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57 results about "Silver mirror" patented technology

Inverted silver mirror light emitting diode chip and preparation method thereof

The invention discloses an inverted silver mirror light-emitting diode chip and a preparation method thereof, and relates to the technical field of semiconductors. The inverted silver mirror light-emitting diode chip comprises a substrate, an epitaxial layer, a current expansion layer, a Bragg reflection layer, a metal reflection layer, a first insulating layer, a P-type metal conductive layer and an N-type metal conductive layer, the epitaxial layer comprises an N-type semiconductor layer, an active light-emitting layer and a P-type semiconductor layer; the Bragg reflection layer is provided with a Bragg reflection layer P-type through hole, the first insulating layer is provided with a first insulating layer P-type through hole, and the included angle beta between the hole wall of the first insulating layer P-type through hole and the horizontal plane is smaller than the included angle alpha between the hole wall of the Bragg reflection layer P-type through hole and the horizontal plane; the distance L between the projection edge of the P-type through hole of the first insulating layer and the projection edge of the P-type through hole of the Bragg reflection layer is 5 [mu] m-12 [mu] m. According to the invention, the structure of the flip silver mirror light-emitting diode chip is improved, so that the capability of the flip silver mirror light-emitting diode chip for resisting large current can be improved.
Owner:JIANGXI ZHAO CHI SEMICON CO LTD

Device and method for testing stability of liquid-gas interface of super-hydrophobic material

The invention belongs to the technical field of super-hydrophobic material underwater stability evaluation, and particularly relates to a super-hydrophobic material liquid-gas interface stability testing device and a super-hydrophobic material liquid-gas interface stability testing method. Laser is irradiated to the surface of a super-hydrophobic material by utilizing the underwater silver mirror phenomenon of the super-hydrophobic material; the stability condition of an underwater gas film of the super-hydrophobic material is explored by measuring the illumination of reflected light, the stability of the super-hydrophobic material under the hydrostatic pressure is quantitatively represented, the relation between microstructure parameters of the super-hydrophobic material and hydrostatic pressure resistance is explored, and accurate evaluation of the liquid-gas interface stability of the super-hydrophobic material under the hydrostatic pressure is achieved. A theoretical basis is provided for designing an underwater high-stability super-hydrophobic material; the device is simple in structure, the method is convenient to operate, the design is rigorous and reliable, the application range is wide, the stability of the gas layer on the surface of the super-hydrophobic material can be quantitatively represented only by measuring the reflected illuminance of a liquid-gas interface, and the error of a test result is small.
Owner:CHINA SHIPBUILDING INDUSTRY CORPORATION NO725 RESEARCH INSTITUTE

Preparation method of low-temperature phase change microcapsule with high thermal conductivity and high durability

The application discloses a kind of high heat-conducting high endurance low-temperature phase change microcapsule preparation methods, comprising: step 1: using C7, C9 alkane preparation cryogenic phase change material emulsion;Step 2: using melamine resin prepolymer containing polyethylene glycol and hydrophobic silicon carbide powder containing nano silicon carbide preparation modified wall material prepolymer;Step 3: using cryogenic phase change material emulsion and modified wall material prepolymer preparation phase change microcapsule;Step 4: using silver mirror reaction to phase change microcapsule surface silver plating, obtain surface silver plating microcapsule.The low-temperature phase change microcapsule prepared, using C7, C9 low-temperature mixed alkane as microcapsule core material;Using melamine resin as microcapsule wall material, and wall material contains polyethylene glycol modified material, nano silicon carbide modified material to improve the toughness of microcapsule, thermal conductivity;Microcapsule surface silver plating to resist volatility, eliminate residual formaldehyde in wall material.The application solves the problem of low thermal conductivity and poor durability of cryogenic phase change material microcapsule.
Owner:NANJING TECH UNIV

Flip silver mirror light-emitting diode chip preparation method and flip silver mirror light-emitting diode chip

