186 results about "Parylene" patented technology

The invention discloses a composite laminated waterproof coating preparation device, and relates to the technical field of multilayer film deposition. A main body adopts a double-layer chamber design, an ALD gas inlet unit and a Parylene gas inlet unit are introduced into the double-layer chamber at the same time, a low-temperature fluid gas inlet unit is connected between the double-layer chamber, a sample needing to be coated is placed on a sample support in the chamber, rapid cooling of the chamber is achieved through low-temperature fluid (such as liquid nitrogen), the cooling waiting time after a coating is deposited is shortened to the maximum extent, and the coating quality is improved. And the preparation efficiency of the composite laminated waterproof coating of the ALD coating and Parylene is improved. And meanwhile, the equipment has a rapid cooling capability, so that the preparation of the composite laminated waterproof coating at different deposition temperatures of the sample can be efficiently realized.

The present invention belongs to the field of plating technology and specifically relates to an ALD-Parylene composite film layer, a deposition device, and a deposition method thereof. By reserving a vacuum gap between a heating plate and the outer wall of a cavity, a barrier is formed to isolate the heating plate from heat conduction to the outside of the cavity as the vacuum degree in the cavity increases during the reaction process, thereby avoiding heat loss caused by direct contact and damage to seals, thereby improving the coating effect. The ALD reaction and the Parylene reaction are combined in the same reaction chamber, and different pipeline designs and time-sharing control are used to form a composite film layer structure of alternating ALD film layers and Parylene film layers on the surface of the substrate. The density of the ALD film layer is conducive to enhancing the water resistance of the film layer and sealing the defects of the original Parylene film layer. The softness of the original coating is maintained, and it will not break when subjected to impact and thermal shock, which is conducive to improving the stability of the film layer.

The invention belongs to the technical field of medical interventional catheters, and particularly relates to a modified parylene-based antibacterial coating and a preparation method thereof, and is characterized in that a monomer molecular structure of a high-molecular compound is formed by carboxyl-containing parylene and parylene N through a gas deposition process together to form a parylene polymer with the surface containing carboxyl, and the modified parylene-based antibacterial coating is prepared from the modified parylene-based antibacterial coating and the preparation method of the modified parylene-based antibacterial coating. Then guanidine salt or antibacterial peptide reacts with carboxyl and is grafted on the parylene polymer coating. The composite material can be applied to the related aspects of biological medicine, has excellent antibacterial and anti-adhesion properties, and also has the beneficial effects of water resistance, moisture resistance, solid lubrication, small friction force, relatively low interface constant and the like; the preparation method is simple and low in cost.

The invention discloses a manufacturing method of a redistribution layer of a packaging substrate and the packaging substrate, and the method comprises the steps: providing a glass core plate, manufacturing conductive through holes, and manufacturing an inner layer circuit which is electrically connected with the glass core plate through the conductive through holes on the glass core plate; depositing a first dielectric layer on the inner layer circuit by adopting a chemical vapor deposition process, wherein the first dielectric layer adopts a parylene material; forming a hole in the first dielectric layer to expose an inner-layer bonding pad of the inner-layer circuit; forming a first seed layer on the first dielectric layer and an inner layer bonding pad of the inner layer circuit; a transition medium layer is formed on the first seed layer, and a first layer wiring pattern is manufactured on the transition medium layer; electroplating a first metal conductive layer on the first layer of wiring pattern; and removing the transition dielectric layer, and removing the exposed first seed layer to form a first redistribution layer electrically connected with the inner layer circuit. Therefore, the problems of uniformity of the dielectric layer of the large-size glass substrate and warping, interlayer separation and the like in layer adding can be solved.

The invention discloses a preparation method of octafluoro [2, 2] parylene dimer, which comprises the following steps: uniformly mixing parylene N monomer, polar organic solvent, photosensitizer and additive to obtain mixed solution; and carrying out light treatment on the mixed solution, and adding a fluorinating reagent into the mixed solution to obtain the octafluoro [2, 2] dimer p-xylene. Starting from the N-type parylene monomer, photochemical reaction byproducts are few, the yield is high, purification is easy, and the N-type parylene monomer is commercialized, cheap and easy to obtain, so that industrialization of the preparation method is easier to realize.

