54results about "3D structure electroforming" patented technology

The invention relates to a jet flow electrochemical deposition rate self-adaptive control method and system, and belongs to the technical field, and the method comprises the steps: carrying out the physical field model construction of collected data through a digital twinning technology, and constructing a jet flow electrochemical deposition rate self-adaptive control model based on deep learning and a physical model; therefore, optimized working parameters of the chemical additive manufacturing equipment are generated through the jet flow electrochemical deposition rate self-adaptive control model, a visualization system is constructed based on the collected data, and finally interaction control is conducted on the chemical additive manufacturing equipment through the visualization system. According to the method, a high-fidelity virtual model which synchronously runs with physical equipment is created, and before a complex spiral structure is printed, full-process simulation can be performed in a digital twinning body, which corners possibly have defects due to rate mismatch can be found in advance, and optimized manufacturing production parameters are generated; therefore, dynamic fine adjustment is carried out according to real-time current and image data, and closed-loop control is realized.

A heat exchanger with a heat-exchanging portion is electrochemically deposited onto a base (for thermal coupling to a heat source) or directly on the heat source. The heat-exchanging portion comprises extensions that define openings (e.g., channels) for passing heat transfer fluid through the heat exchanger. The geometry of these c and / or openings varies throughout the exchange to achieve different unit-area thermal conductivities for at least two different portions of the heat-receiving surface. For example, the thickness, height, spacing, shape, and / or materials of the heat-exchanging extensions may be selected to achieve the desired heat transfer at each zone. This variability in unit-area thermal conductivities may be used to accommodate for “hot spots”, heating of the heat transfer fluid, fluid dynamics, and other factors associated with the heat exchanger operation. Electrochemical additive manufacturing (ECAM) is used to fabricate at least heat-exchanging extensions thereby enabling precise and zone-specific thermal transfer characteristics.

A method of fabricating a multiphase heat exchanger for thermal coupling to a heat source is provided. The method includes submerging a build plate having a deposition surface into an electrolyte, the deposition surface comprising at least one of an evaporator base, a condenser base, or a liquid-return base. A printhead comprising pixelated electrodes and electrode-array drivers is submerged proximate to the deposition surface. A subset of the pixelated electrodes is selectively activated to generate an ionic flow through the electrolyte between the electrode subset and a portion of the deposition surface, thereby electrochemically depositing wicking structures on the base surface. Any two adjacent wicking structures positioned on the evaporator base are spaced apart by an average pitch selected to maintain a heat-transfer fluid, in a liquid phase, in contact with the evaporator base during operation of the multiphase heat exchanger.

A method of making an electronics package for an electrical power module includes positioning a base plate into an electrolyte solution such that a first metallic layer of the base plate directly contacts the electrolyte solution. The method also includes positioning a deposition anode array into the electrolyte solution such that a gap is established between the first metallic layer and the deposition anode array. The method further includes connecting the first metallic layer to a power source and connecting the deposition anode array to the power source. The method also includes transmitting electrical energy from the power source through the deposition anode array, through the electrolyte solution, and to the first metallic layer, such that material is deposited onto the first metallic layer and forms an electrical connection pillar, an electrical-component retention feature, and an encapsulant retention feature of the electronics package.

To provide a method for manufacturing watch components in batches.SOLUTION: A method for manufacturing watch components in batches comprises the steps of: a) providing a substrate 1 covered with a conductive priming layer 2; b) applying a layer of a photosensitive resin 3 to the conductive layer 2 of the surface of the substrate 1; c) irradiating a resin layer 3 through a mask 4 defining the outline of a batch of components 5, as well as a grid 7 and material bridges 6; d) dissolving non-irradiated areas 3b of a photosensitive resin layer 3 to reveal the conductive layer 2 of the substrate 1 in places and form a mold; e) conformal electro-galvanic deposition of a metal layer from the conductive layer 2; f) removing the photosensitive resin layer 3 and the substrate 1 to release one cluster of components thus formed; and g) releasing the batch of components from the one cluster.SELECTED DRAWING: Figure 1

In a master mold and a method for producing a metal molded article, the master mold has: a product region having an electrodeposition surface on which a metal molded article is formed by electrodeposition, in which a product part that is cut out as a product from the metal molded article is formed on the electrodeposition surface; and a non-product region other than the product region. The master mold has: a product pattern which is formed in the product region and includes a depressed part and a projecting part; and a dummy pattern which is formed in at least a part of the non-product region and includes a plurality of depressed parts and a plurality of projecting parts, in which, when the surface area of the product pattern per unit area of the product region is defined as a first surface area and the surface area of the dummy pattern per unit area of a dummy region on which the dummy pattern is formed is defined as a second surface area, the second surface area is larger than the first surface area.

