333 results about "Thermopile" patented technology

The invention relates to the technical field of active testing of circuit breakers, discloses an active testing method and system for a circuit breaker, and is used for solving the problem that an existing active testing method is difficult to realize self-adaptive adjustment of a threshold value. Time-frequency analysis is carried out on the contact speed signal to extract time domain and frequency domain features, and heat flow analysis of the thermopile array is combined to obtain a heat engine coupling feature vector; a thermo-electro-mechanical coupling dynamic graph with the sensors and the components as nodes and the reciprocal of thermal conductance as the edge weight is constructed, the structure is updated in real time, and node drift is predicted through a graph convolutional network; fusing the environment derating and the predicted drift amount to adaptively adjust a threshold value; extracting a thermoelectric coupling component of a contact speed fast change component and a heat flow refraction angle change rate, and generating a reversed polarity pulse compensation signal to suppress interference; time synchronization, closed-loop feedback of data and threshold adjustment results are realized through secondary alignment of IEEE1588 and the cloud, graph model node weight and threshold rules are dynamically updated, synchronization with equipment health degree is ensured, and accurate early warning and protection are realized.

The invention discloses an MEMS-based two-dimensional heat conduction type gas sensor and a manufacturing method thereof, and belongs to the technical field, gas molecules in a surrounding environment are heated through a thermopile, and the flow velocity information of gas is converted into electric signal change for measurement through different heat capacity characteristics of the gas molecules, so that the measurement accuracy is improved. The defects of single detection direction, high power consumption, poor measurement precision, low sensitivity, large temperature drift and the like of a low-end thermal conductivity sensor are overcome, the thermal conductivity sensor is adopted, the content of various gases in mixed gas is measured by utilizing different thermal conductivities of various gases, the cost is low, and the sensitivity is high; the silicon-based substrate and the heating resistor assembly enable the sensor to accurately sense gases with different heat conductivities, so that accurate gas detection is provided; the manufacturing process ensures the accuracy of the sensor structure and the manufacturing consistency, and the design and material selection of the sensor enable the sensor to be suitable for various environments and suitable for industrial application.

The invention relates to the technical field of infrared sensors, in particular to a monolithic integrated MEMS out-of-plane thermopile chip and a preparation method thereof, and the thermopile chip comprises a substrate, and a bottom electrode, a thermocouple array, a top electrode and an optical radiation absorption layer which are sequentially arranged on the substrate; the thermocouple array is vertically arranged on the bottom electrode; the thermocouple array comprises a plurality of thermocouple pairs, and each thermocouple pair comprises an N-type thermocouple and a P-type thermocouple; the N-type thermocouple and the P-type thermocouple form a current and heat flow loop in an electric series connection and heat parallel connection mode. According to the invention, the bismuth telluride-based thermoelectric material with low thermal conductivity and high Seebeck coefficient difference is used as the thermocouple material of the out-of-plane thermopile chip, the heat conduction path of the out-of-plane thermopile chip is more direct, the temperature difference in the vertical direction can be directly utilized, and the higher response speed and high sensitivity are expected to be realized due to the more efficient thermal gradient.

The invention discloses a multi-channel high-precision three-dimensional microcalorimeter, and belongs to the technical field of microcalorimeters, the multi-channel high-precision three-dimensional microcalorimeter comprises a support block, a furnace body is arranged above the support block, a heat insulation layer is arranged in the furnace body in sequence, a heating cylinder is arranged in the heat insulation layer, a heat uniformizing block is arranged in the heating cylinder, and the heat uniformizing block is arranged in the furnace body. The device comprises a heat uniformizing block, a heat measuring cavity is formed in the heat uniformizing block, a heat uniformizing block temperature sensor is arranged at the circle center of the heat measuring cavity, a plurality of heat measuring channels are arranged in the heat measuring cavity around the circle center of the heat uniformizing block at equal intervals, the distances between every two adjacent heat measuring channels are the same, and three-dimensional thermopiles are arranged on the outer walls of the heat measuring channels in a sleeving mode. The number of the heat measuring channels is at least three. According to the multi-channel high-precision three-dimensional microcalorimeter, multiple channels are arranged, multiple groups of experiments, especially comparative experiments, can be carried out at the same time, the experiment efficiency can be greatly improved, and the research and development progress of scientific researchers is accelerated.