A sensor device including a conductive graphene film covered on at least one side by a graphene support layer of parylene, a detection element configured to sense an environmental change, and an electrode. The parylene repairs some defects of the conductive graphene film without damaging, polluting, or degrading the conductivity of conductive graphene film.

An electronic chip including a semiconductor substrate in and on which an integrated circuit is formed at least one connection metallization of the integrated circuit formed on the side of a front face of the semiconductor substrate and a first passivation layer covering the front face of the semiconductor substrate, the first passivation layer including openings in line with the connection metallization of the integrated circuit The chip having a second passivation layer covering the side flanks of the semiconductor substrate, the second passivation layer being made of a parylene, and the first passivation layer and the second passivation layer being in contact with each other on the side of the front face of the semiconductor substrate. Methods of making a device are also provided.

The present invention provides a method for matching the film formation rate of C-type polyparaxylene dimer, comprising the following steps: S100, constructing a sublimation rate calculation formula, a cracking rate calculation formula, and a film formation rate calculation formula; S200, using the sublimation rate calculation formula, the cracking rate calculation formula, and the film formation rate calculation formula to respectively calculate the sublimation rate, the cracking rate, and the film formation rate, and by adjusting the corresponding sublimation temperature, the cracking temperature, and the film formation temperature, achieving equality of the sublimation rate, the cracking rate, and the film formation rate, thereby achieving speed matching in the film formation process of C-type polyparaxylene dimer. Utilizing the present invention, the film formation efficiency of C-type polyparaxylene dimer can be significantly improved, the product processing time can be shortened by more than 40%, the raw material utilization rate of C-type polyparaxylene dimer can be improved, and the film formation quality of C-type polyparaxylene dimer can be improved, and the C residual substances in the film formation process can be significantly reduced.

The invention provides an organic electrochemical transistor and stimulating electrode array based on PEDOT: PSS and a preparation method thereof. The electrode array comprises an OECT based on PEDOT: PSS and a stimulating electrode with a PEDOT: PSS coating, a PEDOT: PSS channel and the PEDOT: PSS coating which are made of the same modified PEDOT: PSS material are different in thickness, and the material is obtained through the following steps that ionic liquid is taken and diluted with deionized water, the diluted ionic liquid is doped into PEDOT: PSS dispersion liquid, then a cross-linking agent is added, and full stirring is conducted. A pit with submicron depth is etched in a stimulating electrode area on a poly-p-xylylene substrate, only one-time spin coating of a PEDOT: PSS solution is needed, or the poly-p-xylylene substrate is not etched, multiple times of spin coating are carried out through a photoresist mask, and OECT channels and stimulating electrode modified coatings with different thicknesses in an electrode array can be obtained at the same time. And the advantages of high signal-to-noise ratio of the OECT and strong charge injection capability of the modified stimulating electrode can be fully exerted, so that co-optimization of the collection performance of the OECT and the electrical stimulation performance of the stimulating electrode is realized.

The invention relates to the technical field of waterproof plates, and provides a tear-resistant waterproof plate and a preparation method thereof. The tear-resistant waterproof board is prepared from the following raw materials in parts by weight: 30 to 35 parts of ethylene-vinyl acetate copolymer, 60 to 80 parts of tear-resistant master batch, 0.5 to 1.5 parts of first antioxidant and 3 to 4 parts of compatilizer, the tear-resistant master batch comprises the following raw material components in parts by weight: 20-30 parts of high-density polyethylene, 40-50 parts of linear low-density polyethylene, 1-3 parts of a processing aid and 0.5-1 part of a second antioxidant, and the processing aid comprises fluoro-dimer p-xylene and poly-alpha-methylstyrene. By means of the technical scheme, the problem that in the prior art, waterproof plates are insufficient in tear resistance is solved.