The invention relates to the technical field of semiconductor devices, in particular to a preparation method of a flip silver mirror light-emitting diode chip and the flip silver mirror light-emitting diode chip. According to the preparation method, a preparation process of a P-type first insulating layer through hole and an N-type first insulating layer through hole is improved, a partial exposure region is arranged on a photoetching plate, partial photoresist of a P-type region opening is reserved, an insulating layer can still be reserved above the P-type region opening after etching, Cl ion corrosion is avoided, and the performance of the device is improved. And the P-type first insulating layer through hole and the N-type first insulating layer through hole can be prepared together, batch preparation is not needed, thick precious metal does not need to be prepared on the top layer of the metal reflecting layer to serve as a protective layer, and the preparation cost of the light emitting diode chip is greatly reduced.
Owner:JIANGXI ZHAO CHI SEMICON CO LTD

A flip-chip silver mirror light-emitting diode chip and its preparation method

The present invention provides a flip-chip silver mirror light-emitting diode chip and a preparation method thereof. The preparation method comprises S10, providing an epitaxial wafer; S20, preparing a Bragg reflector layer; S30, coating a first photoresist on the surface of the Bragg reflector layer, and then removing a portion of the first photoresist on the Bragg reflector layer; S40, etching a Bragg reflector through hole using an inductively coupled plasma etching process; and S50, removing residues in the Bragg reflector through hole using an inductively coupled plasma etching process. The specific steps of step S40 include: S401, performing main reaction etching to form the Bragg reflector through hole; the specific steps of step S50 include: S501, cleaning byproducts generated after the main reaction etching; S502, performing oxygen ion etching to remove the first photoresist layer with fluorine ions remaining after the main reaction etching process; S503, performing argon ion etching to remove fluorine ions remaining on the sidewalls of the Bragg reflector through hole; and S504, removing residues in the Bragg reflector through hole.
Owner:JIANGXI ZHAO CHI SEMICON CO LTD

Light emitting diode and manufacturing method of light emitting diode

The invention provides a light-emitting diode and a manufacturing method of the light-emitting diode, and belongs to the field of light-emitting devices. The light-emitting diode comprises a first semiconductor layer, an active layer and a second semiconductor layer which are stacked in sequence, wherein the second semiconductor layer and the active layer are provided with grooves extending to the first semiconductor layer; the transparent conductive layer is located on the second semiconductor layer, the transparent conductive layer is provided with a first through hole corresponding to the groove and an annular second through hole surrounding the first through hole, and the projection of the groove on the bottom surface of the first semiconductor layer is located in the projection of the first through hole on the bottom surface of the first semiconductor layer; the silver mirror structure is located on the transparent conductive layer, the silver mirror structure is provided with a third through hole corresponding to the groove, and the projection of the third through hole on the bottom surface of the first semiconductor layer is located between the projection of the first through hole and the projection of the second through hole on the bottom surface of the first semiconductor layer; and the insulating layer is located in the second through hole, and the insulating layer is located between the second semiconductor layer and the silver mirror structure.
Owner:HC SEMITEK ZHEJIANG CO LTD

Drying device for silver mirror production

The utility model relates to the technical field of silver mirror production, and discloses a drying device for silver mirror production, which comprises a drying box and a plurality of heat dissipation grooves, a motor is fixed at the top of the drying box, a rotating shaft is fixed at the output shaft end of the motor, a placing plate I and a placing plate II are respectively fixed on the side wall of the rotating shaft, and two limiting grooves are respectively arranged on the placing plate I and the placing plate II. A plurality of through holes are formed in the limiting rods, the two ends of the limiting rods are sleeved with reset springs, limiting plates slide on the limiting rods, through grooves are formed in the first placement plate, a bearing plate is fixed to the side wall of the drying box, an air heater is fixed to the top of the bearing plate, and the air blowing end of the air heater communicates with an air blowing pipe; the other end of the air blowing pipe is communicated with a collecting pipe which is communicated with an air blowing opening. According to the utility model, the silver mirror is clamped through the cooperation of the limiting rod, the reset spring and the limiting plate, and the silver mirror is prevented from deviating due to the influence of wind power, so that the possibility that the silver mirror falls off is reduced, and the practicability of the device is improved.
Owner:BENXI JIANTAI IND TECHNOLOGY GLASS CO LTD

