86results about "3D structure electroforming" patented technology

The invention relates to a jet flow electrochemical deposition rate self-adaptive control method and system, and belongs to the technical field, and the method comprises the steps: carrying out the physical field model construction of collected data through a digital twinning technology, and constructing a jet flow electrochemical deposition rate self-adaptive control model based on deep learning and a physical model; therefore, optimized working parameters of the chemical additive manufacturing equipment are generated through the jet flow electrochemical deposition rate self-adaptive control model, a visualization system is constructed based on the collected data, and finally interaction control is conducted on the chemical additive manufacturing equipment through the visualization system. According to the method, a high-fidelity virtual model which synchronously runs with physical equipment is created, and before a complex spiral structure is printed, full-process simulation can be performed in a digital twinning body, which corners possibly have defects due to rate mismatch can be found in advance, and optimized manufacturing production parameters are generated; therefore, dynamic fine adjustment is carried out according to real-time current and image data, and closed-loop control is realized.

A heat exchanger with a heat-exchanging portion is electrochemically deposited onto a base (for thermal coupling to a heat source) or directly on the heat source. The heat-exchanging portion comprises extensions that define openings (e.g., channels) for passing heat transfer fluid through the heat exchanger. The geometry of these c and / or openings varies throughout the exchange to achieve different unit-area thermal conductivities for at least two different portions of the heat-receiving surface. For example, the thickness, height, spacing, shape, and / or materials of the heat-exchanging extensions may be selected to achieve the desired heat transfer at each zone. This variability in unit-area thermal conductivities may be used to accommodate for “hot spots”, heating of the heat transfer fluid, fluid dynamics, and other factors associated with the heat exchanger operation. Electrochemical additive manufacturing (ECAM) is used to fabricate at least heat-exchanging extensions thereby enabling precise and zone-specific thermal transfer characteristics.

Described herein are methods and systems for additive manufacturing of parts comprising electrolytic deposits and electrophoretic deposits. Such methods and methods provide various new ways for integrating different materials into composite parts. Specifically, an additive manufacturing system comprises an electrode array with individually-addressable electrodes. Each individually-addressable electrode is coupled to a separate deposition control circuit, which selectively connects this electrode to a power supply. When forming a composite part, the electrode array can control the location of each electrolytic deposit (by controlling the current flow through each individually-addressable electrode) and each electrophoretic deposit (by controlling the electric field distribution). An electrolyte solution or an electrophoretic suspension is provided between the electrode array and deposition electrode to form corresponding deposits. In addition to the electrode-array provided control, alternating the electrolytic and electrophoretic deposition operations can be used to locate the corresponding deposits within a composite part.

A method of fabricating a multiphase heat exchanger for thermal coupling to a heat source is provided. The method includes submerging a build plate having a deposition surface into an electrolyte, the deposition surface comprising at least one of an evaporator base, a condenser base, or a liquid-return base. A printhead comprising pixelated electrodes and electrode-array drivers is submerged proximate to the deposition surface. A subset of the pixelated electrodes is selectively activated to generate an ionic flow through the electrolyte between the electrode subset and a portion of the deposition surface, thereby electrochemically depositing wicking structures on the base surface. Any two adjacent wicking structures positioned on the evaporator base are spaced apart by an average pitch selected to maintain a heat-transfer fluid, in a liquid phase, in contact with the evaporator base during operation of the multiphase heat exchanger.

A method of making an electronics package for an electrical power module includes positioning a base plate into an electrolyte solution such that a first metallic layer of the base plate directly contacts the electrolyte solution. The method also includes positioning a deposition anode array into the electrolyte solution such that a gap is established between the first metallic layer and the deposition anode array. The method further includes connecting the first metallic layer to a power source and connecting the deposition anode array to the power source. The method also includes transmitting electrical energy from the power source through the deposition anode array, through the electrolyte solution, and to the first metallic layer, such that material is deposited onto the first metallic layer and forms an electrical connection pillar, an electrical-component retention feature, and an encapsulant retention feature of the electronics package.

To provide a method for manufacturing watch components in batches.SOLUTION: A method for manufacturing watch components in batches comprises the steps of: a) providing a substrate 1 covered with a conductive priming layer 2; b) applying a layer of a photosensitive resin 3 to the conductive layer 2 of the surface of the substrate 1; c) irradiating a resin layer 3 through a mask 4 defining the outline of a batch of components 5, as well as a grid 7 and material bridges 6; d) dissolving non-irradiated areas 3b of a photosensitive resin layer 3 to reveal the conductive layer 2 of the substrate 1 in places and form a mold; e) conformal electro-galvanic deposition of a metal layer from the conductive layer 2; f) removing the photosensitive resin layer 3 and the substrate 1 to release one cluster of components thus formed; and g) releasing the batch of components from the one cluster.SELECTED DRAWING: Figure 1

