241 results about "Thermopile" patented technology

The invention relates to the technical field of active testing of circuit breakers, discloses an active testing method and system for a circuit breaker, and is used for solving the problem that an existing active testing method is difficult to realize self-adaptive adjustment of a threshold value. Time-frequency analysis is carried out on the contact speed signal to extract time domain and frequency domain features, and heat flow analysis of the thermopile array is combined to obtain a heat engine coupling feature vector; a thermo-electro-mechanical coupling dynamic graph with the sensors and the components as nodes and the reciprocal of thermal conductance as the edge weight is constructed, the structure is updated in real time, and node drift is predicted through a graph convolutional network; fusing the environment derating and the predicted drift amount to adaptively adjust a threshold value; extracting a thermoelectric coupling component of a contact speed fast change component and a heat flow refraction angle change rate, and generating a reversed polarity pulse compensation signal to suppress interference; time synchronization, closed-loop feedback of data and threshold adjustment results are realized through secondary alignment of IEEE1588 and the cloud, graph model node weight and threshold rules are dynamically updated, synchronization with equipment health degree is ensured, and accurate early warning and protection are realized.

The invention relates to the technical field of infrared sensors, in particular to a monolithic integrated MEMS out-of-plane thermopile chip and a preparation method thereof, and the thermopile chip comprises a substrate, and a bottom electrode, a thermocouple array, a top electrode and an optical radiation absorption layer which are sequentially arranged on the substrate; the thermocouple array is vertically arranged on the bottom electrode; the thermocouple array comprises a plurality of thermocouple pairs, and each thermocouple pair comprises an N-type thermocouple and a P-type thermocouple; the N-type thermocouple and the P-type thermocouple form a current and heat flow loop in an electric series connection and heat parallel connection mode. According to the invention, the bismuth telluride-based thermoelectric material with low thermal conductivity and high Seebeck coefficient difference is used as the thermocouple material of the out-of-plane thermopile chip, the heat conduction path of the out-of-plane thermopile chip is more direct, the temperature difference in the vertical direction can be directly utilized, and the higher response speed and high sensitivity are expected to be realized due to the more efficient thermal gradient.

The invention discloses a multi-channel high-precision three-dimensional microcalorimeter, and belongs to the technical field of microcalorimeters, the multi-channel high-precision three-dimensional microcalorimeter comprises a support block, a furnace body is arranged above the support block, a heat insulation layer is arranged in the furnace body in sequence, a heating cylinder is arranged in the heat insulation layer, a heat uniformizing block is arranged in the heating cylinder, and the heat uniformizing block is arranged in the furnace body. The device comprises a heat uniformizing block, a heat measuring cavity is formed in the heat uniformizing block, a heat uniformizing block temperature sensor is arranged at the circle center of the heat measuring cavity, a plurality of heat measuring channels are arranged in the heat measuring cavity around the circle center of the heat uniformizing block at equal intervals, the distances between every two adjacent heat measuring channels are the same, and three-dimensional thermopiles are arranged on the outer walls of the heat measuring channels in a sleeving mode. The number of the heat measuring channels is at least three. According to the multi-channel high-precision three-dimensional microcalorimeter, multiple channels are arranged, multiple groups of experiments, especially comparative experiments, can be carried out at the same time, the experiment efficiency can be greatly improved, and the research and development progress of scientific researchers is accelerated.

The utility model discloses a high-temperature specific heat capacity tester which comprises a main control cabinet, a heating device, a connecting sleeve and a detection device, the heating device is fixedly installed on the detection device through the connecting sleeve, the detection device is fixedly installed on the main control cabinet, the heating device comprises an electric furnace, a test sample is hung in a heating hearth through a high-temperature-resistant wire to be heated, and the electric furnace is connected with the electric furnace. The detection device comprises an outer box body connected with the connecting sleeve, a constant-temperature heat insulation screen cover is installed in the outer box body, a temperature-controllable heat insulation screen cover is installed in the constant-temperature heat insulation screen cover through an insulation support, a heat measuring block is installed in the temperature-controllable heat insulation screen cover through an insulation support, and an electric heating tube and a thermocouple are arranged on the heat measuring block. A heating resistance wire is arranged on the side wall of the temperature-controllable heat insulation shield, a temperature difference thermopile is arranged between the heating resistance wire and the calorimetric block, and a copper pipe used for introducing constant-temperature hot water is wound on the side wall of the constant-temperature heat insulation shield. The high-temperature specific heat capacity tester disclosed by the utility model is high in measurement precision, simple to operate and small in size.