Light Emitting Diode Chips and Their Fabrication Methods

PendingCN122094265AGuaranteed brightness improvement effectachieve full coverageActive layerLight-emitting diode
This disclosure discloses a light-emitting diode (LED) chip and its fabrication method, belonging to the field of semiconductor technology. The LED chip includes an epitaxial layer and a silver mirror layer. The epitaxial layer comprises a first semiconductor layer, an active layer, and a second semiconductor layer stacked sequentially. The first semiconductor layer has a first conductivity type, and the second semiconductor layer has a second conductivity type, which is different from the first conductivity type. The epitaxial layer has mesa trenches extending from the second semiconductor layer to the first semiconductor layer. The silver mirror layer covers the second semiconductor layer, the sidewalls of the mesa trenches, and the first semiconductor layer. The embodiments of this disclosure ensure that the silver mirror layer enhances the brightness of the LED chip.
Owner:HC SEMITEK ZHEJIANG CO LTD

Novel dial plate capable of realizing micron-sized grains

The utility model discloses a novel dial plate capable of realizing micron-sized grains, which comprises a base plate and a texture sheet attached to the upper surface of the base plate, a glue layer is arranged between the base plate and the texture sheet, the texture sheet comprises a silver mirror base layer and an electroformed texture layer, and the electroformed texture layer is arranged on the upper surface of the silver mirror base layer. The utility model provides the novel dial plate capable of realizing micron-sized grains, and the surface of the dial plate can show micron-sized fine grains which cannot be generated through a stamping process and a chemical etching process, so that the dial plate is more fine and exquisite.
Owner:SHANTOU SPECIAL ECONOMIC ZONE DARONG HOROLOGE IND CO LTD

Highly conductive silver / graphene composite solute and preparation method thereof

The application belongs to the technical field of electronic materials, and particularly relates to a high-conductivity silver / graphene composite solute and a preparation method thereof. The method comprises the following steps: acidizing graphene to obtain an acidized graphene dispersion liquid; mixing the acidized graphene dispersion liquid with a formaldehyde solution to perform an aldehyde reaction, and obtaining an aldehyde graphene dispersion liquid; mixing the aldehyde graphene dispersion liquid with a silver-ammonia solution to perform a silver mirror reaction, and obtaining a silver / graphene composite solute. The graphene is subjected to acidization and aldehyde treatment, and then is subjected to a silver mirror reaction with a silver-ammonia solution to form a silver / graphene composite solute. A small amount of the prepared silver / graphene composite solute is added to commercial silver paste, which not only optimizes the conductive path of the silver paste, but also effectively reduces the porosity problem in the sintering process, thereby significantly enhancing the electron transmission performance, greatly improving the conductivity of the silver paste, and finally promoting the solar cell to achieve higher photoelectric conversion efficiency.
Owner:XI AN JIAOTONG UNIV

Silver precursor inks

PCT designated stageWO2026155533A1Carboxylic acidAcetylene
The present invention relates to silver precursor inks by which a silver mirror having excellent conductivity and reflection properties after firing may be easily formed, and which have high stability. The present invention provides silver precursor inks comprising: a carboxylic acid silver precursor compound; an acetylene-based compound; a nitrogen atom-containing compound; and a solvent.
Owner:PESOLVE CO LTD

Electrochemical microsensor and its preparation method and application

The present invention discloses an electrochemical microsensor, comprising: a device substrate; a bottom layer of polyimide formed on the device substrate; a top layer of polyimide formed on the top surface of the bottom layer of polyimide and designed to match the pattern of a working electrode lead, a reference electrode and its lead, and a counter electrode and its lead; a silver mirror film formed on the top surface of the top layer of polyimide, respectively constituting the working electrode lead, the reference electrode and its lead, and the counter electrode and its lead; and a working electrode, which is nitrogen-oxygen co-doped laser-induced graphene formed on the bottom layer of polyimide and conductively connected to the working electrode lead. A method for preparing an electrochemical microsensor and its application for detecting nitrous acid are disclosed. The present invention has the beneficial effects of good conductivity, low detection limit, stable performance, high reusability, and a wide range of applications.
Owner:GUANGXI SANHUAN CERAMIC TOWN DEV CO LTD

