1380 results about "Micron scale" patented technology

The invention provides an LED packaging material defect detection method, which comprises the following steps: performing image enhancement processing on each layer of separated image to obtain each layer of clear material image; carrying out local fine scanning on the identified cross defect area to obtain micron-sized three-dimensional structure data, and reconstructing fine morphology characteristics of the cross defect; according to the reconstructed cross flaw structure, combining various material performance parameters pre-stored in a material database to simulate and calculate the influence of flaws on the LED performance, including optical, thermal and mechanical properties; and judging the position, the size, the type and the influence degree on the performance of the flaws, and carrying out quantitative scoring on the overall quality of LED packaging to obtain a final detection result and quality grade judgment.

The invention discloses a cleaning control method and system based on an electronic cleaning agent, and the method comprises the steps: obtaining the distribution characteristics of pollutants and a material sensitivity judgment result through obtaining the micron-sized particle distribution data, chemical residue concentration data and surface roughness parameters of the pollutants on the surface of an electronic workpiece; according to the pollutant distribution characteristics and the material sensitivity judgment result, matching a candidate formula from a preset cleaning agent formula database, calculating pollutant removal rate predicted values of different concentration and time combinations through a linear regression algorithm, and determining optimized cleaning agent formula parameters and cleaning strength control parameters; and in the cleaning process, the residual quantity of pollutants and the surface damage degree are collected in real time, if the residual quantity of the pollutants exceeds a preset threshold value T1 or the surface damage degree exceeds a preset threshold value T2, cleaning agent injection pressure and cleaning time parameters are dynamically adjusted, and updated cleaning execution parameters are generated. Accurate and efficient cleaning of the surface of the electronic workpiece is achieved.

The invention relates to the technical field of liquid absorption cores, and discloses a porous superstructure with excellent liquid absorption performance, which comprises a macroscopic lattice structure, the macroscopic lattice structure is manufactured by using an additive manufacturing method, the macroscopic lattice structure forms a macroscopic porous structure with lattice arrangement, the macroscopic porous structure is in a millimeter level, and the macroscopic porous structure is a porous structure. The lattice pillars of the macroscopic lattice structure form a micro porous structure, the micro porous structure is micron-sized, the diameter of macroscopic pores in the macroscopic porous structure is 200-1000 microns, and the diameter of micro pores in the micro porous structure is 50-150 microns. The macroscopic pores provide good permeability, and the microscopic pores of the porous material provide good capillary force, so that comprehensive optimization of the permeability and the capillary force is achieved through cooperation of the macroscopic pores and the microscopic pores, and the liquid absorption performance and the heat transfer performance of the liquid absorption core are greatly improved; and meanwhile, the macroscopic / microcosmic pore proportion, lattice configuration and distribution can be adjusted to realize regulation and control of liquid absorption performance and mechanical strength, and the integrally-formed liquid absorption core with the structure and the function integrated is prepared.

The invention belongs to the technical field of material preparation. The invention provides a porous tantalum carbide ceramic as well as a preparation method and application thereof, the preparation method comprises the following steps: mixing tantalum powder and / or tantalum carbide powder with tantalum salt and an organic ligand source in a liquid phase system, rapidly cooling to form a solid, vacuumizing and sintering the obtained solid, and carbonizing to obtain the porous tantalum carbide ceramic. According to the preparation method, an organic ligand source provides a ligand, so that the ligand and tantalum form a metal organic framework structure, pores and distribution are adjusted, pore forming is realized through further decomposition or volatilization at a high temperature, and finally, the prepared porous silicon carbide ceramic has disordered micron-sized pores, and when the porous silicon carbide ceramic is applied to preparation of single crystal silicon carbide through a physical vapor deposition method, the pore forming efficiency is improved. Compared with a traditional graphite material, the graphite material can allow gaseous substances generated by silicon carbide to pass through, is resistant to high temperature and high in strength, does not participate in reaction, does not generate impurities entering crystals or forming carbon wrapping and the like, and effectively achieves the filtering effect.

