66 results about "Microfabrication" patented technology

This application discloses a gas sensor and electronic device. The gas sensor includes a substrate, a micro-hot plate, and a microphone. At least one of the micro-hot plate and the microphone is disposed on the substrate. The micro-hot plate includes a heating element, and a thermoacoustic cavity is formed around the heating element. The microphone has a sensing cavity, with the sensing surface of the microphone facing the sensing cavity, and the sensing cavity communicating with the thermoacoustic cavity. The micro-hot plate also includes a first substrate and a heat insulation layer stacked together. The first substrate has a first through-hole, and the heating element is located within the heat insulation layer. Thus, the gas sensor of this embodiment, through the coordinated operation of the micro-hot plate and the microphone, can accurately detect the composition and concentration of gas using the thermoacoustic effect. Furthermore, it is fabricated using microfabrication technology, making it easy to integrate into various micro-devices and possessing broad application prospects.

Microfabrication process with the following steps: Providing a structure (800) comprising a layer stack (30, 40, 50) containing, from bottom to top, a first silicon oxide layer (30), a stoichiometric silicon nitride layer (40), and a second silicon oxide layer (50), and a conductive material part (20) below the layer stack (30, 40, 50) and above a substrate (10); Producing a patterned etch mask layer (57) having an opening through this layer over the layer stack (30, 40, 50); and Producing a via cavity (59) extending through the layer stack (30, 40, 50) and downwards to a top side of the conductive material part (20) by isotropic etching of parts of the second silicon oxide layer (50), the silicon nitride layer (40) and the first silicon oxide layer (30) with an isotropic etching process in which an etch rate of the silicon nitride layer (40) is 1 / 10 to 1 / 2 of the etch rate of the first silicon oxide layer (30), wherein: the first silicon oxide layer (30) comprises a first silicon oxide material produced by decomposition of tetraethyl orthosilicate, the stoichiometric silicon nitride layer (40) is produced by chemical vapor deposition at a temperature of less than 300°C, in which a silicon precursor gas and a nitrogen precursor gas are used together to produce a silicon nitride material, and the second silicon oxide layer (50) comprises a second silicon oxide material produced by decomposition of tetraethyl orthosilicate.

A method of microfabrication includes forming a sacrificial layer over a film. A resist layer is formed over the sacrificial layer. The resist layer includes an extreme ultraviolet (EUV) resist. A pattern is formed in the resist layer by an EUV exposure and a wet etch followed by rinsing and drying, resulting in uncovered portions of the sacrificial layer. The uncovered portions of the sacrificial layer are treated. The pattern is transferred from the resist layer to the film by performing an etch process.

The invention relates to a stimulation module combining galvanic and electromagnetic stimulation, consisting of a housing having: • two electrodes positioned to come into contact with the mastoids of the user and connected to a source of electric current, one of the electrodes being active, the other of the electrodes being passive • at least one electromagnetic coil for generating electromagnetic stimulation without contact, formed on an electrically insulating substrate, the substrate being associated with a heat sink • two separate compartments for housing, on the one hand, the electrical stimulation circuit connected to the electrodes and, on the other hand, the electromagnetic stimulation circuit supplying the coil • an electronic control circuit for controlling the sequences of electrical and electromagnetic stimulation, including a Bluetooth module for receiving remote control signals of the stimulation parameters.

The invention relates to the technical field of micromachining and surface engineering, and discloses a variable cross-section sampling needle tube inner wall electrochemical discharge additive and subtractive material synergistic preparation method which comprises the following steps: adsorbing magnetic nano powder to a magnet electrode handle to assemble a flexible tool electrode; the flexible tool electrode is inserted into a sampling needle tube injected with electrolyte containing silver nitrate and low-surface-energy substances, a local thermal field is generated through electrochemical discharge, and the flexible tool electrode is extruded in a reducing area to force powder to be rearranged to actively adapt to pore diameter changes. According to the method, the micro-nano nested structure is etched through electrochemical discharge, the recast layer is removed through mechanical grinding of adsorbed magnetic nano powder, antibacterial particles and low-surface-energy substances are induced to be co-deposited in situ through a discharge thermal field, and the silver antibacterial coating is formed in the micro-nano nested structure. The integrated cooperation of variable cross-section deep hole inner wall material removal, surface finishing and functional coating preparation is realized, and the inner wall of the sampling needle tube is endowed with hydrophobic and antibacterial properties.

