligent algorithm unit, the time synchronization precision of the multi-channel data synchronizer is smaller than or equal to 1ms, and the multi-channel data synchronizer is used for dynamically separating the radiation heat dissipation amount Qrad and the convection heat dissipation amount Qconv. According to the invention, multi-parameter synchronous measurement is adopted, information acquisition mechanisms such as infrared, thermopile and micro differential pressure sensors are integrated, and accurate separation of radiation and convection heat dissipation is realized.

The application provides a MEMS differential thermal analysis sensor and a DTA / DSC testing method, the sensor comprising a detection thermocouple, a reference thermocouple, an ambient resistance and a shielding ring, wherein the detection thermocouple and the reference thermocouple each comprise a single crystal silicon substrate, a heat insulation cavity, a plurality of single crystal silicon thermocouple pairs and a supporting film, the heat insulation cavity is located in the single crystal silicon substrate, the plurality of single crystal silicon thermocouple pairs are connected in series and are supported by the supporting film to be suspended above the heat insulation cavity to achieve thermal isolation, and the single crystal silicon thermocouple pair comprises an N-type single crystal silicon thermocouple and a P-type single crystal silicon thermocouple connected in series, the temperature and power sensitivity of the sensor are significantly improved, reach 28 mV / K and 100 V / W, and the noise equivalent temperature difference and the noise equivalent power reach 0.5 mK or 0.2 muW. Based on the output signal of the sensor, differential thermal analysis testing and differential scanning calorimetry testing on physical or chemical processes of material heat absorption and release can be realized, the sample consumption is small, and the testing precision is high.

The invention relates to the field of new energy batteries, and discloses a new energy battery temperature monitoring control method comprising the following steps: deploying a multi-mode sensor array comprising a nanowire thermopile, a terahertz time-domain spectroscopy system and a flexible film temperature sensor; constructing a non-local heat conduction model, and introducing a heat flow relaxation time term and a non-local diffusion term to correct the traditional Fourier law; establishing a jump diffusion type stochastic differential equation of a microscopic heat source, and quantifying the randomness of lithium ion flux fluctuation and thermal runaway triggering; the optimal layout of the sensor is determined through a topological optimization algorithm, and the temperature field reconstruction error and the hardware cost are minimized. Through the cross-scale sensing fusion of the nanowire thermopile and the terahertz spectrum, the limitation of traditional single-point temperature measurement is broken through, and millisecond-level capture of the thermal behavior of an electrode-electrolyte interface microcell is realized. Compared with a method depending on surface temperature extrapolation in the prior art, the problem that microcosmic heat source recognition precision is insufficient is effectively solved, and the early-stage thermal runaway early warning capacity is remarkably improved.

The invention relates to the technical field of body temperature monitoring, in particular to a non-contact infrared body temperature monitoring chip and a self-adaptive noise suppression system, comprising the following modules: an infrared signal acquisition module for receiving an infrared signal radiated by a human body and converting the infrared signal into a weak electric signal, adopting a thermopile sensor array and having a response wavelength range of 8-14 [mu] m; the pre-amplification module is connected with the infrared signal acquisition module and used for primarily amplifying the weak electric signals, a low-noise operational amplifier is adopted, and the noise density is smaller than or equal to 1.5 nV / Hz; the noise feature analysis unit adopts a time-frequency conjoint analysis algorithm, extracts time-varying feature parameters of noise in real time through short-time Fourier transform (STFT), realizes fine separation of noise in different frequency bands in combination with a wavelet packet decomposition technology, can identify and suppress various complex noise such as 50Hz / 60Hz power frequency interference, switching power supply ripple noise, ambient light flicker noise and the like, and is high in practicability. And the system can still keep the measurement precision of + / -0.1 DEG C in an ICU environment with dense medical equipment.

The present application relates to a kind of ion polymer-based thermoelectric pile heat flux sensor device, the thermoelectric pile heat flux sensor includes in turn: first protective layer, first connecting circuit, thermal resistance layer, thermoelectric element, second connecting circuit and second protective layer, wherein the thermoelectric element is embedded in the thermal resistance layer and is made of ion conductor with free ion as main carrier. Since ion conductor has huge thermoelectric potential, only a few pairs of ion thermoelectric column need to be integrated to obtain the required thermoelectric voltage with the required sensitivity.

Wearable devices capable of measuring a core body temperature and other vital signs of a user in a range of situations are described herein. The wearable device is arranged to be retained within the ear canal of the ear, in order to prevent the wearable device from inadvertently removing itself from the ear. Providing an infrared thermopile at the innermost end of the ear insert ensures that the infrared thermopile is provided as close as possible to the tympanic membrane which will be used to provide an indication of the core body temperature.