The invention belongs to the technical field of biosensing, and particularly relates to a mutual inductance type brain deformation array sensor and a preparation method and application thereof. According to the invention, a metal material or a conductive polymer is used as a conductive material, an elastomer or parylene is used as an insulating material, an insulating layer-conductive coil-insulating layer sandwich film unit is prepared by micro-nano processing and the like, and a plurality of coil units are connected into a sensing coil array through the insulating layers. The change of tiny deformation of the brain tissue can be effectively detected, so that the method can be used for continuous real-time detection and imaging of the deformation of the brain tissue; the sensor is based on the mutual inductance principle, realizes the time resolution of less than 100 microseconds and the resolution of less than 5 microns according to the corresponding relation between the output voltage and the distance, and has very strong anti-interference capability on the change of cerebrospinal fluid components; according to the sensor, by changing the size and arrangement of the coil units, the detection requirements of to-be-detected objects of different body types and different scenes can be met.

The present disclosure is related to a method of producing a capsule. The method includes providing a mold, depositing parylene on the mold to form a parylene layer, scoring the parylene layer, and coating the parylene layer with a polymer to produce a capsule.

The invention discloses a film coating system and a film coating method, and belongs to the technical field of film coating. The coating system comprises a reaction cavity and a gas inlet device, the gas inlet device is provided with two branch distribution pipes, a plurality of cavity gas inlet pipes correspondingly distributed in the height direction of the cavity are arranged on the two branch distribution pipes respectively, and the flow directions of gas in the two branch distribution pipes are opposite. The pipe diameter of the cavity gas inlet pipe on each branch distribution pipe is gradually increased along the gas flow direction, and the pipe diameter sequences on the two pipes are reversed. According to the ALD and parylene integrated coating device, through the structure of the double branch pipes with the opposite flow directions and the reversed-order increasing pipe diameters, the problem that gas distribution in the vertical direction in large-size ALD and parylene integrated coating equipment is not uniform is effectively solved, the excellent uniformity of ALD coating thickness on a base material is achieved, the coating quality and batch consistency are remarkably improved, precursor raw materials are saved, and the production cost is reduced. And complete conformal deposition of the parylene layer is ensured, so that the coating performance of the system and the overall process efficiency are synergistically enhanced.

The invention relates to a parylene copolymer material and a method for improving the adhesive force of a parylene film. According to the invention, a conventional parylene monomer and a parylene H monomer are subjected to chemical vapor deposition copolymerization to prepare the parylene copolymerization material. The invention further provides a method for improving the adhesive force of the parylene film, and the method comprises the following steps: putting a pre-cleaned base material into a deposition chamber for later use; the method comprises the following steps: mixing a conventional parylene monomer to be plated with a parylene H monomer, and putting the mixture into an evaporation chamber; under the condition that the vacuum degree is-10 Pa to-0.5 Pa, a conventional parylene monomer and a parylene H monomer in the evaporation chamber are evaporated, after pyrolysis is conducted through the cracking furnace, deposition is conducted on a base material in the deposition chamber, and the parylene film is formed. According to the method, the adhesive force of the parylene material is greatly improved, and meanwhile, the uniformity and the surface smoothness of the film are kept.

Specific embodiments of the present invention provide a coating and a preparation method therefor. The coating comprises a coating I, wherein the coating I is a polymerized coating obtained by depositing, on the surface of a base material, by means of a chemical reaction, an organic monomer simultaneously having a carbon-carbon double bond structural unit, a carbon-carbon triple bond structural unit or an epoxy structural unit, and an epoxy structural unit or an aromatic ring structural unit, and / or an organic monomer having at least two carbon-carbon unsaturated bonds and a parylene active monomer that has been subjected to high-temperature pyrolysis. The coating overcomes the problems of the relatively single range of surface energy and greatly limited application scenarios of existing parylene protective coatings.