The invention provides a curved-surface conformal wireless passive heat flow sensor and a preparation method thereof, and belongs to the technical field of high-temperature sensors. The heat flow sensor comprises a metal wire, a silicon carbide substrate, a sensitive layer and a thermal resistance layer which are sequentially arranged from bottom to top; the sensitive layer comprises a thermopile, an inductor, a capacitor and a microstrip antenna which adopt an ink direct writing process and are made of metal, one end of the thermopile is connected with the capacitor, and the microstrip antenna and the inductor are connected with the other end of the thermopile; the thermal resistance layer is provided with at least one opening to expose a thermal junction of the thermopile; the metal wire connects the inductor and the capacitor to form a resonant circuit. The whole heat flow sensor is flexible, can be adaptively attached to the surface of a curved part, has the characteristic of high temperature resistance, realizes wireless and passive transmission of heat flow signals, and solves the problems that the lead is difficult to lead and the lead is easy to break in a high-temperature and high-rotation environment.

The invention belongs to the technical field of integrated circuit design, and particularly relates to a flexible thermoelectric flow velocity sensor for surface flow field monitoring, which comprises a flexible substrate, and a central heating circuit and a thermopile arranged on the flexible substrate, wherein the thermopile surrounds the periphery of the heating circuit, and a thermoelectric junction close to the heating circuit and a thermoelectric junction far away from the heating circuit are formed. The structure of the central heating circuit and the surrounding thermopile is adopted, the temperature difference output voltage generated by the heating circuit and the flow field is utilized to measure the flow velocity, and the use scene of the sensor is expanded through the arrangement of the flexible substrate.

The invention discloses a chromium-doped indium oxide-based high-temperature heat flux sensor and a preparation method thereof, a screen printing technology is adopted, a slurry formula and printing process parameters are optimized, a thermopile structure is accurately formed on a high-temperature-resistant ceramic substrate, and then a thermopile and a thermal resistance layer are subjected to step-by-step high-temperature sintering treatment, so that the chromium-doped indium oxide-based high-temperature heat flux sensor is obtained. And firm combination between the thin film and the substrate and densification of a microstructure are ensured. The finally prepared sensor has excellent high-temperature oxidation resistance and long-term working stability, is stable and reliable in thermoelectric output signal, meets the strict requirements of aerospace, energy power and other fields on high-temperature heat flow measurement, is suitable for heat flow monitoring in high-temperature combustion environments, high-speed pneumatic heating and other scenes, and has wide application prospects. And a reliable test means is provided for design and performance evaluation of the thermal protection system in an extreme environment.

The invention discloses a high-power thin film thermopile laser power meter and a preparation method thereof, and relates to the technical field of laser detection equipment. The high-power thin-film thermopile laser power meter comprises a thermopile chip and a heat sink packaging shell, the thermopile chip comprises a substrate, a thermopile layer is arranged on the substrate, the thermopile layer comprises a plurality of thermocouple lines, the adjacent thermocouple lines are connected in series, the thermocouple lines are distributed in a square shape, the thermocouple lines are distributed in a step shape, and the thermopile chip is connected with the heat sink packaging shell. And a cold end thermal resistance layer and a hot end thermal resistance layer are respectively arranged above the cold end and below the hot end of the thermopile layer. The structure of the thermopile is optimized, the heat transfer path in the thermopile chip is regulated and controlled, the stability of the thermopile chip in a low laser power test is improved, the preparation process is improved, and the cost is reduced. The problems that an existing thin film thermopile laser power meter is low in sensitivity and poor in stability during low-power measurement, and a thermopile chip is prone to aging and poor in stability during high-power density measurement are effectively solved.

