The invention discloses a
mask manufacturing method and a
mask, and relates to the technical field of
silicon-based OLEDs (Organic Light Emitting Diodes), the
mask manufacturing method comprises the following steps: providing a
silicon-based substrate, forming a
metal seed layer on the surface of the
silicon-based substrate, forming a first
photoresist layer on the surface of the
metal seed layer, and forming a second
photoresist layer on the surface of the first
photoresist layer; and forming a plurality of first windows for exposing part of the
metal seed layer on the surface of the first photoresist layer, forming mask
layers for filling the first windows on the surface, facing the first windows, of the metal seed layer by an
electroforming process, and removing the first photoresist layer, the silicon-based substrate and the metal seed layer to obtain the mask. According to the manufacturing method, the mask plate is manufactured in a mode of combining the photoetching process and the
electroforming process, the opening width of the mask plate depends on the
exposure, development and photoresist removal precision in the photoetching process, and compared with existing
calendering and
etching processes, the manufacturing method can reduce the minimum opening size of the mask plate and improve the
manufacturing efficiency of the mask plate. Therefore, the mask plate can be applied to manufacturing of a silicon-based
OLED display device with higher PPI.