The invention discloses a preparation method of a fine structure surface RB-SiC friction pair based on throttling expansion self-suction type multiphase jet flow, and aims to solve the technical problems of poor uniformity and easy generation of microcracks in fine machining of an RB-SiC material. According to the method, negative pressure is formed through the throttling expansion effect generated when micron diamond gas jet flows through a Laval nozzle, nano diamond slurry with the shear thinning characteristic is automatically sucked in, and cell type diamond cluster abrasive multiphase jet is formed through online mixing; when the surface of a workpiece is impacted, grinding material clusters are depolymerized, uniform fragile region erosion of the material is achieved through the micron diamond, flexible finishing is conducted by means of ploughing and micro-cutting effects of the nano diamond, and therefore generation of micro cracks is synergistically inhibited. And in combination with a mask plate technology, the preparation of the high-quality fine structure surface is finally realized. Through the synergistic effect of multi-phase jet flow online mixing and cell type grinding materials, the quality of the machined surface is remarkably improved, and the method is suitable for preparing the high-performance RB-SiC friction pair.

A method of microfabrication is provided. The method includes providing a wafer including a dielectric layer having an opening formed in the dielectric layer. The opening includes a bottom and a sidewall. A buffer film is formed along the bottom and the sidewall of the opening. A metal material is formed over the buffer film to fill the opening. A first coefficient of thermal expansion (CTE) α1 of the dielectric layer is larger than a second CTE α2 of the buffer film, which is larger than a third CTE α3 of the metal material.

The invention relates to the technical field of piezoelectric micropump devices, and discloses a piezoelectric micropump device based on an MEMS technology, which comprises a pump body, a pump cavity arranged in the pump body, a one-way valve arranged on one side in the pump cavity, an outlet valve arranged on the other side in the pump cavity, and a PZT film actuating structure arranged in the inner cavity of the pump cavity. According to the piezoelectric micropump device based on the MEMS technology, the pump cavity, the inlet flow channel, the outlet flow channel and the valve structure are integrally formed on the pump body through the MEMS micromachining technology, sealing packaging is achieved through the bonding or bonding technology by combining the upper diaphragm and the lower diaphragm, the integration degree and the structural stability of the device are improved, the one-way valve is arranged at the inlet end, and the one-way valve is arranged at the outlet end; a valve column can move up and down, the valve column is lifted to open an inlet channel when the pressure in a pump cavity is reduced, the valve column is pressed to close the inlet channel when the pressure is increased, and an outlet valve is arranged at an outlet end, is of a flexible diaphragm type structure and deforms downwards to open an outlet channel when the pressure in the pump cavity is increased.

The utility model relates to the technical field of bioengineering, and provides an array chip integrating impedance measurement and microscopic observation, which comprises a transparent substrate, a circuit board, a 3D printing board and an electrode unit, and one side of the transparent substrate is provided with a conductive film; the circuit board is arranged on the conductive film, and a plurality of micro-channels are arranged on the circuit board in an array manner; the 3D printing plate is arranged on the side, away from the conductive film, of the circuit board, a plurality of micro-cavities are arranged on the 3D printing plate in an array mode, and the positions of the micro-cavities correspond to the positions of the micro-channels one to one; the electrode unit comprises a first electrode plate and a second electrode plate, the 3D printing plate is covered with the first electrode plate, the circuit board is surrounded by the second electrode plate, and the second electrode plate and the first electrode plate form a closed loop through a conductive film. Through innovative fusion of micromachining and bioelectrochemistry, synchronization of electrophysiology (impedance) and morphology (microscopy) is realized, and the dynamic growth process of organisms is conveniently and continuously monitored.

The present application relates to a resonator and an electronic device. A high and low acoustic impedance alternating layer, a bottom temperature coefficient of frequency compensation layer, a bottom electrode layer, a piezoelectric layer, a top electrode layer and a top temperature coefficient of frequency compensation layer are sequentially stacked on a substrate by using a specific microfabrication process, to form a new resonator. The resonator can simultaneously show excellent characteristics of low loss, wide bandwidth, low temperature sensitivity and a small size through the special stack geometry, thereby having better operation reliability.

Thin films for developing array patterns and processes for their manufacture. The present invention relates to thin films for developing array patterns and processes for their manufacture. The thin films of the present invention have strong adhesion, improved oxidation resistance, etch compatibility with standard microfabrication techniques, and excellent electrical conductivity. Furthermore, the thin films of the present invention are stable at high temperatures in oxygen. Furthermore, the present invention relates to a simple and economical process for manufacturing thin films for developing array patterns.

