The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective
coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective
coating, preferably by dry
plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a
wafer. The protective
coating can be a vacuum vapor-deposited
parylene polymer,
silicon nitride,
metal (e.g. aluminum or
tungsten), a vapor deposited organic material, cynoacrylate, a
carbon film, a self-assembled monolayered material,
perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic
carboxylic acid,
silicon dioxide,
silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a
package; attaching the device to the
package; electrically interconnecting the device to the
package; and substantially removing the protective coating from the sensitive area.