A hyperbolic metamaterial is provided. The hyperbolic metamaterial includes a substrate and sub-wavelength nanostructures arrayed on the substrate. Each sub-wavelength nanostructure has a decreasing cross-sectional area with increasing height from the substrate and includes dielectric or semi-metallic material layers and metal-insulator transition (MIT) material layers respectively interleaved with the dielectric or semi-metallic material layers. Each MIT material layer and each dielectric or semi-metallic material layer of each sub- wavelength nanostructure has a cross-sectional shape characterized in that current is induced in one or both of the dielectric or semi-metallic material layers and the MIT material layers by exposure to a magnetic field.

The process for fabricating a multi-level metal microstructure comprises the steps consisting in: a) providing a substrate (1) having a conducting surface (2); b) covering the conducting surface (2) with a first layer of photoresist (3); c) irradiating the first layer of photoresist (3) through a mask (4) corresponding to the desired impression; d) developing the first layer of photoresist (3) so as to cut out openings therein and thus obtain a first level of a photoresist mould, the openings in the first layer of photoresist exposing the conducting surface (2) of the substrate; e) depositing a new layer of photoresist (6) on the developed photoresist layer (3), so as to cover the latter and fill the openings therein; f) irradiating the new layer of photoresist (6) through a mask (7) corresponding to the desired impression; g) developing the new layer of photoresist (6) so as to cut openings thereinto and obtain a multi-level photoresist mould, the openings in the multi-level mould exposing the conducting surface (2) of the substrate; h) galvanically depositing a metal or an alloy in the openings of the multi-level photoresist mould; and i) detaching the substrate and then removing the photoresist layers so as to reveal a multi-level metal structure (8) comprising said metal or alloy deposited in the openings.

The present invention relates to a copper surface passivation composition, comprising 4-(2-pyridineazo) resorcinol and glucosamine derivatives, and also relates to a photoresist stripper containing same and a method for cleaning a copper substrate. The copper surface passivation composition provides a good copper passivation protection performance, so that the copper surface passivation composition can be used for photoresist removal and copper surface passivation protection in a bumping process of semiconductor back-end packaging with good industrial application prospects and promotion potential in the technical field of microelectronics.

Disclosed herein is a method for fabricating a probe card, the method including the steps of preparing a carrier board, a surface of the carrier board having at least one probe guide portion, and generating a probe by performing additive manufacturing with a conductive material directly on the at least one probe guide portion to generate a probe on the probe guide portion, the additive manufacturing including depositing a conductive material directly on the probe guide portion.

The invention relates to an electroforming system and method comprising an electrode defining a mandrel within a mixing solution, and the application of a voltage to the electrode in the mixing solution to form a composite metal layer on the electrode. The composite metal layer may have particles incorporated within a metal matrix and define a composite electroformed component. Figure 2 for the abstract.

Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousands or millions of anodes, the printhead may use matrix control with row and column drivers similar to display backplanes. Unlike display backplanes where the design goal is to display images using minimal current, the printhead may be optimized for high current density for fast electrodeposition, and for anode longevity. Current density may exceed 1000 mA per cm-squared, at least an order of magnitude greater than that of display backplanes. Anode longevity may be enhanced by using relatively large anodes compared to the grid pitch of the printhead, by lengthening the conductive paths through anodes, or both. Embodiments may be constructed by adding anode and insulation layers on top of matrix-controlled switching circuits.

A method of manufacture is detailed for a pipe for a cryogenic fluid (100). The manufacturing method comprises (100): obtaining an expansion joint (110) and electroforming an inner pipe for a cryogeni

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

Described herein are methods of operating ECAM systems comprising modular cartridge assemblies. A modular cartridge assembly comprises a base, a cover, an ECAM printhead, a support unit, and a control board. The base has an opening providing access to the support unit (e.g., for heat transfer and fluidic connections), which is sealed against the base around this opening. The cover also has an opening exposing the electrode array of the ECAM printhead. The ECAM printhead is also sealed against the cover around this opening. The control board selectively activates the electrode of the array and is positioned within a cavity formed by the base and cover. The modular cartridge assembly allows replacing the ECAM printhead when the electrode array is damaged (e.g., dissolved during the ECAM process), while other assembly components can be reused. Furthermore, the support unit provides alignment and heat transfer for the ECAM printhead.