Laminate, decorative device, millimeter wave radar device, and sensor device

Provided are a laminate having a metal tone and colorfulness, a decorative device, a millimeter wave radar device, and a sensor device. The laminate includes a colored clear coat layer, a base material, and a silver mirror layer in this order.
Owner:RESONAC CORP

A mirror-finish metallic screen printing ink for IMD injection molding and its preparation method

This invention relates to the field of screen printing ink technology, specifically to an IMD injection molded mirror metallic screen printing ink and its preparation method. The ink is a two-component system: Component A contains a resin liquid composed of polyvinyl butyral, nitrocellulose, modified polyester resin, and polyarylate resin, flake aluminum silver powder, and additives; Component B is a phthalic diisocyanate polymer. Ethylene glycol monobutyl ether is the main solvent, ketones / esters / aromatic hydrocarbons are prohibited, and it has no corrosive effect on polycarbonate. The mass ratio of aluminum silver powder to resin solids is controlled at 0.6:1-1.2:1. The process involves preparing the resin liquid and dispersing the aluminum silver powder and additives, followed by degassing and filtration to obtain component A; before use, component B is pre-diluted with ethylene glycol monobutyl ether, added dropwise at a low shear rate of A:B = 100:8-12, and cured. The resulting ink exhibits high mirror gloss and clarity, high-temperature adhesion resistance, and MEK wiping resistance. Under IMD injection molding conditions, it demonstrates excellent consistency in appearance and structure, making it suitable for bright silver mirror-like decoration.
Owner:浙江恒基油墨科技有限公司

Mirror surface antifogging material and preparation method thereof

The invention discloses a mirror surface antifogging material, which is prepared from the following raw materials: a perfluoro solvent, perfluoropolyether and an adhesion auxiliary agent, and the adhesion auxiliary agent is polymethyl methacrylate and / or poly (hydroxyethyl methacrylate). The mirror surface anti-fog material is suitable for visual reflectors such as glass mirror surfaces, silver mirrors and aluminum mirrors, a transparent nano hydrophobic film can be formed on the mirror surfaces through simple spraying at normal temperature, the light transmittance of the formed film layer is high, and the mirror surface anti-fog material has the advantages of clear vision, long anti-fog time, fast film forming, no peculiar smell, simple operation and the like, and is suitable for popularization and application. The anti-fog mirror can be applied to articles such as bathroom mirrors, cosmetic mirrors, glasses and the like in daily life.
Owner:NINGHAI MINGDA CRAFTS CO LTD

Flip chip silver mirror light emitting diode chip and method of manufacturing the same

The application discloses a flip silver mirror light emitting diode chip and a preparation method thereof, and relates to the technical field of semiconductors. According to the application, a first annular groove is formed on a Bragg reflection layer, and a region surrounded by the first annular groove forms a first protruding part. When a P-type first insulating layer via hole is prepared subsequently, the thickness of photoresist of an edge region of the P-type first insulating layer via hole can be improved in a targeted manner, so that the etching resistance of the photoresist of the edge of the P-type first insulating layer via hole is improved. In the process of ICP etching for preparing the P-type first insulating layer via hole, the defects of sawtooth deformation and optical heterochromia of the edge region of the P-type first insulating layer via hole can be effectively improved, so that the AOI detection yield of the flip silver mirror light emitting diode chip is significantly improved.
Owner:JIANGXI ZHAO CHI SEMICON CO LTD

Laminate, decorative device, millimeter wave radar device, and sensor device

Provided is a laminate comprising a clearcoat layer, a base material, and a silver mirror layer in this order. Y (reflectance) in an XYZ color system (Yxy color system), when measured from a surface side where the clearcoat layer is provided, is 40% or more.
Owner:RESONAC CORP