In a master mold and a method for producing a metal molded article, the master mold has: a product region having an electrodeposition surface on which a metal molded article is formed by electrodeposition, in which a product part that is cut out as a product from the metal molded article is formed on the electrodeposition surface; and a non-product region other than the product region. The master mold has: a product pattern which is formed in the product region and includes a depressed part and a projecting part; and a dummy pattern which is formed in at least a part of the non-product region and includes a plurality of depressed parts and a plurality of projecting parts, in which, when the surface area of the product pattern per unit area of the product region is defined as a first surface area and the surface area of the dummy pattern per unit area of a dummy region on which the dummy pattern is formed is defined as a second surface area, the second surface area is larger than the first surface area.

A hyperbolic metamaterial is provided. The hyperbolic metamaterial includes a substrate and sub-wavelength nanostructures arrayed on the substrate. Each sub-wavelength nanostructure has a decreasing cross-sectional area with increasing height from the substrate and includes dielectric or semi-metallic material layers and metal-insulator transition (MIT) material layers respectively interleaved with the dielectric or semi-metallic material layers. Each MIT material layer and each dielectric or semi-metallic material layer of each sub- wavelength nanostructure has a cross-sectional shape characterized in that current is induced in one or both of the dielectric or semi-metallic material layers and the MIT material layers by exposure to a magnetic field.

The process for fabricating a multi-level metal microstructure comprises the steps consisting in: a) providing a substrate (1) having a conducting surface (2); b) covering the conducting surface (2) with a first layer of photoresist (3); c) irradiating the first layer of photoresist (3) through a mask (4) corresponding to the desired impression; d) developing the first layer of photoresist (3) so as to cut out openings therein and thus obtain a first level of a photoresist mould, the openings in the first layer of photoresist exposing the conducting surface (2) of the substrate; e) depositing a new layer of photoresist (6) on the developed photoresist layer (3), so as to cover the latter and fill the openings therein; f) irradiating the new layer of photoresist (6) through a mask (7) corresponding to the desired impression; g) developing the new layer of photoresist (6) so as to cut openings thereinto and obtain a multi-level photoresist mould, the openings in the multi-level mould exposing the conducting surface (2) of the substrate; h) galvanically depositing a metal or an alloy in the openings of the multi-level photoresist mould; and i) detaching the substrate and then removing the photoresist layers so as to reveal a multi-level metal structure (8) comprising said metal or alloy deposited in the openings.

The present invention relates to a copper surface passivation composition, comprising 4-(2-pyridineazo) resorcinol and glucosamine derivatives, and also relates to a photoresist stripper containing same and a method for cleaning a copper substrate. The copper surface passivation composition provides a good copper passivation protection performance, so that the copper surface passivation composition can be used for photoresist removal and copper surface passivation protection in a bumping process of semiconductor back-end packaging with good industrial application prospects and promotion potential in the technical field of microelectronics.

A laser induced electrochemical deposition five-axis additive manufacturing device and a method are provided. The device includes: a housing, together with a main support component, a displacement control component, an electrode component, and a coupling component that are disposed inside the housing. The displacement control component is fixed to the main support component, and is configured to control the coupling component to move in a third direction, and / or control a partial structure of the electrode component to move in a first direction and a second direction, and to rotate about the first direction and the third direction; and the electrode component and the coupling component are both fixedly connected to the displacement control component; the coupling component and the electrode component are mounted in sequence on the displacement control component along the third direction.

Disclosed herein is a method for fabricating a probe card, the method including the steps of preparing a carrier board, a surface of the carrier board having at least one probe guide portion, and generating a probe by performing additive manufacturing with a conductive material directly on the at least one probe guide portion to generate a probe on the probe guide portion, the additive manufacturing including depositing a conductive material directly on the probe guide portion.

The invention relates to an electroforming system and method comprising an electrode defining a mandrel within a mixing solution, and the application of a voltage to the electrode in the mixing solution to form a composite metal layer on the electrode. The composite metal layer may have particles incorporated within a metal matrix and define a composite electroformed component. Figure 2 for the abstract.

A composite metal porous body according to one aspect of the present invention has a skeleton having a three-dimensional network structure, in which the skeleton has a porous body base material and a metal film covering the surface of the porous body base material, and the metal film contains titanium metal or a titanium alloy as a main component.

Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousands or millions of anodes, the printhead may use matrix control with row and column drivers similar to display backplanes. Unlike display backplanes where the design goal is to display images using minimal current, the printhead may be optimized for high current density for fast electrodeposition, and for anode longevity. Current density may exceed 1000 mA per cm-squared, at least an order of magnitude greater than that of display backplanes. Anode longevity may be enhanced by using relatively large anodes compared to the grid pitch of the printhead, by lengthening the conductive paths through anodes, or both. Embodiments may be constructed by adding anode and insulation layers on top of matrix-controlled switching circuits.