A method for producing a probe card comprises the steps of: providing a carrier board, wherein a surface of the carrier board has at least one probe guiding portion; and generating a probe on the probe guiding portion by performing additive manufacturing with a conductive material directly on the at least one probe guiding portion to generate the probe, wherein the additive manufacturing comprises directly layering the conductive material on the probe guiding portion.

Proposed is an electroconductive contact pin, and the objective is to manufacture a metal molded product with a high aspect ratio, the metal molded product using a mold made of an anodized film material so that deformation of the electroconductive contact pin is prevented, and being capable of effectively improving current carrying capacity.

Described herein are heat exchangers and heat source assemblies, which may be fabricated using electrochemical additive manufacturing (ECAM). A heat exchanger comprises a base and a heat-exchanging portion electrochemically deposited on and attached to the base and comprising heat-exchanging extensions with heat-exchanging surfaces. The combination of the heat-exchanging surfaces and the base forms openings (e.g., non-linear channels) for directing a heat transfer fluid through the heat exchanger. The openings may extend to the base for direct contact. The average CTE of the base may be closer to that of the heat source than the average CTE of the heat-exchanging portion. In some examples, the heat-exchanging portion comprises extension ends for thermal coupling to the heat source. Any dimension of each extension end may be less than a critical dimension, determined by adhesion, CTE mismatch, and temperature fluctuations.

The invention provides a laser-enhanced area electroforming additive manufacturing device and method. The device comprises an electroforming power supply, a master control system, a circulating system, a laser system, an electroforming tank, an area array micro-jet printing head erected in the electroforming tank, a cathode substrate arranged below the area array micro-jet printing head and a cathode driving system, the cathode substrate is not in contact with the inner wall and the bottom of the electroforming tank; the laser system comprises a beam shaping module; a linear strip-shaped laser beam emitted by the beam shaping module passes through the electrolyte in the liquid storage shell and the micro nozzle through the light transmitting window and then is vertically irradiated on the cathode substrate; and the line-strip-shaped laser beam covers all the micro nozzles. The method is a laser-enhanced area electroforming additive manufacturing method using the device. According to the device and the method, the deposition rate and the production efficiency can be greatly improved, the printing resolution ratio and the forming precision are improved, the structural part with higher performance can be obtained, and the performance of the structural part is easier to regulate and control.

An electrode array assembly (101) includes an electrode array (113) having electrodes (111), connection circuits (115), and a power supply layer (200) configured to supply electrical power (270) to the connection circuits (115). The power supply layer (200) includes strips (203A, 203B) made of at least two electrically conductive materials. Each one of the strips (203A, 203B) includes segments (202A, 202B) each electrically coupled to and extending between a corresponding two of the electrodes (111). The power supply layer (200) further includes pass-through openings each defined between adjacent ones of the segments (202A, 202B). The connection circuits (115) are selectively controllable to supply the electrical power (270) from the power supply layer (200) to one or more of the electrodes (111). Each one of at least some of the segments (202A, 202B) includes a corrosion-isolation bridge (210) between the corresponding two of the electrodes (111).

The invention discloses a metal product and a 3D printing method thereof, and belongs to the field of metal product 3D printing.The 3D printing method of the metal product comprises the following steps that under the condition of an external electric field, 3D printing is conducted on printing slurry in a direct ink writing mode, the metal product is obtained, the density of the metal product is 95.0%-99.9%, and the surface roughness Ra is smaller than 20 microns. The mixture containing the metal simple substance and the metal cation salt in a proper mass ratio is used as the printing slurry, and direct ink writing 3D printing is carried out under the condition of the external electric field, so that the metal cations are reduced into the metal simple substance in the 3D printing process, and the metal particles are gradually filled with the metal simple substance; the porosity, the shrinkage amplitude and the surface roughness of the metal product are remarkably reduced, meanwhile, the characteristics of high efficiency, high forming speed, low cost and the like are achieved, and a new technical means is provided for 3D printing of the metal product.