The invention discloses a comprehensive test system and method for clothing radiation and convection heat dissipation mechanism research, and belongs to the technical field of clothing thermal performance tests.The comprehensive test system comprises a thermal dummy model, an environment control module, a data acquisition module and a signal processing module, and the thermal dummy model simulates human physiological characteristics according to requirements to adjust the body surface temperature; the partitioned thermal control units are used for independently controlling the temperature of a trunk and four limbs; the environment control module comprises a wind tunnel system and a temperature and humidity bin. The data acquisition module is composed of an infrared thermal imager array and a thermopile sensor group embedded into the surface of the dummy; the signal processing module is integrated with a multi-channel data synchronizer and an intelligent algorithm unit, the time synchronization precision of the multi-channel data synchronizer is smaller than or equal to 1ms, and the multi-channel data synchronizer is used for dynamically separating the radiation heat dissipation amount Qrad and the convection heat dissipation amount Qconv. According to the invention, multi-parameter synchronous measurement is adopted, information acquisition mechanisms such as infrared, thermopile and micro differential pressure sensors are integrated, and accurate separation of radiation and convection heat dissipation is realized.

The invention discloses a novel thermopile type MEMS flow sensor easy to package and a preparation method thereof. The sensor comprises a heating resistor, an environment temperature measurement resistor, a first temperature measurement thermopile, a second temperature measurement thermopile, a silicon dioxide layer, a mixed substrate, a conductive through hole, a silicon supporting layer and a back cavity. Wherein the heating resistor is distributed in the middle of the sensor, and four groups of temperature measuring thermopiles are symmetrically distributed on two sides of the heating resistor. Through the back cavity and the silicon oxide heat insulation area, heat transfer through the substrate is effectively reduced, the measuring range and the sensitivity of the sensor are improved by optimizing the arrangement mode of the thermopiles, and the packaging difficulty of the device is reduced by arranging the back conductive through hole structure.

The utility model relates to a kitchen temperature measurement sensor, which comprises a sleeve-shaped sensor body, a hollow cavity is arranged in the sensor body, two sets of induction components are symmetrically packaged in the cavity, and each induction component comprises a thermopile chip capable of converting a temperature signal into a thermoelectromotive force signal. The sensor comprises a sensor body and a sensor probe embedded in the sensor body, a filter is arranged in front of the thermopile chip, a light hole is formed in front of the filter, the light hole is formed in the sensor body, and an optical path formed by the light hole is used for infrared rays to pass through; the induction component comprises a sensor signal conditioning chip unit which is electrically connected with the thermopile chip through a gold wire. Two sets of sensor components are arranged in one kitchen temperature measurement sensor, and a dual-channel structure is adopted, so that the product cost is reduced, and the hidden trouble is reduced. The sensor signal conditioning chip unit is used for replacing a traditional analog signal sensor, so that the anti-interference capability is improved, and the circuit design is simplified.

The application provides a MEMS differential thermal analysis sensor and a DTA / DSC testing method, the sensor comprising a detection thermocouple, a reference thermocouple, an ambient resistance and a shielding ring, wherein the detection thermocouple and the reference thermocouple each comprise a single crystal silicon substrate, a heat insulation cavity, a plurality of single crystal silicon thermocouple pairs and a supporting film, the heat insulation cavity is located in the single crystal silicon substrate, the plurality of single crystal silicon thermocouple pairs are connected in series and are supported by the supporting film to be suspended above the heat insulation cavity to achieve thermal isolation, and the single crystal silicon thermocouple pair comprises an N-type single crystal silicon thermocouple and a P-type single crystal silicon thermocouple connected in series, the temperature and power sensitivity of the sensor are significantly improved, reach 28 mV / K and 100 V / W, and the noise equivalent temperature difference and the noise equivalent power reach 0.5 mK or 0.2 muW. Based on the output signal of the sensor, differential thermal analysis testing and differential scanning calorimetry testing on physical or chemical processes of material heat absorption and release can be realized, the sample consumption is small, and the testing precision is high.