A thermal insulation performance testing device of a thermal insulation material comprises a heat flow meter, a cold plate, a hot plate, a temperature control system and a data acquisition system. The micro thermopile heat flow meter accurately detects the heat flow change of a sample in real time through an array thermocouple sensor, and provides heat flow data with high sensitivity and quick response. The temperature control system monitors the environment temperature, and the stability in the testing process is ensured. And the data acquisition system records the detection result in real time and optimizes the whole detection process through intelligent control. The automatic design in the embodiment enables the equipment to realize efficient batch detection, reduces manual intervention, improves the working efficiency and testing precision of a production line, and is suitable for testing the heat conductivity and heat flow performance of the thermal insulation material in large-scale industrial production.

The utility model discloses a high-temperature specific heat capacity tester which comprises a main control cabinet, a heating device, a connecting sleeve and a detection device, the heating device is fixedly installed on the detection device through the connecting sleeve, the detection device is fixedly installed on the main control cabinet, the heating device comprises an electric furnace, a test sample is hung in a heating hearth through a high-temperature-resistant wire to be heated, and the electric furnace is connected with the electric furnace. The detection device comprises an outer box body connected with the connecting sleeve, a constant-temperature heat insulation screen cover is installed in the outer box body, a temperature-controllable heat insulation screen cover is installed in the constant-temperature heat insulation screen cover through an insulation support, a heat measuring block is installed in the temperature-controllable heat insulation screen cover through an insulation support, and an electric heating tube and a thermocouple are arranged on the heat measuring block. A heating resistance wire is arranged on the side wall of the temperature-controllable heat insulation shield, a temperature difference thermopile is arranged between the heating resistance wire and the calorimetric block, and a copper pipe used for introducing constant-temperature hot water is wound on the side wall of the constant-temperature heat insulation shield. The high-temperature specific heat capacity tester disclosed by the utility model is high in measurement precision, simple to operate and small in size.

The invention provides a curved-surface conformal wireless passive heat flow sensor and a preparation method thereof, and belongs to the technical field of high-temperature sensors. The heat flow sensor comprises a metal wire, a silicon carbide substrate, a sensitive layer and a thermal resistance layer which are sequentially arranged from bottom to top; the sensitive layer comprises a thermopile, an inductor, a capacitor and a microstrip antenna which adopt an ink direct writing process and are made of metal, one end of the thermopile is connected with the capacitor, and the microstrip antenna and the inductor are connected with the other end of the thermopile; the thermal resistance layer is provided with at least one opening to expose a thermal junction of the thermopile; the metal wire connects the inductor and the capacitor to form a resonant circuit. The whole heat flow sensor is flexible, can be adaptively attached to the surface of a curved part, has the characteristic of high temperature resistance, realizes wireless and passive transmission of heat flow signals, and solves the problems that the lead is difficult to lead and the lead is easy to break in a high-temperature and high-rotation environment.

The invention discloses a thermopile detector and a spectrum detector, relates to the technical field of spectrum detection, and provides a high-precision, high-performance, real-time and low-cost spectrum detection technical scheme. The thermopile detector comprises a substrate structure, a thermoelectric conversion structure and a phase change metamaterial structure, the thermoelectric conversion structure comprises a micro-heating structure and a thermocouple structure, the thermocouple structure is arranged on the substrate structure, the micro-heating structure is arranged above the thermocouple structure, and the phase change metamaterial structure is arranged above the micro-heating structure. The phase change metamaterial structure is used for absorbing light in a target wavelength range under the regulation and control of the micro-heating structure, converting the absorbed light energy into heat energy and transmitting the heat energy to the thermocouple structure, and the thermocouple structure is used for sensing first heat energy output by the micro-heating structure and second heat energy output by the phase change metamaterial structure; and the first heat energy and the second heat energy are converted into electric energy to be output.