Method and machine for manufacturing a metal terminal, assembly comprising a metal terminal and an electrical conductor. Method for manufacturing a metal terminal (18) at one end (12) of a single-strand or multi-strand electrical conductor (10), comprising the following steps: S10) positioning the end of the conductor in an enclosure (110) of an additive manufacturing machine (100); and S20) manufacturing the terminal (18) directly onto an external surface (16) of the end of the electrical conductor by additive manufacturing. Metal terminal manufacturing machine, adapted for carrying out this method, and assembly comprising a metal terminal and an electrical conductor to which the terminal is fixed. Figure for the abstract: Fig. 2.

A hollow body has a bottom, an upper end wall, and side walls extending between the bottom and the upper end wall. The upper end wall and side walls are made of metal. The cavity within the hollow body has a volume in the range between 1 picoliter to 1,000 picoliter. The upper end wall comprises at least one opening. The hollow body is suitable for encapsulating small amounts of liquid, or a small micro-electromechanical system, and may be used for the controlled release of pharmaceutical components.

A system and method of inspecting a thickness of metal on an electroformed component. The system capable of scanning the electroformed component with a sensor. The system including a computer for generating a scan data set indicative of the thickness of the metal on the electroformed component. A controller for instructing an anode to deposit additional metal on the electroformed component where the thickness is less than a target thickness.

The invention relates to a method for manufacturing a mold for electroplating or metal growth of a watch part (31, 32) or a piece of jewelry (31, 32), comprising the steps of: - obtaining at least one base substrate (11), - depositing at least one layer of photosensitive resin (13), - irradiating at least a first portion of the layer of photosensitive resin (13) - characterized: - in that the irradiation of the first portion of said at least one layer of photosensitive resin (13) comprises a step of projecting onto said at least one layer of photosensitive resin (13) at least one first irradiation pattern (PM) corresponding to at least a first portion of a first watch or jewelry part (31, 32).

A multiphase heat exchanger includes an evaporator, a condenser, and a liquid-return portion extending between the evaporator and the condenser, such that microstructured wicking structures are electrochemically integrated into one or more of these components. In an evaporator, the wicking structures promote capillary-driven liquid transport and assist in displacing vapor bubbles from the evaporator to improve two-phase cooling performance. By tailoring the geometry, location, and density of the wicking features, localized “dryouts” are mitigated thereby ensuring efficient heat transfer. Wicking structures may be also positioned along sidewalls, at channel bases, or on fin surfaces to maintain fluid distribution and enhance phase-change efficiency. Electrochemical additive manufacturing (ECAM) enables precise, layer-by-layer fabrication of these structures, allowing customization for different flow regimes and heat flux profiles. The resulting device supports higher thermal loads, improved reliability, and consistent manufacturing for advanced heat transfer / cooling applications.

A method of forming an electrode array includes applying at least one first photosensitive resist layer onto a substrate, exposing a portion of the at least one first photosensitive resist layer to a first light such that a first-layer region is defined, applying at least one second photosensitive resist layer onto the at least one first photosensitive resist layer, and exposing a portion of the at least one second photosensitive resist layer to a second light such that a second-layer region, within a footprint of the first-layer region, is defined. The method further includes developing the at least one first photosensitive resist layer and the at least one second photosensitive resist layer to remove the second-layer region and at least a portion of the first-layer region, such that an aperture is formed with an overhang portion.

Described herein are electrochemical-additive manufacturing (ECAM) systems comprising membranes and methods of operating thereof. An ECAM system comprises an electrode array with individually-addressable electrodes, a deposition electrode, and a membrane positioned between the deposition electrode and electrode array. In some examples, the membrane is configured to transmit protons while blocking gas bubbles, such as oxygen bubbles forming at the electrode array surface. Isolating these bubbles from the deposition electrode helps to preserve the desired component resolution of deposited materials. In some examples, the membrane is also configured to block other components (e.g., metal ions) to maintain different electrolyte compositions (e.g., anolyte and catholyte) on the opposite sides of the membrane. For example, the anolyte may comprise multivalent cations that are oxidized (e.g., Fe+2→Fe+3) thereby decreasing the oxygen gas formation. Furthermore, the membrane allows flowing the anolyte and catholyte at different flow rates.