The invention belongs to the technical field, and discloses a film coating processing technology simulation and optimization system based on digital twinning. The system is composed of a data acquisition module, a feature recognition and analysis module, a behavioral digital twinborn simulation module, a coating uniformity evaluation module, a process parameter optimization module and a coating distribution prediction module. The method comprises the following steps: acquiring a three-dimensional roughness digital model of a base material, accurately identifying a micron-sized local rough region and extracting geometrical characteristic parameters of the micron-sized local rough region; constructing a coating growth behavior digital twinborn model based on the geometrical characteristic parameters and the process parameters, and accurately simulating the coating growth process of the local rough area; and establishing a global coating uniformity quantitative evaluation system, and optimizing a process parameter combination by applying machine learning and a genetic algorithm. The system breaks through the limitation of traditional static shadow hypothesis, real-time tracking and accurate simulation of microstructure evolution in the deposition process are achieved, and the coating growth prediction accuracy is remarkably improved.

The invention discloses a double-PHA barrier system for a paper-based container and a paperboard as well as a preparation method and application of the double-PHA barrier system, and belongs to the technical field of paper-based material surface engineering and green packaging. The system sequentially comprises a paper base material, a water-based PHA dispersion hole sealing layer and a PHA extrusion compact layer from inside to outside. According to the invention, the micron-sized PHA dispersoid without cell debris is utilized, so that an efficient hole sealing effect which is difficult to achieve by a high coating amount in a traditional process can be achieved by only needing an extremely low coating amount, and the pinhole defect of an extrusion layer is eliminated from the source. And in cooperation with the modified PHA extrusion layer with the specific crystallinity, the problem of micro-cracking of a single coating during edge rolling forming is cooperatively solved. According to the system, excellent barrier performance is achieved through a thinner bio-based structure, and meanwhile the system has a wide heat sealing window and excellent repulp recycling performance. Compared with the prior art, on the premise that high performance is guaranteed, the consumption amount of packaging materials and the environmental burden are remarkably reduced.

The invention relates to the technical field of milling cutters, in particular to a multi-tooth micro-blade milling cutter and a manufacturing method and application thereof. The multi-tooth micro-blade milling cutter comprises a cutter handle and a cutter head body, wherein the cutter head body is fixedly connected to one end of the cutter handle; the multiple cutter teeth are arranged on the outer side face of the cutter head body, and each cutter tooth extends to the tail end, close to the cutter handle, of the cutter head body from the top end, away from the cutter handle, of the cutter head body; each cutter tooth comprises a front cutter face, a rear cutter face and a cutting edge, the cutting edge is provided with a plurality of continuously-distributed micron-sized protruding micro-blades, the micro-blades form an arc-shaped sawtooth structure, the micro-blades extend to the front cutter faces and form micro grooves in the front cutter faces, the micro-blades extend to the front cutter faces and form micro grooves in the front cutter faces, and the micro-blades extend to the rear cutter faces and form micro grooves in the front cutter faces. The multi-tooth micro-blade milling cutter has the structure of the front angle of the front cutter face of the milling cutter tooth and the rear angle of the rear cutter face of the milling cutter tooth, the linear cutting blade of the traditional cutter tooth is dispersed into micro blades, the stress concentration of the cutter is reduced, a plurality of convex micro blades are in grinding motion on the machining face in the milling process, and the milling and grinding combined machining effect is formed. Unification of machining efficiency and machining precision is achieved.

The utility model provides a micro-fluidic chip and a micro-fluidic system, a micron-sized main channel is arranged in the micro-fluidic chip, and a sample to be detected is introduced into a generation area of the main channel to form a large number of micro-droplets. The micro-droplets serve as a reaction container to react with tyrosine and tyrosinase which are guided into the reaction area of the main channel, and finally absorbance testing can be conducted on the micro-droplets in the detection area of the main channel. The micro-droplets are small in volume, have high surface area to volume ratio, and can form a reaction container for efficient reaction. The microfluidic system can rapidly and accurately measure to-be-detected samples with different concentrations, and has the advantages of low reagent consumption, energy conservation, environmental protection, small required detection space, large-scale parallel operation and the like.