High-precision silver electrode micron-scale patterning method

The invention relates to a high-precision silver electrode micron-sized patterning method, which mainly comprises the following steps of: preparing a hydrophobic molecular film on the surface of a pretreated substrate by a molecular vapor deposition method, patterning the molecular film by ultraviolet ozone photoetching, and precisely depositing a silver electrode in a pattern area by utilizing a silver mirror reaction. Therefore, the silver electrode with simplified and environment-friendly process, low equipment cost, high processing efficiency, excellent precision and strong material adaptability is prepared.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

A method for improving the brightness of an inverted LED chip

The present application relates to the field of LED, specifically relates to a kind of method for improving flip LED chip brightness, comprising the following steps: step 2: the first silicon dioxide layer is divided into reserved part and etching part;Photoresist is covered in reserved part;The structure of the obtained sapphire substrate, epitaxial layer, first silicon dioxide layer and photoresist is Wafer2;Step 3: using BOE etching Wafer2, obtains Wafer3;Silver mirror reflection layer is sputtered on the surface of Wafer3;Step 5: stripping photoresist.The beneficial effects of the present application are that: while etching the first silicon dioxide layer, the photoetching topography of silver mirror reflection layer is formed, and sputtering silver mirror radiation layer on the above photoetching topography can make the subsequent reserved silver mirror reflection layer edge adhere to the reserved part.Also, the step of photoetching silver mirror reflection layer is reduced.
Owner:FUJIAN PRIMA OPTOELECTRONICS CO LTD

Ornament and silver mirror film-forming liquid

An ornament includes a base material; and a silver particle layer containing silver particles and disposed on the base material, wherein the silver particle layer has surface resistivity of 104Ω / □ or more, and the silver particles are stacked in the silver particle layer in a thickness direction of the silver particle layer.
Owner:RESONAC CORP

Float glass copper-silver mirror surface treatment polishing device

ActiveCN224059379UExpand the grinding rangeGrinding drivesGrinding work supportsPolishingAir pump
The utility model provides a float glass copper-silver mirror surface treatment polishing device, and relates to the technical field of glass copper-silver mirror production, the float glass copper-silver mirror surface treatment polishing device comprises a waste scrap collecting box, and a dust collecting pipeline is fixedly mounted on the inner wall of one side of the waste scrap collecting box; a float glass copper-silver mirror is placed on a suction cup above a float glass copper-silver mirror placing plate, and a second air pump and a connecting pipeline are controlled to adsorb air between the suction cup and the float glass copper-silver mirror, so that the float glass copper-silver mirror can be attached and fixed above the suction cup; after fixing is completed, a float glass copper-silver mirror containing plate can be placed on the top of a conveying belt, an electric telescopic rod is controlled to drive a connecting frame and a closed machining box to descend, the closed machining box slides into the inner side of a sealing groove above the float glass copper-silver mirror containing plate, and the closed machining box and the float glass copper-silver mirror containing plate can be in a closed state.
Owner:TG CHENGDU GLASS CO LTD

Laminate, decoration device, millimeter wave radar device, and sensor device

Provided are a laminate capable of reducing a transmission attenuation amount of millimeter waves, and a decoration device, a millimeter wave radar device, and a sensor device including the laminate.SOLUTION: A laminate includes a clear coat layer, a base material, and a silver mirror layer in this order, and the clear coat layer contains particles.SELECTED DRAWING: None
Owner:RESONAC CORP

High-efficiency detection equipment for small surface area of crystal ingot

The utility model relates to the technical field of semiconductor crystal ingot processing, in particular to efficient detection equipment for a small surface area of a crystal ingot. The utility model aims to provide the high-efficiency detection equipment for the small surface area of the crystal ingot, the equipment shapes a laser beam into rectangular laser to be output, surface laser scanning is used for replacing point laser scanning, and a single scanning area is expanded, so that the scanning efficiency is improved, the end surface information omission of the crystal ingot is avoided, and the detection accuracy is improved. The efficiency and the resolution ratio of crystal ingot end face detection are higher; meanwhile, the light intensity distribution of the rectangular laser is obtained by adopting the silver reflector, and then the light intensity distribution of the reflected light of the crystal ingot is corrected, so that the influence of non-uniform light intensity of the rectangular laser on the light intensity distribution of the reflected light of the crystal ingot is avoided, and the measurement precision is improved.
Owner:WESTLAKE INSTRUMENTS (HANGZHOU) TECHNOLOGY CO LTD