The invention belongs to the technical field of integrated circuit design, and particularly relates to a flexible thermoelectric flow velocity sensor for surface flow field monitoring, which comprises a flexible substrate, and a central heating circuit and a thermopile arranged on the flexible substrate, wherein the thermopile surrounds the periphery of the heating circuit, and a thermoelectric junction close to the heating circuit and a thermoelectric junction far away from the heating circuit are formed. The structure of the central heating circuit and the surrounding thermopile is adopted, the temperature difference output voltage generated by the heating circuit and the flow field is utilized to measure the flow velocity, and the use scene of the sensor is expanded through the arrangement of the flexible substrate.

The invention discloses a chromium-doped indium oxide-based high-temperature heat flux sensor and a preparation method thereof, a screen printing technology is adopted, a slurry formula and printing process parameters are optimized, a thermopile structure is accurately formed on a high-temperature-resistant ceramic substrate, and then a thermopile and a thermal resistance layer are subjected to step-by-step high-temperature sintering treatment, so that the chromium-doped indium oxide-based high-temperature heat flux sensor is obtained. And firm combination between the thin film and the substrate and densification of a microstructure are ensured. The finally prepared sensor has excellent high-temperature oxidation resistance and long-term working stability, is stable and reliable in thermoelectric output signal, meets the strict requirements of aerospace, energy power and other fields on high-temperature heat flow measurement, is suitable for heat flow monitoring in high-temperature combustion environments, high-speed pneumatic heating and other scenes, and has wide application prospects. And a reliable test means is provided for design and performance evaluation of the thermal protection system in an extreme environment.

The invention provides a structure and a manufacturing method of an infrared thermopile sensor chip, and the manufacturing method comprises the following steps: a, providing a substrate layer which is provided with an upper surface and a lower surface; b, depositing a dielectric couple layer group on the upper surface of the substrate layer, namely, b1, depositing a first dielectric on the upper surface of the substrate layer, and performing imaging processing on the first dielectric to obtain a first dielectric layer with a plurality of dielectric holes, the dielectric hole is communicated with the upper surface of the first dielectric layer and the substrate layer; b2, depositing a first galvanic couple layer on the upper surface of the first dielectric layer, wherein the dielectric holes are filled with the first galvanic couple layer; and e, corroding the substrate layer and the first galvanic couple layer in the dielectric hole on the lower surface of the substrate layer to prepare the infrared thermopile sensor chip with a back cavity, so that the heat dissipation capability is improved, and the thermopile semaphore is increased.

The invention discloses a high-power thin film thermopile laser power meter and a preparation method thereof, and relates to the technical field of laser detection equipment. The high-power thin-film thermopile laser power meter comprises a thermopile chip and a heat sink packaging shell, the thermopile chip comprises a substrate, a thermopile layer is arranged on the substrate, the thermopile layer comprises a plurality of thermocouple lines, the adjacent thermocouple lines are connected in series, the thermocouple lines are distributed in a square shape, the thermocouple lines are distributed in a step shape, and the thermopile chip is connected with the heat sink packaging shell. And a cold end thermal resistance layer and a hot end thermal resistance layer are respectively arranged above the cold end and below the hot end of the thermopile layer. The structure of the thermopile is optimized, the heat transfer path in the thermopile chip is regulated and controlled, the stability of the thermopile chip in a low laser power test is improved, the preparation process is improved, and the cost is reduced. The problems that an existing thin film thermopile laser power meter is low in sensitivity and poor in stability during low-power measurement, and a thermopile chip is prone to aging and poor in stability during high-power density measurement are effectively solved.

The invention relates to the technical field of semiconductor devices, discloses an infrared thermoelectric sensing chip, a radiation temperature measurement device and a design method of an infrared hot end sensing chip, and is used for solving the technical problems that an infrared thermoelectric sensing chip in the prior art is poor in temperature measurement effect, is easily influenced by interference signals and is relatively low in detection precision. The infrared thermoelectric sensing chip comprises a supporting layer arranged above a substrate layer; a thermopile unit disposed over the support layer; the thermopile unit comprises a couple layer composed of a plurality of couple strips, a reflecting layer covers one end of the couple layer to form a cold end of the thermopile unit, and the other end of the couple layer forms a hot end of the thermopile unit; and the hot end area size of the galvanic couple layer is greater than or equal to the cold end area size of the galvanic couple layer. According to the invention, the temperature measurement effect of the infrared thermoelectric sensing chip is improved, the influence of interference signals on temperature detection is reduced, and the temperature detection precision is improved.