A method for microfabrication of a three-dimensional transistor stack with a gate-all-around field-effect transistor device. Channels are suspended between source and drain regions. Each channel is selectively deposited with a material layer designed to adjust the threshold voltage of the channel. These layers can be oxides, high-k materials, work function materials, and metallizations. The three-dimensional transistor stack forms an array of high-threshold-voltage devices and low-threshold-voltage devices in a single package.

Battery component structures and manufacturing methods for solid-state battery cells include a unitary Li ion conducting sulfide glass solid electrolyte structure that serves as the basic building block around which a solid-state battery cell can be fabricated. The unitary glass structure approach can leverage precision controlled high throughput processes from the semiconductor industry that have been inventively modified as disclosed herein for processing a sulfide glass solid electrolyte substrate into a unitary Li ion conducting glass structure, for example, by using etching and lithographic photoresist formulations and methods. The glass substrate may be precision engineered to effectuate a dense glass portion and a porous glass portion that can be characterized as sublayers having predetermined thicknesses. The porous glass sublayer includes a plurality of discrete substantially vertical closed-end holes or trenches that are precision engineered into one or both major substrate surfaces using microfabrication processes.

The application provides a sequencing chip based on a solid-state nanopore array and a preparation method thereof. The chip comprises, from bottom to top, a silicon substrate, a first dielectric layer, a second dielectric layer and a plurality of electrodes, the materials of the first dielectric layer and the second dielectric layer are different; a plurality of independent sample cavities are formed in the silicon substrate and penetrate the silicon substrate; a plurality of nanopores are formed in the first dielectric layer and penetrate the first dielectric layer; a plurality of cavities are formed in the second dielectric layer and penetrate the second dielectric layer; the plurality of independent sample cavities, the plurality of nanopores, the plurality of cavities and the plurality of electrodes are arranged one by one in a one-to-one correspondence; the plurality of electrodes are arranged in a corresponding manner in the plurality of cavities and the surface of the second dielectric layer, and meanwhile, a part of each electrode exposed in a corresponding cavity forms a bridge-shaped structure. The chip is based on a mature silicon microfabrication process combined with the breakdown principle of dielectric materials, has small and controllable process fluctuation, low cost and simple process, is suitable for controllable large-scale parallel formation of a nanopore array, and is thus suitable for industrial mass production.

A microfabrication method comprises the steps of: providing a substrate having an existing pattern of features formed within a first layer; depositing a selective adhesive on the substrate (wherein the selective adhesive is attached to the features and includes a solubility-converting agent); depositing a first resist on the substrate; activating the solubility-converting agent so that a portion of the first resist on the features is dissolved in a first developer; developing the first resist using a first developer to form a relief pattern having an opening that exposes the features of the existing layer; growing a selective growth material on the features and within the opening of the relief pattern to provide a self-aligned selective growth feature; removing the first resist; depositing a fill layer on the substrate; and repeating the steps a predetermined number of times to provide a stacked device having a predetermined number of levels.

Disclosed herein is an implantable or wearable, flexible, miniaturized microimaging suited for localized brain fluorescent imaging. The microimaging device is implemented on a Parylene photonics platform, which is biocompatible and fabricated using scalable planar microfabrication techniques, enabling customizable design, size, and number of channels (pixels). Operating across the entire visible spectrum. The microimaging device functions effectively both for coherent and scattered light. The microimaging device can be implanted into the brain of freely moving animals, where one or more waveguides could be dedicated to light delivery and the rest of the waveguides for collecting and relaying the fluorescent image to image the tissue structure and function.

The present invention relates to a method for microfabrication of a glass substrate, and provides a method for microfabrication of a glass substrate, the method being characterized by comprising: a step for preparing a glass substrate; a step for forming a micro-hole penetrating the glass substrate through a laser treatment and an etching process; and a step for performing operations for adjusting the thickness and improving the surface of the glass substrate having the micro-hole formed therein.

The invention provides a tungsten needle electrochemical corrosion microchannel control method and system, and relates to the technical field of micromachining and electrochemical corrosion precision control, and the method comprises the following steps: obtaining corrosion state characteristic data and a boundary characteristic image of a microchannel in a tungsten needle electrochemical corrosion process; based on the boundary feature image of the microchannel, generating structural integrity data; fusing the corrosion state characteristic data and the structural integrity data to form comprehensive state data, and performing time sequence correlation analysis on the comprehensive state data to predict a depth change sequence of the micro-channel; and based on the depth change sequence of the microchannel, a corrosion parameter matching degree is calculated by combining a deep learning controller, corrosion control parameters for optimizing the morphology of the microchannel are generated based on the corrosion parameter matching degree, and the corrosion process of the microchannel is controlled through the corrosion control parameters. According to the method, the morphology control precision and the process stability of micro-channel preparation are improved.