Manufacturing method of LED silver mirror chip

The present application relates to the field of semiconductor electronic technology, particularly relates to a kind of LED silver mirror chip manufacturing method.The manufacturing method is evaporated on GaN epitaxial wafer ITO conductive layer, then deposit a layer of etching mask, the Mesa step surface is obtained by etching mask photolithography, etching, then using photoresist covers Mesa step surface, etching gets cutting path;BOE solution is used to etch the remaining silicon dioxide, then evaporate silver mirror after photolithography again, obtain current expansion layer and reflective layer, finally, silicon dioxide protective layer and metal electrode pad layer are prepared in sequence.The manufacturing method is prepared by adjusting steps, one-time photolithography is realized, the area of GaN layer and the area of ITO on it can be maximized to retain, and its luminous efficiency is increased.
Owner:FUJIAN PRIMA OPTOELECTRONICS CO LTD

A low-expansion silver-doped silicon-carbon composite material and its preparation method and application

The embodiment of the present invention discloses a low-expansion silver-doped silicon-carbon composite material, and the preparation method includes: first subjecting nano-silicon to acid etching treatment, then loading silver through silver-ammonia reaction, and finally mixing with a binder, a conductive liquid and a catalyst, then ball milling and carbonizing for secondary granulation. The present invention deposits silver element on the surface of porous nano-silicon that has been etched by silver mirror reaction. Compared with traditional solid-phase mixed doping, it has the characteristics of uniform deposition, controllable process, thin deposition thickness, etc., and has little effect on the energy density of the material. The deposited silver element is connected by chemical bonds and deposited on its surface, which reduces the interface impedance between the materials, improves power performance and reduces expansion. The secondary particle granulation process forms amorphous carbon after the binder is carbonized at high temperature. The added catalyst promotes the reaction progress of the granulation process and forms a small amount of pore structure during the carbonization process, reducing the expansion of the material.
Owner:NANJING SILIYUAN TECH DEV CO LTD

A light-trapping and sensitized optical fiber pH temperature sensor and its preparation method

The present invention provides a light-trapping and enhanced-sensitivity optical fiber pH temperature sensor and a preparation method thereof, relating to the field of soil detection technology. The sensor comprises a pH optical fiber sensor, wherein the optical fiber sensing layer comprises: a pH-sensitive layer, a silver mirror, a fiber core, and an optical fiber cladding. The pH-sensitive layer has a plurality of non-directionally distributed light-reflecting structures within it, and the light-reflecting structures are achieved by adding two-dimensional materials and / or three-dimensional materials during the preparation stage of the optical fiber sensing layer. The sensor solves the technical problems existing in the prior art, such as the inability to balance the sensor's response time and recovery time, low sensitivity in low-moisture soil environments, and lack of effective temperature response correction. Based on the principle of evanescent wave absorption, a coating with a light-trapping effect is constructed at the interface of the optical fiber sensor, while enhancing the coating's rapid hydrogen ion transmission characteristics. The sensor is coupled to an optical fiber temperature sensor to calibrate the pH measurement value, thereby achieving in-situ, precise measurement of the pH and temperature of a heterogeneous soil system.
Owner:PIPECHINA SOUTH CHINA CO +2

Wave-shaped lamp intelligent mirror

The utility model relates to the technical field of mirrors, and discloses a waveform lamp intelligent mirror which comprises an aluminum frame, an aluminum plate I is fixedly connected to the outside of the aluminum frame, a four-centimeter silver mirror is fixedly connected to the inside of the aluminum frame, a waveform lamp profile is fixedly connected to the top of the four-centimeter silver mirror, a light guide plate is fixedly connected to the inside of the waveform lamp profile, and a light guide plate is fixedly connected to the inside of the light guide plate. Wave-shaped lamp side plates are fixedly connected to the left side and the right side of the outer portion of the light guide plate, acrylic wave-shaped lampshades are fixedly connected to the sides, close to each other, of the two wave-shaped lamp side plates, and fixing assemblies used for fixing the wave-shaped lamp profile are fixedly connected to the outer portions of the wave-shaped lamp side plates. The external threads of the flat head screws are connected to the outer portion of the wave-shaped lamp side plate. According to the utility model, the light-supplementing lamp strip is prominent in appearance aesthetic feeling, and meanwhile, the light-supplementing lamp strip irradiates a human face at a 70-degree inclined angle, so that the practicability of the light-supplementing lamp strip is better shown. Atmosphere light bars are arranged on the two sides of the mirror body, so that the mirror is attractive in appearance and illuminates the surrounding environment.
Owner:FOSHAN HANPAI HOUSEHOLD PROD CO LTD