The invention discloses a comprehensive test system and method for clothing radiation and convection heat dissipation mechanism research, and belongs to the technical field of clothing thermal performance tests.The comprehensive test system comprises a thermal dummy model, an environment control module, a data acquisition module and a signal processing module, and the thermal dummy model simulates human physiological characteristics according to requirements to adjust the body surface temperature; the partitioned thermal control units are used for independently controlling the temperature of a trunk and four limbs; the environment control module comprises a wind tunnel system and a temperature and humidity bin. The data acquisition module is composed of an infrared thermal imager array and a thermopile sensor group embedded into the surface of the dummy; the signal processing module is integrated with a multi-channel data synchronizer and an intelligent algorithm unit, the time synchronization precision of the multi-channel data synchronizer is smaller than or equal to 1ms, and the multi-channel data synchronizer is used for dynamically separating the radiation heat dissipation amount Qrad and the convection heat dissipation amount Qconv. According to the invention, multi-parameter synchronous measurement is adopted, information acquisition mechanisms such as infrared, thermopile and micro differential pressure sensors are integrated, and accurate separation of radiation and convection heat dissipation is realized.

The invention discloses a novel thermopile type MEMS flow sensor easy to package and a preparation method thereof. The sensor comprises a heating resistor, an environment temperature measurement resistor, a first temperature measurement thermopile, a second temperature measurement thermopile, a silicon dioxide layer, a mixed substrate, a conductive through hole, a silicon supporting layer and a back cavity. Wherein the heating resistor is distributed in the middle of the sensor, and four groups of temperature measuring thermopiles are symmetrically distributed on two sides of the heating resistor. Through the back cavity and the silicon oxide heat insulation area, heat transfer through the substrate is effectively reduced, the measuring range and the sensitivity of the sensor are improved by optimizing the arrangement mode of the thermopiles, and the packaging difficulty of the device is reduced by arranging the back conductive through hole structure.

The utility model relates to a kitchen temperature measurement sensor, which comprises a sleeve-shaped sensor body, a hollow cavity is arranged in the sensor body, two sets of induction components are symmetrically packaged in the cavity, and each induction component comprises a thermopile chip capable of converting a temperature signal into a thermoelectromotive force signal. The sensor comprises a sensor body and a sensor probe embedded in the sensor body, a filter is arranged in front of the thermopile chip, a light hole is formed in front of the filter, the light hole is formed in the sensor body, and an optical path formed by the light hole is used for infrared rays to pass through; the induction component comprises a sensor signal conditioning chip unit which is electrically connected with the thermopile chip through a gold wire. Two sets of sensor components are arranged in one kitchen temperature measurement sensor, and a dual-channel structure is adopted, so that the product cost is reduced, and the hidden trouble is reduced. The sensor signal conditioning chip unit is used for replacing a traditional analog signal sensor, so that the anti-interference capability is improved, and the circuit design is simplified.

The application provides a MEMS differential thermal analysis sensor and a DTA / DSC testing method, the sensor comprising a detection thermocouple, a reference thermocouple, an ambient resistance and a shielding ring, wherein the detection thermocouple and the reference thermocouple each comprise a single crystal silicon substrate, a heat insulation cavity, a plurality of single crystal silicon thermocouple pairs and a supporting film, the heat insulation cavity is located in the single crystal silicon substrate, the plurality of single crystal silicon thermocouple pairs are connected in series and are supported by the supporting film to be suspended above the heat insulation cavity to achieve thermal isolation, and the single crystal silicon thermocouple pair comprises an N-type single crystal silicon thermocouple and a P-type single crystal silicon thermocouple connected in series, the temperature and power sensitivity of the sensor are significantly improved, reach 28 mV / K and 100 V / W, and the noise equivalent temperature difference and the noise equivalent power reach 0.5 mK or 0.2 muW. Based on the output signal of the sensor, differential thermal analysis testing and differential scanning calorimetry testing on physical or chemical processes of material heat absorption and release can be realized, the sample consumption is small, and the testing precision is high.

