The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective 
coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective 
coating, preferably by dry 
plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a 
wafer. The protective 
coating can be a vacuum vapor-deposited 
parylene polymer, 
silicon nitride, 
metal (e.g. aluminum or 
tungsten), a vapor deposited organic material, cynoacrylate, a 
carbon film, a self-assembled monolayered material, 
perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic 
carboxylic acid, 
silicon dioxide, 
silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a 
package; attaching the device to the 
package; electrically interconnecting the device to the 
package; and substantially removing the protective coating from the sensitive area.