LED and preparation method thereof

PendingCN121057379AEngineeringMaterials science
The invention discloses an LED and a preparation method thereof. The method comprises the following steps: providing a first substrate and a second substrate; microstructures arranged in an array are arranged on one side of the first substrate; forming a buffer layer on the surface of one side of the microstructure; preparing an epitaxial layer on the surface of one side, deviating from the first substrate, of the buffer layer; stripping the first substrate to enable a complementary structure of the microstructure to be located on the surface of one side, deviating from the buffer layer, of the epitaxial layer; the epitaxial layer and the buffer layer are transferred to a second substrate, so that the epitaxial layer and the buffer layer which are stacked in sequence are arranged on the surface of one side of the second substrate; plating silver on the surface of one side, deviating from the epitaxial layer, of the complementary structure of the microstructure to form a silver mirror; and preparing electrodes on two sides of the epitaxial layer to form the LED. By using the method, the secondary reflection of the emergent light of the epitaxial layer is increased, and the light reflectivity is greater than 95%, so that the extraction efficiency of the light is increased, and the brightness and the luminous efficiency of the LED are improved.
Owner:DONGGUAN ZHONGTU SEMICON TECH CO LTD

Automobile cup stand with flocked layer with heat preservation, heat insulation and cold insulation effects

The utility model relates to the technical field of automobile cup saucers, and discloses an automobile cup saucer with a flocked layer with heat preservation, heat insulation and cold insulation effects, which comprises a cup saucer bottom frame, cup body brackets are clamped at the left end of the cup saucer bottom frame, and the cup body brackets are symmetrically arranged relative to the horizontal center of the cup saucer bottom frame; the left end of the upper end face of the cup body bracket is rotationally connected with a cover plate through a rotating assembly. A first reset spring is fixedly connected to the center of the inner bottom face of the cup body bracket, and a pressing plate is fixedly connected to the upper end face of the first reset spring. By optimizing the structural design, the cup holder comprises the movable sliding rods, the gears, the limiting clamping plates and the like which are symmetrically arranged, and the reset springs and the roller assemblies, stable clamping and automatic resetting of a cup are achieved, meanwhile, the flocking filling soft plate and the silver mirror reflecting coating are adopted, the heat preservation and heat insulation performance is improved, and the service life of the cup holder is prolonged. And the temperature keeping time of the beverage in the vehicle is effectively prolonged, and the use comfort and safety are improved.
Owner:SHANGHAI LEITUO PLASTIC PROD CO LTD

Flip chip LED chip electrode structure and method of generating the same

The present application relates to the technical fields of semiconductor preparation, in particular to a flip car lamp LED chip electrode structure and a generating method thereof, comprising the following steps: S1: evaporating Cr on the silver mirror protective layer body of the LED; S2: stopping evaporating Cr; evaporating Pt; S3: stopping evaporating Pt, evaporating Cr; S4: stopping evaporating Cr, evaporating Pt; S5: stopping evaporating Pt, evaporating Au; S6: stopping evaporating Au, evaporating Ti; stopping evaporating Ti, to obtain the flip car lamp LED chip electrode structure. The flip car lamp LED chip electrode structure provided by the present application and the generating method thereof provide multiple protection for the silver mirror reflection layer, and the corrosion resistance to the silicon dioxide corrosion liquid is excellent, and the anti-aging property and reliability are excellent.
Owner:FUJIAN PRIMA OPTOELECTRONICS CO LTD