The invention provides a chip self-destruction device and a manufacturing method. The chip self-destruction device comprises a chip, a through silicon via, a silicon dioxide layer, a metal micro heater layer, a first poly-p-xylylene layer, a second poly-p-xylylene layer and a backboard layer, the through silicon vias are arranged in the thickness direction of the chip; the chip groove structure is arranged on the back surface of the chip and is positioned between the adjacent through silicon vias; the silicon dioxide layer, the metal micro heater layer, the first poly-p-xylylene layer, the second poly-p-xylylene layer and the backboard layer are sequentially arranged in the direction from the active surface of the chip to the back surface of the chip; the silicon dioxide layer covers the back surface of the chip and the interior of a groove of the groove structure of the chip; the second poly-p-xylylene layer covers the first poly-p-xylylene layer and the opening direction of the chip groove structure, the chip groove structure is sealed into a sealing groove, and filler is arranged in the sealing groove; and the back plate layer covers the surface of the second poly-p-xylylene layer. Therefore, the purpose of effective self-destruction of the chip through the small-size self-destruction device is achieved.

The invention belongs to the technical field of MEMS loudspeakers, and particularly relates to a preparation method of a PZT loudspeaker based on a back guide structure. Comprising the steps that a bottom electrode metal film and a PZT piezoelectric film are sequentially sputtered on the front face of a device at high temperature through a magnetron sputtering PVD technology; performing a bottom electrode layer structure photoetching process; performing a top electrode layer photoetching process; performing an upper and lower electrode isolation layer photoetching process, performing a front surface back guide hole structure photoetching process, and etching a top silicon layer of the SOI substrate material sheet through ICP (Inductively Coupled Plasma) to form a device back guide hole structure; depositing a Parylene protection material on the front side by a vacuum vapor deposition process; and performing a back photoetching process, and etching the back of the SOI substrate material sheet through ICP (Inductively Coupled Plasma) to form a device diaphragm cavity structure. According to the invention, the air circulation resistance of the rear cavity can be accurately controlled, the quality-spring property of the diaphragm can be matched, the rigidity and damping of the diaphragm can be balanced, the resonance peak can be effectively reduced, the low-frequency response bandwidth can be expanded, and the SPL can be improved.

The invention provides a magnetic response muscle bionic anti-icing substrate and a preparation method thereof, and belongs to the technical field of anti-icing materials. According to the anti-icing base plate, human muscles are simulated, an elastomer driving material is used for simulating muscles, a high-hardness parylene restraint layer is used for simulating human epidermis, and contraction and relaxation of the elastomer material are controllably triggered through magnetic response of magnetic particles arranged in an elastomer, so that macroscopic lines are generated on the surface, and the anti-icing effect is achieved. And the contact area between ice-solid interfaces is changed, so that the adhesion strength between ice and the surface of the substrate is reduced, and the ice layer falls off.

The invention relates to a protective coating and a preparation method and application thereof.The preparation method of the protective coating comprises the following steps that 1, a disilane coupling agent, a monosilane coupling agent containing carbon-carbon double bonds, ethyl alcohol, water and an optional pH regulator are mixed, the volume ratio of the disilane coupling agent to the monosilane coupling agent containing the carbon-carbon double bonds is (3-10): 1, and the mixture is stirred to be uniform; a composite silane solution is obtained; (2) mixing a monosilane coupling agent containing carbon-carbon double bonds, ethanol, water and an optional pH regulator to obtain a monosilane solution; and (3) dip-coating the base material subjected to alkali treatment with the composite silane solution prepared in the step (1), drying for the first time, dip-coating the base material with the monosilane solution prepared in the step (2), drying for the second time, and depositing a poly-p-xylylene layer to form the protective coating, the binding force between the protective coating and the base material is high, the adhesion effect on the base material is good, and the stability between batches is good.

The application discloses a super-flexible friction sensor and a preparation method and application thereof, and belongs to the technical field of flexible electronics. The super-flexible friction sensor comprises a sensing layer; the sensing layer comprises a substrate, a first conductive layer, a photoresist layer, an insulating polymer layer and a second conductive layer which are sequentially stacked; the material of the substrate comprises poly-p-xylylene, and the thickness of the substrate is 0.1-3 microns; and the thickness of the super-flexible friction sensor is 20-40 microns. Compared with a conventional friction sensor, the super-flexible friction sensor has smaller thickness, and is more flexible and sensitive. The application further provides a preparation method and application of the super-flexible friction sensor.