The invention provides an integrated chip for synchronous thermal analysis, a synchronous thermal analysis system and a synchronous thermal analysis method, and is applied to the technical field of micro-nano sensors. A heating area is formed on a resonance disc through heating of a heating element, a plurality of thermocouples are arranged on the resonance disc to form a thermopile, and a temperature measurement area for detecting the temperature of the heating area is formed; the hot ends of the thermocouples are connected to the cold ends of the thermocouples on the substrate through the wires on the plurality of connecting beams distributed around the resonance disc, so that the number of the thermocouples in the resonance disc can be increased, and the temperature sensitivity of the integrated chip can be improved; therefore, the integrated chip can meet the sample test requirements of low heat absorption / release or small temperature change, so that the measurement capability of a synchronous thermal analysis system is improved.

The invention discloses an optical multichannel gas sensor based on an NDIR principle, and relates to the technical field of infrared gas sensors. The device is composed of an infrared absorption light system composed of an infrared light source, a gas chamber and a four-channel thermopile detector, a light source voltage stabilization modulation circuit, a thermopile weak signal conditioning circuit, a high-precision analog-to-digital conversion circuit and a single-chip microcomputer control and communication circuit system. The device achieves the functions of compact structure and real-time measurement of various gases; a low-noise zero-drift self-stabilization signal processing circuit is realized, a low-power-consumption 24-bit # imgabs0 # sampling circuit is designed, accurate real-time digital signals can be obtained without a complex data processing algorithm, the design has the characteristics of wide range, high precision, good stability, long service life, miniaturization and the like, various types of gases can be measured by replacing a sensor end, and the measurement accuracy is high. The problems that a traditional infrared optical gas sensor is high in cost, large in size, inconvenient to carry, long in detection result time consumption and prone to environmental interference are solved.

The invention discloses an MEMS (Micro Electro Mechanical System) thermopile structure and a preparation method thereof, and belongs to the technical field of micro electro mechanical systems, the MEMS thermopile structure is characterized by comprising a substrate, a support film I and a support film II which are arranged in one step, and the support film II is provided with an electrode and a plurality of thermocouple strip groups which are radially arranged from a hot end to a cold end; the thermocouple strip group is curved and comprises a second thermocouple strip, an insulating interlayer and a first thermocouple strip which are sequentially arranged from bottom to top; a structure formed by the support film II, the electrode and the thermocouple strip is covered with an infrared absorption layer and a passivation layer; the second thermocouple strip and the electrode are made of the same material; the tail end of the second thermocouple strip extends downwards and is connected with the tail end of the first thermocouple strip to form a cold end of the thermopile, and the head end is connected with the head end of the adjacent first thermocouple strip to form a hot end of the thermopile; and the tail ends of the first thermocouple strip and the second thermocouple strip of the group of thermocouple strips are respectively connected with the two electrodes. The sensing performance such as the response rate, the linearity and the stability of the MEMS thermopile temperature sensor is improved.

The invention relates to the field of new energy batteries, and discloses a new energy battery temperature monitoring control method comprising the following steps: deploying a multi-mode sensor array comprising a nanowire thermopile, a terahertz time-domain spectroscopy system and a flexible film temperature sensor; constructing a non-local heat conduction model, and introducing a heat flow relaxation time term and a non-local diffusion term to correct the traditional Fourier law; establishing a jump diffusion type stochastic differential equation of a microscopic heat source, and quantifying the randomness of lithium ion flux fluctuation and thermal runaway triggering; the optimal layout of the sensor is determined through a topological optimization algorithm, and the temperature field reconstruction error and the hardware cost are minimized. Through the cross-scale sensing fusion of the nanowire thermopile and the terahertz spectrum, the limitation of traditional single-point temperature measurement is broken through, and millisecond-level capture of the thermal behavior of an electrode-electrolyte interface microcell is realized. Compared with a method depending on surface temperature extrapolation in the prior art, the problem that microcosmic heat source recognition precision is insufficient is effectively solved, and the early-stage thermal runaway early warning capacity is remarkably improved.