This invention provides a miniature shape memory alloy wire drive component and its fabrication method, relating to the fields of microfabrication and shape memory alloy application technology. The fabrication method includes: spirally winding a shape memory alloy wire with a diameter of 0.03-0.08 mm onto the outer circumference of a miniature metal component to form at least one winding segment; applying an axial pre-tension force of 0.05-0.2 N to the alloy wire to maintain tension; and finally, using a pulsed laser to perform multi-point welding at the contact area between the winding segment and the component. This structure utilizes the geometric self-locking effect formed by winding, combined with the metallurgical bonding of laser welding, to achieve a dual connection of mechanical and electrical components. Examples show that the tensile strength of the weld joints of the drive component prepared by this method can reach 82% of the strength of the base material, and it exhibits excellent thermal cycling resistance and low contact resistance characteristics.

This invention discloses a thin film with a multi-level microstructure surface, its preparation method, and its applications, belonging to the field of thin film microstructure construction technology. This invention is the first to apply the dynamic behavior of fluids during stretching motion to the construction of multi-level microstructures on a thin film surface. Compared to traditional microfabrication techniques, the stretch flow curing method's most significant advantage lies in its extremely simplified process flow and high flexibility. The entire preparation process includes only two key stages—stretch flow molding and curing—significantly reducing equipment complexity and operational difficulty. The stretch flow curing method not only provides a novel, efficient, and low-cost solution for surface microstructure fabrication but also demonstrates broad application potential in functional thin films, flexible electronics, optical coatings, biointerfaces, and microfluidic devices.

A method of microfabrication includes providing a first relief pattern on a target layer, wherein the first relief pattern comprises a first resist having a first etch selectivity, coating the first relief pattern with a solubility-shifting agent, depositing a second resist on the first relief pattern, wherein the second resist has a second etch selectivity that is different from the first etch selectivity, diffusing the solubility-shifting agent into the second resist to provide a solubility-shifted region of the second resist, developing the second resist such that the solubility-shifted region is dissolved providing gaps between the first relief pattern and the second resist where a portion of the target layer is exposed, and filling the gaps between the first relief pattern and the second resist with a fill material.

The application belongs to the technical field of urea nitrogen detection, and particularly relates to an integrated microfluidic chip device and method for detecting urea nitrogen; wherein a cover plate is bonded to a main plate, and the main plate is bonded to a base plate; the main plate is provided with a light path channel, a micro flow channel, a reaction chamber, a sample chamber, a control chamber and a groove; a photoelectric detector is fixed in the groove, an LED light source, a lens, a spectroscope and a reflecting mirror are fixed in the light path channel, the sample chamber and the reaction chamber are communicated through the micro flow channel, and the sample chamber and the outside are communicated through the micro flow channel; the cover plate is etched with an injection port communicated with the reaction chamber and the control chamber; the application adopts the microfluidic analysis chip idea, and through microfabrication technology, functional elements such as the LED light source, the lens, the spectroscope, the reflecting mirror, the reaction chamber, the sample chamber, the control chamber, the micro flow channel, the photoelectric detector and the main control chip are integrated on the chip like integrated circuits, and the idea of transferring the functions of the whole laboratory to the chip is concentratedly embodied.

The present disclosure provides methods of manufacturing porous silicon structures having controlled sizes, shapes, and porosity by using a series of protective layers and selective etching steps. A benefit of the methods disclosed herein can be providing microfabrication and nanofabrication methods that are capable of provide porous silicon structures having sizes, shapes, and porosity that are more tightly controlled by avoiding inadvertently etching parts of the silicon structures during the fabrication process.

The present application belongs to the field of precision microfabrication, and discloses a microstructure substrate film forming method combining ultrasonic oscillation and doctor blade coating, comprising the following steps: positioning and fixing the microstructure substrate; improving the wettability of the microstructure substrate; removing the excess solution on the microstructure substrate and leveling the liquid film. The microstructure substrate is immersed into the solution in the ultrasonic instrument, the solution is oscillated by the amplitude and frequency of the ultrasonic wave, the contact angle of the solution at the bottom of the microstructure is reduced by the hysteresis effect of the contact angle, and the air layer at the bottom of the microstructure is removed by the cavitation effect of the ultrasonic wave, so as to enhance the wettability of the solution to the bottom of the microstructure. The wettability of the solution to the microstructure substrate is effectively improved, the problems of poor wettability of the solution to the bottom of the microstructure, multiple repetitive operations and long process in the existing single wet coating method are overcome, and the thin film with high coverage, ideal film thickness and uniformity is prepared on the microstructure substrate.

