A microelectromechanical sensor (100) is described comprising a substrate (110), a stationary
electrode arrangement (120) relative to the substrate (110) with several stationary finger electrodes (122, 124) arranged one behind the other in a detection direction (y), and a
mass arrangement (130) with a first
seismic mass (140) that is elastically deflectable relative to the substrate (110) in the detection direction (y) and that comprises a first movable
electrode arrangement (150) of several movable finger electrodes (151), and a second
seismic mass (160) that is elastically deflectable relative to the substrate (110) in the detection direction (y) and that comprises a second movable
electrode arrangement (170) of several movable finger electrodes (171). wherein the finger electrodes (151) of the first movable electrode arrangement (150) and the finger electrodes (171) of the second movable electrode arrangement (170) are each alternately in
combing engagement with the finger electrodes (122, 124) of the stationary electrode arrangement (120), wherein the
mass arrangement (130) further comprises a
coupling device (180) mechanically connecting the first
seismic mass (140) with the second seismic
mass (160) in a manner capable of movement, which is configured to cause a deflection of the first seismic mass (140) in a corresponding deflection of the second seismic mass (160) in the respective opposite direction.