The invention relates to the technical field of body temperature monitoring, in particular to a non-contact infrared body temperature monitoring chip and a self-adaptive noise suppression system, comprising the following modules: an infrared signal acquisition module for receiving an infrared signal radiated by a human body and converting the infrared signal into a weak electric signal, adopting a thermopile sensor array and having a response wavelength range of 8-14 [mu] m; the pre-amplification module is connected with the infrared signal acquisition module and used for primarily amplifying the weak electric signals, a low-noise operational amplifier is adopted, and the noise density is smaller than or equal to 1.5 nV / Hz; the noise feature analysis unit adopts a time-frequency conjoint analysis algorithm, extracts time-varying feature parameters of noise in real time through short-time Fourier transform (STFT), realizes fine separation of noise in different frequency bands in combination with a wavelet packet decomposition technology, can identify and suppress various complex noise such as 50Hz / 60Hz power frequency interference, switching power supply ripple noise, ambient light flicker noise and the like, and is high in practicability. And the system can still keep the measurement precision of + / -0.1 DEG C in an ICU environment with dense medical equipment.

The present application relates to a kind of ion polymer-based thermoelectric pile heat flux sensor device, the thermoelectric pile heat flux sensor includes in turn: first protective layer, first connecting circuit, thermal resistance layer, thermoelectric element, second connecting circuit and second protective layer, wherein the thermoelectric element is embedded in the thermal resistance layer and is made of ion conductor with free ion as main carrier. Since ion conductor has huge thermoelectric potential, only a few pairs of ion thermoelectric column need to be integrated to obtain the required thermoelectric voltage with the required sensitivity.

The disclosure provides a temperature sensing device including a thermopile sensing assembly with a metal sleeve and a metal grid for blocking microwave from entering the thermopile sensor and influencing temperature detection. The temperature sensing device includes one or more than one thermopile sensing elements, an ambient temperature sensor, a signal processing chip, and an infrared lens providing narrow FOV. When dual thermopile sensing elements are used, one is active unit with narrow FOV for measuring the infrared radiation of the object to be detected, and the other one is a dummy unit for the compensation of the thermal shock to achieve the purpose of accurate temperature detection. The disclosure also provides the visible light source to indicate the sensing area of the thermopile sensor, that may facilitate the user positioning the object to be heated. FOV of the light source is the same with that of the thermopile sensor.

Wearable devices capable of measuring a core body temperature and other vital signs of a user in a range of situations are described herein. The wearable device is arranged to be retained within the ear canal of the ear, in order to prevent the wearable device from inadvertently removing itself from the ear. Providing an infrared thermopile at the innermost end of the ear insert ensures that the infrared thermopile is provided as close as possible to the tympanic membrane which will be used to provide an indication of the core body temperature.

The utility model discloses a kind of optical multi-channel gas sensors based on NDIR principle, it is related to infrared gas sensor technical field;By infrared light source, air chamber, four-channel thermoelectric detector composition infrared absorption light system, light source voltage stabilizing modulation circuit, thermoelectric weak signal conditioning circuit, high-precision analog-digital conversion circuit, single-chip microcomputer control and communication circuit system composition, the utility model realizes compact structure, the function of the real-time measurement of multiple gas;Realize low-noise zero drift self-stable signal processing circuit, design low-power 24-bit sampling circuit, accurate real-time digital signal can be obtained without complex data processing algorithm, the utility model design has the characteristics such as wide range, high precision, good stability, long life, miniaturization, simultaneously replace sensor end can measure multiple types of gas, solve the problem that traditional infrared optical gas sensor is high in cost, bulky inconvenient to carry, detection result is time-consuming long precision is susceptible to environmental interference.