A guidewire driven brain-computer interface system for minimally invasive implantation is provided that includes a flexible electrode array and a plurality of flexible guidewires attached to the flexible electrode array. The flexible electrode array comprises a plurality of insulated poly-p-xylylene-C layers, metal interconnection lines and electrodes. The plurality of flexible guidewires are configured to be guided by an external mechanical force such that the flexible electrode array passes through a craniotomy field and is deployed by tracking the plurality of flexible guidewires. The flexible guidewires each include a manipulation tip and a pull wire.

The invention belongs to the technical field of power supplies, and discloses a vacuum coating protection process of an immersed liquid cooling power supply and application of the vacuum coating protection process. Before vacuum coating of the power supply, a shell needs to be detached for surface cleaning, solvent cleaning, dry ice cleaning and manual cleaning can be adopted as cleaning modes, and after cleaning, the power supply needs to be baked to ensure that a cleaning agent is completely volatilized; open type components comprise various connector terminals, AC sockets, golden fingers and other components with exposed PINs and capable of making contact with the outside, shielding protection needs to be conducted on the open type components before vacuum coating, a protective film layer is deposited on a power source after pretreatment is completed through the vacuum coating technology, the film layer can be made of poly-p-xylylene, silicon nitride and the like, and the vacuum coating technology is adopted for vacuum coating. Plasma chemical vapor deposition (PECVD) is adopted in the coating process, the thickness of a film layer is 5-30 microns, multiple times of deposition can be achieved, and the thickness is increased. The beneficial effects of the invention are that the insulation performance and the waterproof, oil-proof and anti-corrosion capabilities of the body are enhanced, and the reliability of the power supply in an immersed liquid cooling environment is improved.

The present invention provides an indirect flat-panel detector and a preparation method thereof, comprising: a substrate; a lower electrode layer; an organic light conversion layer, wherein the raw materials for the preparation thereof include a P-type organic photoelectric material, an N-type organic photoelectric material and an organic solvent for dissolving the P-type organic photoelectric material and the N-type organic photoelectric material; an upper electrode layer; a packaging layer, wherein the first packaging layer and the second packaging layer are alternately stacked in at least two groups, wherein the material of the first packaging layer includes parylene or polyimide, and the material of the second packaging layer includes aluminum oxide, silicon dioxide or silicon nitride; and a scintillator layer, wherein the material includes Ca 1‑x Sr x I2 or Ca 1‑x Sr x I2:yEu 2+ , where 0≤x≤1, 0.01%≤y≤5%. Using an organic light conversion layer and combining Ca 1‑x Sr x I2 or Ca 1‑x Sr x I2:yEu 2+ The scintillator layer of the material effectively improves the light response of the indirect flat-panel detector, greatly improves the sensitivity of the flat-panel detector, and enables the flat-panel detector to be used in low-dose application scenarios; in addition, by setting the encapsulation layer, damage to the organic light conversion layer when forming the scintillator layer can be effectively prevented.

The invention discloses a para-xylene ring dimer derivative for preparing a parylene film, and a preparation method and application thereof, and specifically relates to a 4,16-bis(trifluoromethyl)-[2,2]-para-xylene ring dimer, wherein the preparation method comprises the following steps: S1, reacting 4-methyl-2-(trifluoromethyl)benzoic acid with a reducing agent in the presence of a solvent to obtain an intermediate 1; S2, reacting the intermediate 1 with a chlorinating agent in the presence of a solvent to obtain an intermediate 2; S3, reacting the intermediate 2 with an organic amine in the presence of a solvent to obtain an intermediate 3; S4, reacting the intermediate 3 with an alkaline agent in the presence of an inhibitor and a solvent to obtain 4,16-bis(trifluoromethyl)-[2,2]-para-xylene ring dimer. The parylene film prepared from the compound as a monomer exhibits high hydrophobicity, is superior to the currently best commercially available waterproof parylene AF4, and has a low preparation cost, and has good application prospects in terms of protective materials.