Method for manufacturing by photolithography a resin multilayer mould (10; 10′) including a cavity (11; 11′) provided with an inlet (110; 110′) for the manufacture of a horological component, including producing at least two resin layers of the mould (10; 10′), by producing a first resin layer (C10; C20′) having a first through-opening or open opening (111; 111′) oriented in the direction of the inlet (110; 110′) of the mould to delimit a first volume of the cavity (11; 11′) of the mould (10, 10′), and producing a second resin layer (C20; C30′) including a rigid film and having a second through-opening (112; 112′) that delimits a second volume of the cavity (11; 11′) of the mould (10, 10′) and is at least partly superposed on the first through-opening or open opening (111; 111′), the second resin layer partly covering that same first through-opening or open opening (111; 111′).

A method of manufacture is detailed for a pipe for a cryogenic fluid (100). The manufacturing method comprises (100): obtaining an expansion joint (110) and electroforming an inner pipe for a cryogeni

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

Described herein are methods of operating ECAM systems comprising modular cartridge assemblies. A modular cartridge assembly comprises a base, a cover, an ECAM printhead, a support unit, and a control board. The base has an opening providing access to the support unit (e.g., for heat transfer and fluidic connections), which is sealed against the base around this opening. The cover also has an opening exposing the electrode array of the ECAM printhead. The ECAM printhead is also sealed against the cover around this opening. The control board selectively activates the electrode of the array and is positioned within a cavity formed by the base and cover. The modular cartridge assembly allows replacing the ECAM printhead when the electrode array is damaged (e.g., dissolved during the ECAM process), while other assembly components can be reused. Furthermore, the support unit provides alignment and heat transfer for the ECAM printhead.

A method for producing a probe card comprises the steps of: providing a carrier board, wherein a surface of the carrier board has at least one probe guiding portion; and generating a probe on the probe guiding portion by performing additive manufacturing with a conductive material directly on the at least one probe guiding portion to generate the probe, wherein the additive manufacturing comprises directly layering the conductive material on the probe guiding portion.

The invention relates to a method for manufacturing a mold for electroplating or metal growth of a watch part (31, 32) or a piece of jewelry (31, 32), comprising the steps of: - obtaining at least one base substrate (11), - depositing at least one layer of photosensitive resin (13), - irradiating at least a first portion of the layer of photosensitive resin (13) - characterized: - in that the irradiation of the first portion of said at least one layer of photosensitive resin (13) comprises a step of projecting onto said at least one layer of photosensitive resin (13) at least one first irradiation pattern (PM) corresponding to at least a first portion of a first watch or jewelry part (31, 32).

Exemplary methods can be used to modify a base part, form battery devices, or form devices with surface modification. Exemplary methods can form at least one junction in a base part, and devices can have at least one material junction therein. Exemplary devices, systems, and methods can deliver a drug to body tissue. Exemplary devices and methods can transmit a signal to, or receive the signal from, cardiovascular anatomy and / or a nervous system. Exemplary devices can interface with body tissue and methods can fixate a device to body tissue. Exemplary methods can use a microneedle device. Exemplary biopsy systems and methods can use a biopsy device, the biopsy device including a first tube and a second tube nested in the first tube. Exemplary devices, systems, and methods can cauterize target tissue within body tissue, ablate the target tissue, map electrical activity in the target tissue, or a combination thereof.

Proposed is an electroconductive contact pin, and the objective is to manufacture a metal molded product with a high aspect ratio, the metal molded product using a mold made of an anodized film material so that deformation of the electroconductive contact pin is prevented, and being capable of effectively improving current carrying capacity.

To provide a master disk for electroforming, a production method of the master disk for electroforming, and a production method of an electroformed object using the master disk for electroforming, which have excellent adhesive properties to the electroformed object and can suppress the peeling of the electroformed object in growth.SOLUTION: A master disk for electroforming comprises a substrate including an n-type semiconductor, on a surface of which a pattern is laid and an oxide film is formed. A thickness of the oxide film is 18Å or smaller. The master disk for electroforming, a production method of the master disk for electroforming, and a production method of an electroformed object using the master disk for electroforming are provided.SELECTED DRAWING: Figure 1

Described herein are heat exchangers and heat source assemblies, which may be fabricated using electrochemical additive manufacturing (ECAM). A heat exchanger comprises a base and a heat-exchanging portion electrochemically deposited on and attached to the base and comprising heat-exchanging extensions with heat-exchanging surfaces. The combination of the heat-exchanging surfaces and the base forms openings (e.g., non-linear channels) for directing a heat transfer fluid through the heat exchanger. The openings may extend to the base for direct contact. The average CTE of the base may be closer to that of the heat source than the average CTE of the heat-exchanging portion. In some examples, the heat-exchanging portion comprises extension ends for thermal coupling to the heat source. Any dimension of each extension end may be less than a critical dimension, determined by adhesion, CTE mismatch, and temperature fluctuations.