The application discloses a kind of thermoelectric array and depth camera joint calibration method and system.The application can be simultaneously detected by thermoelectric array and depth camera with spherical calibration object, and the spherical center of the spherical calibration object is used as feature point;The spherical calibration object is set to the position so that the temperature field observed by the thermoelectric array has central symmetry;Change the space pose of the spherical calibration object and synchronously collect the first coordinate set of the spherical center in the thermoelectric array coordinate system and the second coordinate set in the depth camera coordinate system;Based on the first coordinate set and the second coordinate set, the spatial transformation relationship between the thermoelectric array and the depth camera is solved.By the application, the thermoelectric array image coordinates are not dependent on detection, but rely on aiming at a specific location, and use temperature measurement symmetry, aiming accuracy is much higher than detection, so high-precision thermoelectric array image coordinates are obtained.

The present invention relates to a manufacturing method of a multi-stack double-arrangement high-response flow chip. The method includes fabricating a silicon nitride support layer on a substrate, then fabricating a polysilicon layer on its surface, and forming lower thermocouples of upstream and downstream temperature-measuring thermopiles and a central heat source layer thermocouple through photolithographic patterning; fabricating a second polysilicon layer, and forming middle thermocouples located above the lower thermocouples of upstream and downstream temperature-measuring thermopiles through photolithographic patterning; fabricating a second isolation layer for electrical insulation isolation, forming a first wire and a second wire connecting the thermocouples by photolithography and depositing a conductive layer, and fabricating a third isolation layer for electrical insulation isolation; fabricating a third polysilicon layer, and forming upper thermocouples located above the middle thermocouples of upstream and downstream temperature-measuring thermopiles through photolithographic patterning. Fabricating a fourth isolation layer on the third polysilicon layer, and forming a third wire and a fourth wire connecting the thermocouples by photolithography and depositing a conductive layer. The present invention increases the output and sensitivity of the temperature-measuring element.

The utility model discloses an infrared detection device which comprises a protective cover, an infrared detection module, an infrared thermopile sensor and a PCB (Printed Circuit Board), and the protective cover is made of a transparent material; the infrared detection module is arranged in the protective cover and comprises a transmitting probe for transmitting an infrared signal and a receiving probe for receiving the infrared signal, and the infrared signal can penetrate through the protective cover; the infrared thermopile sensor is arranged on the protective cover in a penetrating manner; the PCB is arranged in the protective cover, and the infrared detection module and the infrared thermopile sensor are both integrated on the PCB and electrically connected with the PCB. Therefore, the infrared detection module used for detecting whether an object is placed in place or not and the infrared thermopile sensor used for detecting the temperature of the object are integrated on one PCB, so that the purpose of compact arrangement is achieved, the installation space of a product is reduced, and the integration degree of the product is higher. In addition, the utility model further provides the milk warming and shaking all-in-one machine with the milk warming and shaking all-in-one machine.

The present application discloses an improved thermopile laser sensor apparatus and methods of use. In one embodiment, the apparatus includes a sensor body having a first sensor body recess and a second sensor body recess formed therein, with a substrate positioned in the first sensor body recess in thermal communication with the sensor body. The substrate includes at least one absorber attached thereto and configured to absorb a portion of a beam of laser energy. A first thermal sensor in thermal communication with the substrate and the sensor body may be formed on or attached to the substrate. A second thermal sensor in thermal communication with the sensor body may be positioned in the second sensor body recess. A thermal barrier configured to reduce the rate of transfer of thermal energy from the substrate to the second thermal sensor may be positioned between the substrate and the second thermal sensor.

The application discloses a blackbody-thermoelectric pile cooperative thermistor multi-temperature-point zero-point matching calibration method. The method utilizes the Seebeck effect of the thermoelectric pile, establishes the accurate corresponding relationship of the blackbody standard temperature-thermistor resistance value through zero-point matching, carries out dynamic temperature scanning on different calibration point temperatures of the cavity, and obtains the thermistor parameters of multiple temperature points. Finally, the accurate R-T curve is fitted through the least square method. The method innovatively calibrates the thermistor through the blackbody heat radiation mode. The method does not need to disassemble the instrument, does not damage the stability of the original system, can complete the rapid calibration of the instrument on site, effectively reduces the calibration cost, and guarantees the temperature calibration accuracy and the calibration effect.