The invention discloses a composite regulation and control method for improving the performance of a laser additive manufacturing high-strength aluminum alloy, and relates to the technical field of laser additive manufacturing high-strength aluminum alloy materials, micron-sized ceramic particles and micron-sized AlMgScZr alloy powder are mixed, and ceramic particle reinforced aluminum-based composite powder is prepared. According to the composite material powder, the solidification structure is regulated and controlled through the characteristics of ceramic particles, stress concentration is reduced, and meanwhile the reinforcing phase particle aggregation phenomenon is avoided. The obtained composite material is excellent in quality and few in metallurgical defects in laser forming, and the density reaches up to 99.8% or above. By combining the optimized selective laser melting and heat treatment process, the room-temperature mechanical property of the prepared composite material part is remarkably improved, the tensile strength exceeds 540 MPa, the yield strength exceeds 490 MPa, and the elongation at break exceeds 10%.

The invention provides a high-strength and high-conductivity copper alloy with a fine grain structure and a preparation method of the high-strength and high-conductivity copper alloy, and belongs to the technical field of copper alloy preparation. The copper alloy comprises the following elements in percentage by mass: 2.0-12.0 wt.% of Ni, 0.4-3.0 wt.% of Si, less than or equal to 1.0 wt.% of Zn, less than or equal to 5.0 wt.% of Ti, less than or equal to 1.0 wt.% of B and the balance of Cu and inevitable impurities. According to the method, the heat treatment process is adjusted, generation of Ni16Ti6Si7 and TiB2 phases is promoted through introduction of Ti and B elements, micron-sized particles can serve as nucleation sites and pinning grain boundaries in the heat deformation process, and grain refinement is promoted. The high-strength and high-conductivity copper alloy with a fine grain structure is obtained by changing the content of Ti and B elements in the copper alloy and regulating and controlling the proportion of Ni16Ti6Si7, a TiB2 micron phase and a Ni2Si nano phase.

The embodiment of the invention provides a manufacturing method of a glass through hole, which is used for solving the technical problem that a glass through hole with an ultrahigh depth-diameter ratio cannot be manufactured according to a pre-designed scheme in an existing manufacturing method of the glass through hole. According to the manufacturing method of the glass through hole, before laser-induced modification, exposed prefabricated through hole graphical areas are formed on the front face and the back face of a glass substrate through the micron-order photoresist mask technology, and meanwhile a photoresist layer with the thickness not smaller than 5 micrometers is formed on the surface, outside the prefabricated through hole graphical areas, of the glass substrate. In the laser-induced modification stage, laser with higher irradiation power can be used for deeply modifying the glass material in the prefabricated through hole patterned area to form a prefabricated through hole modified area. In the chemical etching stage, the surface of the glass substrate outside the prefabricated through hole modified area is covered with the anti-corrosion photoresist layer, and etching liquid only acts on the prefabricated through hole modified area, so that the phenomenon that the thickness of the glass substrate is reduced in the etching process is effectively prevented.

The invention relates to the technical field of biomedical materials, and discloses a high-stability porous hydroxyapatite microsphere as well as a preparation method and application thereof, and the porous hydroxyapatite microsphere is formed by self-assembling nano-scale hydroxyapatite particles under the driving of a thermodynamic behavior of reducing excess surface free energy; the porous hydroxyapatite microspheres are nano-scale to micron-scale microspheres with rough surfaces; the porous hydroxyapatite microspheres have a nano-scale pore channel structure; the mineralization is improved under the assistance of the porous hydroxyapatite microspheres; the defects that hydroxyapatite microspheres in the prior art are sharp in microstructure, poor in histocompatibility, free of a porous structure and the like are overcome, the preparation method is simple, the safety coefficient of the production process is high, the obtained porous microspheres are stable in structure, various parameters can be adjusted according to requirements, and the method is suitable for industrial large-scale production.