The utility model discloses a kind of optical multi-channel gas sensors based on NDIR principle, it is related to infrared gas sensor technical field;By infrared light source, air chamber, four-channel thermoelectric detector composition infrared absorption light system, light source voltage stabilizing modulation circuit, thermoelectric weak signal conditioning circuit, high-precision analog-digital conversion circuit, single-chip microcomputer control and communication circuit system composition, the utility model realizes compact structure, the function of the real-time measurement of multiple gas;Realize low-noise zero drift self-stable signal processing circuit, design low-power 24-bit sampling circuit, accurate real-time digital signal can be obtained without complex data processing algorithm, the utility model design has the characteristics such as wide range, high precision, good stability, long life, miniaturization, simultaneously replace sensor end can measure multiple types of gas, solve the problem that traditional infrared optical gas sensor is high in cost, bulky inconvenient to carry, detection result is time-consuming long precision is susceptible to environmental interference.

The application discloses a kind of thermoelectric array and depth camera joint calibration method and system.The application can be simultaneously detected by thermoelectric array and depth camera with spherical calibration object, and the spherical center of the spherical calibration object is used as feature point;The spherical calibration object is set to the position so that the temperature field observed by the thermoelectric array has central symmetry;Change the space pose of the spherical calibration object and synchronously collect the first coordinate set of the spherical center in the thermoelectric array coordinate system and the second coordinate set in the depth camera coordinate system;Based on the first coordinate set and the second coordinate set, the spatial transformation relationship between the thermoelectric array and the depth camera is solved.By the application, the thermoelectric array image coordinates are not dependent on detection, but rely on aiming at a specific location, and use temperature measurement symmetry, aiming accuracy is much higher than detection, so high-precision thermoelectric array image coordinates are obtained.

The present application discloses an improved thermopile laser sensor apparatus and methods of use. In one embodiment, the apparatus includes a sensor body having a first sensor body recess and a second sensor body recess formed therein, with a substrate positioned in the first sensor body recess in thermal communication with the sensor body. The substrate includes at least one absorber attached thereto and configured to absorb a portion of a beam of laser energy. A first thermal sensor in thermal communication with the substrate and the sensor body may be formed on or attached to the substrate. A second thermal sensor in thermal communication with the sensor body may be positioned in the second sensor body recess. A thermal barrier configured to reduce the rate of transfer of thermal energy from the substrate to the second thermal sensor may be positioned between the substrate and the second thermal sensor.

The application discloses a blackbody-thermoelectric pile cooperative thermistor multi-temperature-point zero-point matching calibration method. The method utilizes the Seebeck effect of the thermoelectric pile, establishes the accurate corresponding relationship of the blackbody standard temperature-thermistor resistance value through zero-point matching, carries out dynamic temperature scanning on different calibration point temperatures of the cavity, and obtains the thermistor parameters of multiple temperature points. Finally, the accurate R-T curve is fitted through the least square method. The method innovatively calibrates the thermistor through the blackbody heat radiation mode. The method does not need to disassemble the instrument, does not damage the stability of the original system, can complete the rapid calibration of the instrument on site, effectively reduces the calibration cost, and guarantees the temperature calibration accuracy and the calibration effect.

The present invention provides a highly sensitive thin-film thermopile heat flux meter, comprising a substrate; a lower thermal resistance layer disposed on the substrate; a thermopile thin film formed by overlapping multiple pairs of thermocouples end to end, disposed on the lower thermal resistance layer. Each pair of thermocouples comprises a positive thermocouple and a negative thermocouple connected in series, with the positive and negative thermocouples connected in a stepped manner. The lower thermal resistance layer covers below the hot junction where the positive and negative thermocouples are connected. An upper thermal resistance layer is disposed on the thermopile thin film and covers above the cold junction where the positive and negative thermocouples are connected. The two ends of the thermopile thin film are connected through positive and negative thermopile lead terminals, respectively. The negative and positive thermopile lead terminals are connected to form a thermocouple, and a temperature signal is measured through the lead terminals. The present invention can achieve transient measurement of temperature and heat flux density and has the advantages of fast response and high sensitivity.

The application discloses a thermoelectric pile structure for calibrating a far ultraviolet ultraviolet detector based on MEMS, which comprises a silicon substrate, a support layer, an absorption layer, a thermocouple pair, aluminum wires, aluminum electrodes and a single crystal silicon material structure on the silicon substrate. The double-layer thermocouple stacking structure is adopted to improve the device duty ratio, more thermocouple pairs can be laid in the case of keeping the size of the one-layer structure unchanged, and the response rate of the detector is improved. The circular structure conforms to the distribution trend that the temperature is radially diffused from the center of the absorption layer to the periphery in a decreasing manner, the hot end of the thermocouple pair can be closer to the area with higher temperature, the temperature of the hot end of the thermocouple pair is more uniform, and the response rate of the detector is improved. The radiant energy of the far ultraviolet ultraviolet radiation source is converted into an output thermoelectric electromotive force, a mathematical model of Fourier's law and the Seebeck effect is established for calculation, and the heat flux density of the far ultraviolet ultraviolet radiation source is measured.