A method including: collecting first processing tool machine data from a first processing tool while treating semiconductor substrates, the first processing tool machine data including process data and operational codes associated with one or more discrete intervals of time during the treatments, training a first neural network with the first processing tool machine data from the first processing tool, and generating a first output indicative of a fault of the first processing tool from the first neural network, based, at least in part, on applying subsequent machine data from at least one processing tool.

The application provides a monolithic integrated multifunctional composite sensor and a preparation method thereof, and adopts single-silicon single-surface silicon microfabrication technology to predefine and cover a first micro groove of a gas flow sensing unit, to form a pressure reference cavity and a pressure sensitive diaphragm first, to predefine a single-crystal silicon thermocouple arm and a heating resistor pattern through the first micro groove and a side wall protection, to protect the pressure sensing unit through a heat insulation medium layer, to form a heat insulation cavity and a temperature sensing unit, to finally realize integration of the gas flow sensing unit, the pressure sensing unit and the temperature sensing unit on the same monolithic wafer, and to realize the structure of the heat insulation cavity and the pressure reference cavity in the same single-crystal silicon substrate. The method replaces traditional double-sided processing technology, solves the problem that a traditional composite chip is difficult to realize small size, avoids a complex process caused by a traditional silicon-silicon or silicon-glass bonding structure, greatly reduces process difficulty and cost, improves the yield of the composite chip, and improves the reliability of the sensor.

A microfluidic detection test paper chip, comprising a substrate, a microfluidic channel, and a dot array arranged reagent block, the microfluidic channel and the dot array arranged reagent block are arranged on the substrate, and are used for detecting enzymes, chemicals, proteins, polypeptides, amino acids, nucleic acids, and exosome components in a liquid sample; a syringe is used to inject a sample or a reagent into the microfluidic channel and infiltrate the reagent block; a color reaction is completed in the reagent block; color reaction data of the dot array arranged reagent block is scanned by an optical sensor to obtain a detection result, wherein the microfluidic channel and the reagent block are manufactured by using a microfabrication process, the reagent block is printed into a dot array arranged groove formed by the substrate and the microfluidic channel, and thus a micro-specimen multi-index analysis and detection effect is achieved.

This invention discloses a fully electrostatically focused planar integrable microstrip slow-wave traveling wave tube. This invention uses an electric field generated by electrodes produced by microfabrication technology to replace the magnetic focusing commonly used in vacuum devices. Under the action of the electrodes, the electron beam is subjected to attraction or repulsion forces from electrodes of different polarities. Due to the periodic changes in electrode potential, the particles alternately focus and defocus in the x and y directions, but the fluctuations in the z-direction of propagation remain within a certain range. By matching the electrode period with the period of the microstrip slow-wave structure, a periodic electrostatic potential well is formed in the longitudinal direction, thereby achieving stable constraint and dynamic control of the electron beam, completing the fully electrostatic focusing of the electron beam in the traveling wave tube.

Information handling systems are transported to a selected of plural micro manufacturing centers for harvesting of component modules to reuse in remanufactured information handling systems through an automated process that uses a robotic arm to harvest the component modules and rebuild the information handling systems. Component module health lifecycle information is applied to select components for harvesting. Carbon footprint, energy consumption, costs, any manual labor involved and time criticality are factored to select a geographical location to harvest the component modules and to send the system to subsequent end user locations.

In some embodiments, methods for fabricating micro-LEDs may include bonding a semiconductor wafer to a Complementary Metal-Oxide-Semiconductor (CMOS) wafer via one or more adhesive layers, etching the LED epilayer and the one or more adhesive layers to form a plurality of micro-LED structures, and fabricating an electrode layer on the plurality of micro-LED structures. The semiconductor wafer may include an LED epilayer including an n-GaN layer, a p-GaN layer, and an active layer positioned between the n-GaN layer and the p-GaN layer. Prior to the bonding of the semiconductor layer to the CMOS wafer, a stress release pattern may be formed in the LED epilayer. The stress release pattern may include a plurality of geometrical shapes (e.g., squares, rectangles, hexagons, rings, etc.) that may facilitate the release of mechanical stresses induced during the subsequent processing of the semiconductor wafer and / or the fabrication of the micro-LEDs.