The invention provides an integrated chip for synchronous thermal analysis, a synchronous thermal analysis system and a synchronous thermal analysis method, and is applied to the technical field of micro-nano sensors. A heating area is formed on a resonance disc through heating of a heating element, a plurality of thermocouples are arranged on the resonance disc to form a thermopile, and a temperature measurement area for detecting the temperature of the heating area is formed; the hot ends of the thermocouples are connected to the cold ends of the thermocouples on the substrate through the wires on the plurality of connecting beams distributed around the resonance disc, so that the number of the thermocouples in the resonance disc can be increased, and the temperature sensitivity of the integrated chip can be improved; therefore, the integrated chip can meet the sample test requirements of low heat absorption / release or small temperature change, so that the measurement capability of a synchronous thermal analysis system is improved.

The invention discloses a neurosurgical patient body temperature accurate regulation and control device which comprises a central control module, a body temperature sensing module, a dynamic heat regulation and control module, an intelligent airflow module, an energy management module and a data recording and early warning module, and real-time monitoring and accurate regulation and control of the body temperature of a patient are achieved through cooperative work of all the modules. The body temperature sensing module adopts an infrared sensor array and a skin contact type sensor, the dynamic thermal regulation and control module regulates the body temperature through a micro thermopile element and a liquid circulation unit, and the intelligent airflow module provides constant-temperature airflow to assist regulation and control. The device also has a modular design, is convenient to quickly assemble and disassemble, and supports power supply of a standby battery. A data recording and early warning function ensures timely alarm when the temperature is abnormal, and safe and efficient body temperature management is provided for a patient in the operation process. The device can effectively guarantee that the body temperature of a patient is stable in the neurosurgery operation, and the operation safety and the recovery effect are improved.

The invention relates to the technical field of thermoelectric effect and heat flux density detection, and discloses an atomic layer thermopile heat flux sensor with water cooling and preparation and assembly methods, the heat flux sensor comprises a sensor chip and a cooling assembly, the bottom layer of the sensor chip is a substrate layer with the 001 crystal face beveled by 15 degrees, and the bottom layer of the sensor chip is a substrate layer with the 001 crystal face beveled by 15 degrees. A layered heat flow sensitive film on the substrate is a YBa2Cu3O7-delta film grown through pulse laser deposition, and double-layer metal electrodes are prepared at the two ends of the surface of the YBa2Cu3O7-delta film; and the cooling assembly is used for carrying out water cooling on the sensor chip and packaging the sensor chip. According to the invention, a YBa2Cu3O7-delta thin film with a large inclination angle is prepared on a single crystal lanthanum aluminate LaAlO3 substrate which is beveled by 15 degrees; the high-temperature-resistant Ni / Pt and Ni / W double-layer electrode is prepared on the surface of the YBa2Cu3O7-delta thin film, annealing is carried out, the contact strength of the YBa2Cu3O7-delta thin film and an electrode material is improved, the contact resistance is reduced, and the electric signal strength is improved; the cooling assembly improves the stability of the device in a large-heat-flow and long-time working scene.

A single MEMS thermal conductivity sensor based system capable of simultaneously measuring an air contained hydrogen and water vapor concentrations is described. The operation of the system is based on: hydrogen and water vapor have different temperature coefficients of their thermal conductivities and the sensor can be modulated by temperature so as to calculate their concentrations by their contributions to the total thermal conductivity of the air contained hydrogen and water vapor at different modulation temperatures of the sensor. The sensor comprises a one-dimensional gas heat conduction chamber recessed in a silicon substrate and a thermopile on the top of the chamber is used to measure the temperature difference between the heat source on the top and heat sink on the bottom of the chamber which is produced by the heat conduction of the air contained hydrogen and water vapor in the chamber. The air contained hydrogen and water vapor concentrations can be calculated using the measured thermal conductivities of the air contained hydrogen and water vapor at different modulation temperatures of the sensor.