This invention relates to a miniature sensor for engine ignition monitoring based on a thermopile infrared sensor. It includes: a housing, a thermopile infrared detector, and a power module, a main control unit, and a communication unit disposed within the housing. The main control unit is an FPGA chip containing an ARM processor and a SOC core. The power module is connected to the thermopile infrared detector, the main control unit, and the communication unit, respectively, to provide voltages for the corresponding parameters of each device. The communication unit is connected to the main control unit to send monitoring commands and the target area for engine ignition monitoring. The infrared detector is connected to the main control unit, and the main control unit controls the infrared detector to monitor the ignition plume within the target area based on the monitoring commands to obtain raw measurement data. The main control unit is also used to calculate the raw measurement data and determine the engine ignition state based on the calculation results. The miniature sensor designed in this application is lightweight, small in size, and can quickly monitor the engine ignition state.

The invention relates to a high-sensitivity MEMS flow sensor and a manufacturing method thereof.The high-sensitivity MEMS flow sensor comprises a sensor chip, a metal base and a measuring runner, the sensor chip comprises a substrate, and a porous silicon area is formed in the substrate; the first dielectric layer is formed on the substrate and the upper surface of the porous silicon region; the heating resistor array is formed on the upper surface of the first dielectric layer and is positioned right above the porous silicon region; the thermopile array is formed on the upper surface of the first dielectric layer and located over the porous silicon area, and the thermopile array and the heating resistor array are alternately arranged in the direction of the gas flow channel; the electric isolation layer covers the heating resistor array and the thermopile array; the metal interconnection structure is formed on the upper surface of the electric isolation layer and is connected with the thermopile array; the electrode is connected with the metal interconnection structure; and the second dielectric layer covers the electrical isolation layer and the metal interconnection structure. A multi-pair symmetrical distribution structure in which the thermopiles and the heaters are alternately arranged is adopted, so that the measurement sensitivity of the flowmeter is remarkably improved.

A temperature sensing system includes absolute temperature sensor(s) and / or thermopiles that form concentric geometries and are uniform in height. In some examples, the temperature sensing system can determine internal body temperature and / or ambient temperature based at least on a thermal gradient associated with the inner thermopile, a thermal gradient associated with the outer thermopile, a lateral temperature difference between the inner and the outer thermopiles, and an absolute temperature. In some examples, the temperature sensing system can determine the internal body temperature and / or ambient temperature using at least four absolute temperature sensors forming a concentric structure.

The application discloses an infrared thermoelectric detector and a manufacturing method thereof, and belongs to the technical field of temperature sensing. The infrared thermoelectric detector comprises a substrate, a first thermocouple layer, a sacrifice layer and a second thermocouple layer are sequentially arranged on the substrate, and a vacuum heat insulation cavity is arranged in the sacrifice layer. The manufacturing method of the infrared thermoelectric detector comprises the following steps: preparing the vacuum heat insulation cavity in the sacrifice layer; etching the sacrifice layer to form a plurality of standby groove structures and a plurality of micropore arrays, the micropore array is a plurality of holes arranged on the top surface or the bottom surface of each standby groove structure, and the micropore array and the standby groove structure form a communication structure; and in a vacuum environment, a filling layer is deposited in the sacrifice layer, the communication structure is not completely filled, and at least one vacuum cavity is formed. Through the infrared thermoelectric detector with the vacuum heat insulation cavity, the response rate and the detection rate of the thermoelectric detector are effectively improved, and the resolution and the sensitivity of the detection result in the laser power measurement application are improved.

The application discloses a thermal type wind speed and direction sensor based on thermistors and thermoelectric piles and a working method thereof. The sensor structure comprises a thermistor, a thermoelectric pile, a heating resistor, a silicon substrate and a measurement and control IC. The heating resistor is square and located at the center of the substrate. Four thermistors and a thermoelectric pile parallel to the side edges of the heating resistor are distributed on the four sides of the heating resistor. The four parallel thermistors are connected to form a Wheatstone full-bridge temperature measurement structure, and the two parallel thermoelectric piles are connected to form a thermoelectric pile temperature measurement structure. The measurement and control IC is distributed at the four corners of the substrate and connected to the temperature measurement structure formed by the heating resistor, the thermoelectric pile and the thermistor, and is used for driving the detection structure and processing the output signal thereof. The application adopts a CMOS process, and the thermistor and the thermoelectric pile structure are redundant to each other, so that the wind speed and direction detection precision can be improved.