The invention discloses a high-temperature-resistant, bending-resistant and high-flexibility polyimide film for flexible display and a preparation method of the high-temperature-resistant, bending-resistant and high-flexibility polyimide film. According to the polyimide film, by introducing the nano silicon dioxide particles and constructing the porous structure design, the problems that a traditional polyimide film is insufficient in stability in a high-temperature environment, cracks are likely to be generated after bending, and the flexibility is poor are effectively solved. The polyimide film disclosed by the invention is prepared by adopting a diamine monomer and a dianhydride monomer as main raw materials, adding nano silicon dioxide particles, and carrying out solution polymerization, gelation, pore regulation and control and thermal imidization processes. The obtained polyimide film has a micron-sized porous structure, keeps stable at a high temperature of 400 DEG C, does not generate cracks after being bent for 100,000 times, has tensile strength of more than or equal to 150MPa, elongation at break of more than or equal to 25% and light transmittance of more than or equal to 85%, and is suitable for a substrate material of a flexible display device.

The invention discloses a sample preparation and characterization method of a rotation angle crystal interface, which is suitable for a sample with dislocation at the interface of two crystals, and comprises the steps of sample preparation and measurement of the relative rotation angle theta of the two crystals. A certain angle is formed between the cutting direction and the interface for sample preparation, a slice is taken out, and the obtained slice has three thin areas including a top material A crystal, a top material A / bottom material B crystal mixing area and a bottom material B crystal; measurement of the rotation angle theta: the electron beam direction is parallel to the rotation axis of the top sample during testing, and the rotation angle theta is directly measured by analyzing crystallographic information of the three thin areas. According to the method, the rotation angle of the top crystal relative to the bottom crystal can be accurately measured through TEM analysis of the three thin regions, and the error-tolerant rate of TEM sample preparation and analysis experiments is improved. In addition, the sample preparation technology can be used for monitoring the change of the physical properties of the sample in mechanics, thermotics, optics, electricity and the like along with the reduction of the size of the sample from the micron level to the nano level.

The invention belongs to the technical field of biological material surface modification, and discloses a medical titanium alloy surface bionic multifunctional composite coating and a preparation method thereof. According to the method, the medical titanium alloy is sequentially subjected to micro-arc oxidation and anodic oxidation, and then the bionic multifunctional composite coating on the surface of the medical titanium alloy is prepared. The purpose of micro-arc oxidation is to prepare a micron porous coating on the surface of the medical titanium alloy. According to anodic oxidation, a series of nano-coatings are synthesized on the surface of the micro-arc oxidation coating, the nano-coatings can be composed of discontinuous cauliflower-shaped nano-particles or can be of a continuous film-forming cauliflower-shaped structure, and the thickness of the nano-coatings can be from the nanometer level to the micrometer level. According to the coating, the biological function is further improved through the nano coating while the mechanical anchoring effect of the micron porous structure on new bone tissue is maintained. Even if the coating is damaged by external force, the high binding force of the coating does not cause the failure of the coating, and the coating also has good wear resistance and corrosion resistance.

A micron-sized speckle preparation method for quasi-in-situ OIM-DIC mesoscopic strain field analysis comprises the following steps: (1) polishing the surface of a sample to be detected to obtain a bright and scratch-free mirror surface; (2) preparing Si powder turbid liquid; (3) dipping speckles of a sample to be detected in the Si powder turbid liquid to obtain micron-sized speckles; and (4) observing and shooting speckle morphology, and if Si particles are uniformly distributed and dispersed, applying the Si particles to quasi-in-situ OIM-DIC mesoscopic strain field analysis. The method is simple, convenient and rapid, low in operation and construction cost, high in practicability, good in particle dispersity, high in precision, more suitable for calculation of a quasi-in-situ OIM-DIC mesoscopic strain field, controllable in preparation process, low in cost and free of damage to the surface of a sample, the definition and stability of speckle characteristics are remarkably improved, DIC mesoscopic micron-scale operation under a quasi-in-situ OIM mechanical test can be effectively achieved, and the method is suitable for large-scale industrial production. And the grain and mesoscopic strain field information is successfully coupled.