The present invention provides a highly sensitive thin-film thermopile heat flux meter, comprising a substrate; a lower thermal resistance layer disposed on the substrate; a thermopile thin film formed by overlapping multiple pairs of thermocouples end to end, disposed on the lower thermal resistance layer. Each pair of thermocouples comprises a positive thermocouple and a negative thermocouple connected in series, with the positive and negative thermocouples connected in a stepped manner. The lower thermal resistance layer covers below the hot junction where the positive and negative thermocouples are connected. An upper thermal resistance layer is disposed on the thermopile thin film and covers above the cold junction where the positive and negative thermocouples are connected. The two ends of the thermopile thin film are connected through positive and negative thermopile lead terminals, respectively. The negative and positive thermopile lead terminals are connected to form a thermocouple, and a temperature signal is measured through the lead terminals. The present invention can achieve transient measurement of temperature and heat flux density and has the advantages of fast response and high sensitivity.

The application discloses a thermoelectric pile structure for calibrating a far ultraviolet ultraviolet detector based on MEMS, which comprises a silicon substrate, a support layer, an absorption layer, a thermocouple pair, aluminum wires, aluminum electrodes and a single crystal silicon material structure on the silicon substrate. The double-layer thermocouple stacking structure is adopted to improve the device duty ratio, more thermocouple pairs can be laid in the case of keeping the size of the one-layer structure unchanged, and the response rate of the detector is improved. The circular structure conforms to the distribution trend that the temperature is radially diffused from the center of the absorption layer to the periphery in a decreasing manner, the hot end of the thermocouple pair can be closer to the area with higher temperature, the temperature of the hot end of the thermocouple pair is more uniform, and the response rate of the detector is improved. The radiant energy of the far ultraviolet ultraviolet radiation source is converted into an output thermoelectric electromotive force, a mathematical model of Fourier's law and the Seebeck effect is established for calculation, and the heat flux density of the far ultraviolet ultraviolet radiation source is measured.

This invention relates to a miniature sensor for engine ignition monitoring based on a thermopile infrared sensor. It includes: a housing, a thermopile infrared detector, and a power module, a main control unit, and a communication unit disposed within the housing. The main control unit is an FPGA chip containing an ARM processor and a SOC core. The power module is connected to the thermopile infrared detector, the main control unit, and the communication unit, respectively, to provide voltages for the corresponding parameters of each device. The communication unit is connected to the main control unit to send monitoring commands and the target area for engine ignition monitoring. The infrared detector is connected to the main control unit, and the main control unit controls the infrared detector to monitor the ignition plume within the target area based on the monitoring commands to obtain raw measurement data. The main control unit is also used to calculate the raw measurement data and determine the engine ignition state based on the calculation results. The miniature sensor designed in this application is lightweight, small in size, and can quickly monitor the engine ignition state.

The invention relates to a high-sensitivity MEMS flow sensor and a manufacturing method thereof.The high-sensitivity MEMS flow sensor comprises a sensor chip, a metal base and a measuring runner, the sensor chip comprises a substrate, and a porous silicon area is formed in the substrate; the first dielectric layer is formed on the substrate and the upper surface of the porous silicon region; the heating resistor array is formed on the upper surface of the first dielectric layer and is positioned right above the porous silicon region; the thermopile array is formed on the upper surface of the first dielectric layer and located over the porous silicon area, and the thermopile array and the heating resistor array are alternately arranged in the direction of the gas flow channel; the electric isolation layer covers the heating resistor array and the thermopile array; the metal interconnection structure is formed on the upper surface of the electric isolation layer and is connected with the thermopile array; the electrode is connected with the metal interconnection structure; and the second dielectric layer covers the electrical isolation layer and the metal interconnection structure. A multi-pair symmetrical distribution structure in which the thermopiles and the heaters are alternately arranged is adopted, so that the measurement sensitivity of the flowmeter is remarkably improved.