The disclosure provides a temperature sensing device including a thermopile sensing assembly with a metal sleeve and a metal grid for blocking microwave from entering the thermopile sensor and influencing temperature detection. The temperature sensing device includes one or more than one thermopile sensing elements, an ambient temperature sensor, a signal processing chip, and an infrared lens providing narrow FOV. When dual thermopile sensing elements are used, one is active unit with narrow FOV for measuring the infrared radiation of the object to be detected, and the other one is a dummy unit for the compensation of the thermal shock to achieve the purpose of accurate temperature detection. The disclosure also provides the visible light source to indicate the sensing area of the thermopile sensor, that may facilitate the user positioning the object to be heated. FOV of the light source is the same with that of the thermopile sensor.

The embodiment of the application discloses an alcohol gas concentration sensor which comprises a reflecting tube, a light source assembly and a detection assembly. When in use, alcohol gas exhaled in a vehicle enters the tube through a long air inlet hole of the reflecting tube, and the light source assembly emits light. The light repeatedly reflects on the inner wall of the metal reflecting tube to prolong the light path, and fully contacts the alcohol gas in the reflecting tube. The alcohol absorbs specific band infrared light. The remaining light reaches another end thermocouple sensor. The thermocouple sensor distinguishes the target infrared band, converts the light intensity change into an electric signal, and the control circuit board collects the electric signal and performs calculation and conversion, and finally outputs the real-time alcohol gas concentration value.

This utility model provides a fault location device for low-voltage engineering, relating to the field of low-voltage engineering technology. It includes a main body for the fault location device, with an annular base at the top and three sensor groups mounted on the annular base. A telescopic rod is located at the bottom of the main body, and a folding arm is hinged to one side of the main body. The device employs a three-layer stacked design of a high-frequency electromagnetic induction coil, an infrared thermopile, and a Hall effect sensor, combined with a triangulation algorithm, to improve fault location accuracy to ±2%, far exceeding the ±8% to 10% accuracy of traditional equipment. Furthermore, the annular base is driven by a stepper motor and, in conjunction with a magnetic encoder, achieves 360° high-precision rotation scanning, avoiding errors caused by manual movement, making it particularly suitable for detecting narrow or concealed wiring.

An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses estimated air temperature based on inside temperature, wrist temperature from thermopile sensor plus the ratio of the thermal resistance between watch case to air and the thermal resistance between thermopile sensor to watch case, and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

The present invention provides a fan-out wafer-level packaging structure and packaging method for an infrared thermopile chip. The structure includes: an infrared thermopile chip having a solder pad; a first infrared-transparent substrate, the infrared thermopile chip being bonded to a groove in the first substrate; a second infrared-transparent substrate bonded to the first substrate; a metal connection column extending through the second substrate and connected to the solder pad; a rewiring layer formed on the second substrate, electrically connected to the metal connection column, the rewiring layer having an opening area facing the photosensitive area of ​​the infrared thermopile chip; and metal bumps formed on the rewiring layer. By simultaneously bonding multiple infrared thermopile chips to the same substrate and then packaging them into a fan-out wafer-level package, the package size is greatly reduced, saving packaging costs. Furthermore, both the first and second substrates are made of infrared-transparent materials, enabling double-sided light transmission of the package, thereby increasing the package's application range and flexibility.

The invention discloses a variable-temperature PCR (polymerase chain reaction) temperature adjusting device based on an MEMS (micro-electromechanical system) thermopile technology, which comprises a radiator, a first base is fixedly mounted on a radiating contact surface of the radiator, a cold panel is fixedly mounted on the upper surface of the first base, and a first film is fixedly mounted on the lower surface of the cold panel and positioned on the inner side of the first base. The variable-temperature PCR temperature adjusting device based on the MEMS thermopile technology has the advantages of being low in heating power, short in response time, small in heat loss, compatible with the CMOS technology, easy to integrate with other microelectronic devices and the like, an integrated fluorescent PCR detection chip of a micro electro mechanical system (MEMS) is used for detecting the temperature of the temperature-variable PCR temperature adjusting device, and the temperature-variable PCR temperature adjusting device based on the MEMS thermopile technology has the advantages of being low in heating power, short in response time, small in heat loss, compatible with the CMOS technology, easy to integrate with other microelectronic devices and the like. A microfluidic reaction cavity, a temperature control module and an optical detection system are highly integrated on a single chip platform, so that the integrated operation of nucleic acid amplification and fluorescence signal detection is realized. Microminiaturization and integration of PCR fluorescence detection are achieved through the MEMS technology, the detection efficiency is remarkably improved, the cost is reduced, and the method is suitable for the field of POCT and precision medical treatment.