The utility model provides a vibrating diaphragm and a thermoacoustic film loudspeaker, and belongs to the technical field of loudspeakers. The vibrating diaphragm comprises a poly-p-xylylene substrate, a polylysine bonding layer and an MXene surface layer which are sequentially stacked. Compared with a vibrating diaphragm in the prior art, the vibrating diaphragm provided by the utility model is better in sound performance.

Provided are a method for manufacturing a liquid ejection head chip, a liquid ejection head chip, a liquid ejection head, and a liquid ejection recording apparatus. The man-hour for removing a protective film such as a parylene film of an unnecessary portion is reduced. A method for manufacturing a head chip according to one aspect of the present disclosure includes: a substrate preparation step of preparing an actuator plate substrate having an ejection passage communicating with a nozzle hole for ejecting ink and a non-ejection passage that does not eject ink; and a protective film formation step of forming, after the substrate preparation step, a protective film that protects a common electrode formed on an inner surface of the ejection passage from the influence of ink in a state where the ejection passage is exposed and the non-ejection passage is covered.

The present invention provides a flexible sensor for deep brain detection in humans and non-human primates, comprising a flexible electrode and a flexible printed circuit board (flexible PCB); wherein the flexible electrode includes an implantation end and a pad area, the length of the implantation end is 50–70 millimeters, detection sites are distributed thereon, pads are distributed in the pad area, the detection sites are used for detecting nerve signals, the pads are used for welding with the flexible PCB, and the detection sites and the pads are connected by wires; the hierarchical structure of the flexible electrode includes a base layer, a conductive layer and an insulating layer, wherein the base layer and the insulating layer are parylene flexible films, and the conductive layer is composed of a chromium layer and a gold layer. The present invention also discloses a welding method for the flexible sensor, which uses a method of spot hot melting of solder to weld the flexible electrode and the flexible PCB. This welding method can achieve precise alignment and tight connection of the solder joints, the conduction rate of the sensor is good, and it can avoid the rupture and deformation of the flexible sensor. The flexible sensor prepared by the present invention has strong flexibility, high transparency, and small implantation damage, and can detect the brain nerve signals of humans and non-human primates for a long time.

A bearing shell (2) for a ball joint (1) includes a shell component (11) made from a first material, such that the shell component (11) has a ball segment shaped receiving space (6) into which a joint ball (4) is fitted and can swivel. An inner side (12) of the shell component (11) is coated with a second material to form a low-friction layer (13). To improve the sliding friction properties between the joint ball (4) and the bearing shell (2) and to reduce the friction between them, the bearing shell (2) is characterized in that the second material is parylene.

The embodiment of the invention relates to the field of solar cell photovoltaic technology, and provides a flexible perovskite solar cell and a preparation method thereof, and the preparation method of the flexible perovskite solar cell comprises the steps: providing a bearing substrate; forming a poly-p-xylylene layer on the bearing substrate by adopting a chemical vapor deposition process; a laminated structure is formed on the surface, away from the bearing substrate, of the poly-p-xylylene layer, the laminated structure at least comprises a perovskite layer, a first electrode layer and a second electrode layer, the first electrode layer and the second electrode layer are located on the two opposite sides of the perovskite layer, and the first electrode layer is located between the poly-p-xylylene layer and the perovskite layer; after the laminated structure is formed, a stripping process is performed to strip the carrier substrate from the poly-p-xylylene layer. According to the embodiment of the invention, at least the preparation cost of the flexible perovskite solar cell can be reduced, and the performance and preparation efficiency of the flexible perovskite solar cell can be improved.

The invention relates to a bearing sleeve (2) for a ball joint (1), comprising a sleeve shell part (11) made of a first material, said sleeve shell part (11) forming a receiving space (6) in the shape of a truncated sphere for the articulated mounting of a joint ball (4), the inner side (12) of the housing part (11) has a coating made of a second material to form a sliding layer (13). In order to improve the sliding behavior between the joint ball (4) and the bearing sleeve (2) or to reduce friction, the bearing sleeve (2) is characterized in that the second material is parylene.