The invention discloses an optical multichannel gas sensor based on an NDIR principle, and relates to the technical field of infrared gas sensors. The device is composed of an infrared absorption light system composed of an infrared light source, a gas chamber and a four-channel thermopile detector, a light source voltage stabilization modulation circuit, a thermopile weak signal conditioning circuit, a high-precision analog-to-digital conversion circuit and a single-chip microcomputer control and communication circuit system. The device achieves the functions of compact structure and real-time measurement of various gases; a low-noise zero-drift self-stabilization signal processing circuit is realized, a low-power-consumption 24-bit # imgabs0 # sampling circuit is designed, accurate real-time digital signals can be obtained without a complex data processing algorithm, the design has the characteristics of wide range, high precision, good stability, long service life, miniaturization and the like, various types of gases can be measured by replacing a sensor end, and the measurement accuracy is high. The problems that a traditional infrared optical gas sensor is high in cost, large in size, inconvenient to carry, long in detection result time consumption and prone to environmental interference are solved.

The invention provides an MEMS (Micro Electro Mechanical System) thermal flow sensor. 100 gt; the inclined edge corrosion holes extending in the crystal orientation are combined with the vertical corrosion holes. 100 gt; when the beveled edge corrosion hole in the crystal direction is corroded by an alkaline solution, the corrosion rate of the crystal face of the substrate (100) is far greater than that of the crystal face of the substrate (111), so that the beveled edge corrosion hole can completely corrode downwards along the thickness direction of the substrate to remove the substrate, thereby improving a hill-like structure at the center of the heat-insulating film, reducing heat loss towards the direction of the substrate, and improving the heat-insulating performance of the heat-insulating film. The vertical corrosion holes can also prevent heat from being transferred to the substrate in the horizontal direction, and heat loss is reduced; meanwhile, the bevel edge corrosion holes can hinder transverse temperature conduction, the multiple sub-film parts obtained through division can be located in different temperature fields, and due to the fact that the distances between the hot end of the thermopile and the heating element are different, the sensitivity to different measuring range flow is different. Therefore, different measuring range test requirements can be realized through different distances between the hot ends of the thermopiles at different sub-film parts and the heating element.

The invention discloses an MEMS (Micro Electro Mechanical System) thermopile structure and a preparation method thereof, and belongs to the technical field of micro electro mechanical systems, the MEMS thermopile structure is characterized by comprising a substrate, a support film I and a support film II which are arranged in one step, and the support film II is provided with an electrode and a plurality of thermocouple strip groups which are radially arranged from a hot end to a cold end; the thermocouple strip group is curved and comprises a second thermocouple strip, an insulating interlayer and a first thermocouple strip which are sequentially arranged from bottom to top; a structure formed by the support film II, the electrode and the thermocouple strip is covered with an infrared absorption layer and a passivation layer; the second thermocouple strip and the electrode are made of the same material; the tail end of the second thermocouple strip extends downwards and is connected with the tail end of the first thermocouple strip to form a cold end of the thermopile, and the head end is connected with the head end of the adjacent first thermocouple strip to form a hot end of the thermopile; and the tail ends of the first thermocouple strip and the second thermocouple strip of the group of thermocouple strips are respectively connected with the two electrodes. The sensing performance such as the response rate, the linearity and the stability of the MEMS thermopile temperature sensor is improved.

The invention relates to the field of new energy batteries, and discloses a new energy battery temperature monitoring control method comprising the following steps: deploying a multi-mode sensor array comprising a nanowire thermopile, a terahertz time-domain spectroscopy system and a flexible film temperature sensor; constructing a non-local heat conduction model, and introducing a heat flow relaxation time term and a non-local diffusion term to correct the traditional Fourier law; establishing a jump diffusion type stochastic differential equation of a microscopic heat source, and quantifying the randomness of lithium ion flux fluctuation and thermal runaway triggering; the optimal layout of the sensor is determined through a topological optimization algorithm, and the temperature field reconstruction error and the hardware cost are minimized. Through the cross-scale sensing fusion of the nanowire thermopile and the terahertz spectrum, the limitation of traditional single-point temperature measurement is broken through, and millisecond-level capture of the thermal behavior of an electrode-electrolyte interface microcell is realized. Compared with a method depending on surface temperature extrapolation in the prior art, the problem that microcosmic heat source recognition precision is insufficient is effectively solved, and the early-stage thermal runaway early warning capacity is remarkably improved.