The invention discloses a wafer-level low-temperature bonding process and a wafer bonding structure based on a smooth surface transfer method, which can realize wafer-level bonding in an air environment and under a low-temperature condition, and the bonding strength reaches the national military standard. According to the wafer-level low-temperature bonding process, firstly, a first bonding metal layer with the root mean square surface roughness smaller than 1 nm and the micron-level thickness is prepared through a transfer method; then, carrying out plasma treatment on the smooth first metal surface of the first bonding metal layer; and finally, heating and pressurizing bonding is carried out in an air environment, so that low-temperature wafer bonding is realized.

The invention discloses a microcrystalline texture glass cover plate and a preparation method thereof. The microcrystalline texture glass cover plate comprises a glass body; a series of surface microstructures are arranged on the surface of the glass body, the section of each surface microstructure is in a wave shape, compared with a common glass cover plate, the glass cover plate is endowed with more excellent optical and mechanical performance due to the special structure of the microcrystalline glass, and the requirements of high-end markets are better met when the glass cover plate is applied to consumer electronics cover plates. The diversification of the MASK design provides diversification of the texture effect of the microcrystalline glass, and specific requirements are met. And the surface of the microcrystalline glass is processed more accurately by the yellow light development technology and reaches the micron level. Pyramid morphology of particles on the surface of the microcrystalline glass is regulated and controlled through a wet etching process, uniform etching is carried out, the texture effect is brighter, and the hand feeling is finer and smoother.

The invention discloses a photoelectric wafer defect detection method, and belongs to the technical field of semiconductors. The detection method comprises the steps that the surface of a photoelectric wafer is covered with a quantum dot precursor solution, annealing is carried out, after a quantum dot film is formed, irradiation is carried out under ultraviolet light, a displayed fluorescence signal can mark defects on the surface of the photoelectric wafer, and the purpose of detecting the defects of the photoelectric wafer is achieved. The quantum dots used in the invention have excellent fluorescence efficiency and stability, and can provide a high-contrast marking effect in an SEM image. Therefore, the detection of micron-scale and nano-scale defects is more accurate, and the details are clearer. A traditional fluorescence labeling solution is limited in infiltration capacity in nanoscale defects and can only cover the surface. The quantum dots can penetrate into the defect to form a mark with the depth ratio as high as 1: 3. The depth marking capability is helpful for comprehensively knowing the internal structure of the defect and the defect extension condition. In addition, the quantum dots have excellent adaptability and multifunctionality, and show good stability and coupling effect under different types of wafer conditions.

The invention discloses an optical microscopy method, system and device for positioning magnetic nanoparticles, and the method comprises the steps: obtaining an interference pattern generated when laser passes through a to-be-detected sample, and distributing the magnetic nanoparticles in the to-be-detected sample; the interference pattern is formed by interference of incident laser and scattered light of the magnetic nanoparticles; determining a distribution function of the interference pattern, and determining the central position of the magnetic nanoparticle according to the interference pattern and the distribution function; the device comprises a laser, an amplification objective lens, a focusing lens, an imaging unit and a processor, light emitted by the laser passes through a to-be-detected sample to generate an interference pattern, the interference pattern is amplified by the amplification objective lens and focused by the focusing lens to be imaged in the imaging unit, and magnetic nanoparticles are distributed in the to-be-detected sample. According to the embodiment of the invention, micron-sized space positioning of the magnetic nanoparticles can be realized, and the method can be widely applied to the technical field of optical positioning.

The invention discloses a preparation method of a photo-thermal super-hydrophobic anti-icing composite coating. The preparation method comprises the following steps: dispersing micron-scale particles and nano-scale particles in a solvent, and adding a dispersing agent to obtain a uniform mixture solution; spraying the mixture solution on the surface of a substrate by using a spray gun to obtain the photo-thermal super-hydrophobic anti-icing composite coating; the prepared photo-thermal super-hydrophobic anti-icing composite coating has the characteristics of super hydrophobicity, low adhesion, photo-thermal property, icing resistance and strong mechanical stability. The preparation method is simple, scientific in process, wide in application scene and especially suitable for power transmission lines.