The invention provides a laser-enhanced area electroforming additive manufacturing device and method. The device comprises an electroforming power supply, a master control system, a circulating system, a laser system, an electroforming tank, an area array micro-jet printing head erected in the electroforming tank, a cathode substrate arranged below the area array micro-jet printing head and a cathode driving system, the cathode substrate is not in contact with the inner wall and the bottom of the electroforming tank; the laser system comprises a beam shaping module; a linear strip-shaped laser beam emitted by the beam shaping module passes through the electrolyte in the liquid storage shell and the micro nozzle through the light transmitting window and then is vertically irradiated on the cathode substrate; and the line-strip-shaped laser beam covers all the micro nozzles. The method is a laser-enhanced area electroforming additive manufacturing method using the device. According to the device and the method, the deposition rate and the production efficiency can be greatly improved, the printing resolution ratio and the forming precision are improved, the structural part with higher performance can be obtained, and the performance of the structural part is easier to regulate and control.

A method of fabricating a metal mask includes receiving a conductive substrate with a first surface, a second surface opposite to the first surface, a third surface connecting the first and second surfaces, and a fourth surface opposite to the third surface and connecting the first and second surfaces. The method further includes forming trenches in a direction from the first surface to the second surface and protrusions in the conductive substrate. The trenches and the protrusions are alternately arranged. The method further includes filling the trenches with an insulation material covering a first area of the protrusions, forming a metal layer on the conductive substrate overlying a second area different from the first area of the protrusions, removing the insulation material, and removing the conductive substrate. The metal layer becomes a metal mask with a three-dimensional structure including strip-shaped structures.

An electrode array assembly (101) includes an electrode array (113) having electrodes (111), connection circuits (115), and a power supply layer (200) configured to supply electrical power (270) to the connection circuits (115). The power supply layer (200) includes strips (203A, 203B) made of at least two electrically conductive materials. Each one of the strips (203A, 203B) includes segments (202A, 202B) each electrically coupled to and extending between a corresponding two of the electrodes (111). The power supply layer (200) further includes pass-through openings each defined between adjacent ones of the segments (202A, 202B). The connection circuits (115) are selectively controllable to supply the electrical power (270) from the power supply layer (200) to one or more of the electrodes (111). Each one of at least some of the segments (202A, 202B) includes a corrosion-isolation bridge (210) between the corresponding two of the electrodes (111).

The invention discloses a micro gap measurement method and device based on nano additive manufacturing, and belongs to the field of micro-nano scale measurement. According to the method, a gap reverse mold is formed in a micro gap on a substrate material through electrochemical additive manufacturing; non-destructive demolding is realized through thermal circulation by utilizing the difference of thermal expansion coefficients of a reverse mold material and a substrate material; performing sequence slicing on the demolded reverse mold by using a focused ion beam, and imaging the exposed surface to obtain a series of two-dimensional images; and finally, based on the two-dimensional image sequence, performing three-dimensional reconstruction on the geometrical morphology of the gap. According to the invention, high-resolution, three-dimensional quantitative and low-damage measurement can be carried out on buried tiny gaps with complex three-dimensional shapes or high depth-to-width ratios, and the method is suitable for various substrate material systems. The non-contact reverse mode duplication strategy is especially suitable for a gap structure which is difficult to apply by a traditional measurement method or a sample is easy to damage, and has scientific research universality and industrialization popularization value; the method can be widely applied to structural analysis scenes such as semiconductors, micro electro mechanical systems, material science, packaging, nano electronics, flexible electronics, biochips, energy devices, microfluidics, biological tissue interfaces and aerospace composite materials, and has remarkable interdisciplinary adaptability.

The invention discloses a metal product and a 3D printing method thereof, and belongs to the field of metal product 3D printing.The 3D printing method of the metal product comprises the following steps that under the condition of an external electric field, 3D printing is conducted on printing slurry in a direct ink writing mode, the metal product is obtained, the density of the metal product is 95.0%-99.9%, and the surface roughness Ra is smaller than 20 microns. The mixture containing the metal simple substance and the metal cation salt in a proper mass ratio is used as the printing slurry, and direct ink writing 3D printing is carried out under the condition of the external electric field, so that the metal cations are reduced into the metal simple substance in the 3D printing process, and the metal particles are gradually filled with the metal simple substance; the porosity, the shrinkage amplitude and the surface roughness of the metal product are remarkably reduced, meanwhile, the characteristics of high efficiency, high forming speed, low cost and the like are achieved, and a new technical means is provided for 3D printing of the metal product.