The invention relates to the technical field of body temperature monitoring, in particular to a non-contact infrared body temperature monitoring chip and a self-adaptive noise suppression system, comprising the following modules: an infrared signal acquisition module for receiving an infrared signal radiated by a human body and converting the infrared signal into a weak electric signal, adopting a thermopile sensor array and having a response wavelength range of 8-14 [mu] m; the pre-amplification module is connected with the infrared signal acquisition module and used for primarily amplifying the weak electric signals, a low-noise operational amplifier is adopted, and the noise density is smaller than or equal to 1.5 nV / Hz; the noise feature analysis unit adopts a time-frequency conjoint analysis algorithm, extracts time-varying feature parameters of noise in real time through short-time Fourier transform (STFT), realizes fine separation of noise in different frequency bands in combination with a wavelet packet decomposition technology, can identify and suppress various complex noise such as 50Hz / 60Hz power frequency interference, switching power supply ripple noise, ambient light flicker noise and the like, and is high in practicability. And the system can still keep the measurement precision of + / -0.1 DEG C in an ICU environment with dense medical equipment.

The present application relates to a kind of ion polymer-based thermoelectric pile heat flux sensor device, the thermoelectric pile heat flux sensor includes in turn: first protective layer, first connecting circuit, thermal resistance layer, thermoelectric element, second connecting circuit and second protective layer, wherein the thermoelectric element is embedded in the thermal resistance layer and is made of ion conductor with free ion as main carrier. Since ion conductor has huge thermoelectric potential, only a few pairs of ion thermoelectric column need to be integrated to obtain the required thermoelectric voltage with the required sensitivity.

The disclosure provides a temperature sensing device including a thermopile sensing assembly with a metal sleeve and a metal grid for blocking microwave from entering the thermopile sensor and influencing temperature detection. The temperature sensing device includes one or more than one thermopile sensing elements, an ambient temperature sensor, a signal processing chip, and an infrared lens providing narrow FOV. When dual thermopile sensing elements are used, one is active unit with narrow FOV for measuring the infrared radiation of the object to be detected, and the other one is a dummy unit for the compensation of the thermal shock to achieve the purpose of accurate temperature detection. The disclosure also provides the visible light source to indicate the sensing area of the thermopile sensor, that may facilitate the user positioning the object to be heated. FOV of the light source is the same with that of the thermopile sensor.

Wearable devices capable of measuring a core body temperature and other vital signs of a user in a range of situations are described herein. The wearable device is arranged to be retained within the ear canal of the ear, in order to prevent the wearable device from inadvertently removing itself from the ear. Providing an infrared thermopile at the innermost end of the ear insert ensures that the infrared thermopile is provided as close as possible to the tympanic membrane which will be used to provide an indication of the core body temperature.

The utility model discloses a kind of optical multi-channel gas sensors based on NDIR principle, it is related to infrared gas sensor technical field;By infrared light source, air chamber, four-channel thermoelectric detector composition infrared absorption light system, light source voltage stabilizing modulation circuit, thermoelectric weak signal conditioning circuit, high-precision analog-digital conversion circuit, single-chip microcomputer control and communication circuit system composition, the utility model realizes compact structure, the function of the real-time measurement of multiple gas;Realize low-noise zero drift self-stable signal processing circuit, design low-power 24-bit sampling circuit, accurate real-time digital signal can be obtained without complex data processing algorithm, the utility model design has the characteristics such as wide range, high precision, good stability, long life, miniaturization, simultaneously replace sensor end can measure multiple types of gas, solve the problem that traditional infrared optical gas sensor is high in cost, bulky inconvenient to carry, detection result is time-consuming long precision is susceptible to environmental interference.