The invention relates to the field of decorative films, in particular to an indented pattern color scraping decorative film and a preparation method thereof.The indented pattern color scraping decorative film comprises a skin feeling functional layer, a pattern developing layer, a supporting strengthening layer and a coloring strengthening layer, the skin feeling functional layer, the pattern developing layer and the supporting strengthening layer are composited into an integrated structure through hot pressing, and micron-sized air guide grooves are formed in the bonding faces of all the layers; the air guide grooves are arranged in parallel along the extending direction of the dimpled grains, the 60-degree glossiness of the surface of the decorative film is less than 3GU, the pencil hardness is greater than 1H, and the texture spacing difference between the outline edge of the dimpled grains and the printed pattern layer is 0.1-0.5 mm, so that the decorative film is endowed with excellent stereoscopic visual effect and physical property. The dimpled grain structure in the skin-touch functional layer is directly formed on the surface of the skin-touch coating, the problem of interlayer dislocation caused by traditional composite embossing is avoided, it is ensured that the dimpled grain outline is clear, the peeling strength between layers is high, bonding is tighter, and no bubble is left on the bonding face between the layers.

The present invention discloses a wafer bonding magnetic alignment method and device, the device includes at least an X-Y moving system, a bottom wafer bonding table, a magnetic sensor module, a bonding arm module, a device base and a frame. The method makes an alignment groove on the wafer through a semiconductor processing technology, and deposits a magnetic column of magnetic material in the groove. After magnetization, the magnetic column has a permanent magnetic property. The spatial magnetic field distribution in the wafer magnetic column is detected by a magnetic sensor to find the boundary or center of the magnetic column, thereby realizing the detection of wafer position information. Compared with the traditional optical alignment method, the magnetic sensor does not need to calibrate the position, and the alignment is performed when the distance between the two wafers is in the micron level. After alignment, there is no need to move the alignment again, and direct bonding is performed, which improves the efficiency and accuracy of wafer bonding.

The present invention relates to the technical field of polymer functional materials, and in particular to a micron-sized polymer microsphere and a preparation method and application thereof. First, a core layer emulsion is prepared by using a mixed monomer A under the action of an initiator, and then a shell layer emulsion is prepared by using a mixed monomer B. The shell layer emulsion is added dropwise to the core layer emulsion to form a micron-sized polymer microsphere under the action of an initiator. The micron-sized polymer microsphere of the present invention has good heat resistance and flame retardancy, good mechanical properties, can resist high temperature shrinkage, and has uniform and stable size.

The invention belongs to the technical field of polycrystalline silicon sample preparation, and particularly relates to a method for fixed-point preparation of a polycrystalline silicon microstructure characterization sample. The method comprises the following steps: preparing a polycrystalline silicon sample; the polycrystalline silicon sample is polished and flattened through abrasive paper; carrying out mechanical polishing and ion polishing on the polycrystalline silicon sample obtained by abrasive paper polishing; and performing micron-sized fixed-point ion polishing on the polycrystalline silicon sample obtained by mechanical polishing and ion polishing to obtain the polycrystalline silicon microstructure characterization sample. According to the method, mechanical polishing, ion polishing and micron-sized fixed-point ion polishing processes are combined, an observation sample in a completely lossless state is obtained, the sample can meet observation of a microstructure at a specific position, and the problems mentioned in the background technology are solved.

The invention discloses a foot and leg integrated design foot and wheel matched type multi-degree-of-freedom piezoelectric robot and an excitation method thereof, and belongs to the field of centimeter-level small robots. According to the robot, piezoelectric ceramics are pasted on an integrated base body, and the piezoelectric ceramics are divided into two pieces of Y-direction piezoelectric ceramics and two pieces of Z-direction piezoelectric ceramics; when two paths of sine excitation signals with the phase difference of 90 degrees are applied to the Y-direction piezoelectric ceramic and the Z-direction piezoelectric ceramic respectively, the base body beam bends and vibrates in the horizontal (Y-direction) direction and the vertical (Z-direction) direction, the foot bottom end is driven to synthesize an elliptic track in the YOZ plane, and rotation motion is achieved through friction between the foot end and the ground. Similarly, an elliptical track can be synthesized in an XOZ plane under excitation of different signals, and linear motion is achieved through friction between the foot end and the ground; when a pulse signal is applied to the piezoelectric ceramic, the robot moves at a micron-order micro step pitch. The robot has the advantages of being simple in structure, high in response speed, capable of giving consideration to fast macro motion and precise micro motion and the like, and faces scenes such as large-range precise detection.

The invention discloses a method and application for ultrasonic-assisted laser additive manufacturing of a multi-scale structure coupling high-toughness aluminum alloy, and the method comprises the steps that high-Ni-content alloy steel powder is refined through high-energy ball milling, and then the refined alloy steel powder is dispersed and distributed in Al-Mg-Sc-Er-Zr alloy powder; an ultrasonic energy field is introduced to assist selective laser melting to form mixed powder, the ultrasonic energy field assists in generating nonlinear effects such as cavitation, acoustic streaming and heat effect, defects such as air holes and cracks are overcome to eliminate residual stress, and the Marlangoni effect is accelerated to increase the solidification speed; and finally, the high-strength and high-toughness aluminum alloy which has high density and is composed of micron-scale, submicron-scale and nano-scale multi-scale phase structures is prepared. The production cost is low, and the room-temperature tensile properties of the prepared high-strength and high-toughness aluminum alloy are as follows: the strength is greater than 850 MPa, and the fracture strain is greater than 6%.

The invention relates to the technical field of heat dissipation of semiconductor devices, in particular to a two-phase cold plate with three-stage porous heat dissipation and a processing method of the two-phase cold plate. The invention discloses a two-phase cold plate with three-stage porous heat dissipation, which comprises a substrate, and a micro-channel is arranged in the substrate. On one hand, flow distribution is regulated and controlled based on the micro-channel of topological optimization, and on the other hand, the surface liquid storage capacity during two-phase boiling is improved and the separation diameter of bubbles is regulated and controlled by machining the micron-sized blind holes in the inner bottom of the micro-channel; on the other hand, nanoscale blind holes are formed in the inner bottom and the inner wall of the micro-channel and in the micron-sized blind holes to improve the gasification core density and strengthen the liquid wicking performance; and the three are combined to form three-stage heat dissipation, so that the heat dissipation performance of the cold plate can be remarkably improved. The problems that an existing conventional two-phase cold plate is unreasonable in design, physical damage is prone to occurring, and the heat dissipation performance of the two-phase cold plate is affected are solved.

The invention relates to the technical field of aluminum alloy guide rail machining processes, in particular to a high-precision manufacturing process of an aluminum alloy guide rail for rail transit, and the high-precision manufacturing process of the aluminum alloy guide rail specifically comprises the following steps: step 1, designing and smelting an alloy material, and utilizing component optimization to design an alloy formula to inhibit grain coarsening; impurity control: Fe < = 0.25%, and Mn < = 0.15%; the tensile strength is greater than or equal to 275MPa, and the ductility is greater than or equal to 12%, which is superior to that of similar products (conventionally less than or equal to 10%); micron-order precision control: the cross section dimensional tolerance is less than or equal to + / -0.15 mm (improved by 50% compared with the traditional process); 12 key parameters from smelting to finished products are monitored in real time, and the yield is increased to 99.8% from 92%.

The invention discloses a method for improving the medium-temperature strength of an additive manufacturing Al-Si alloy, and belongs to the field of metal materials. According to the method, the Al-Si alloy serves as a base body, micron-sized AlB2 and Ti powder are added, laser irradiation energy in the additive manufacturing process is used for enabling the micron-sized AlB2 and Ti powder to react, and nanoscale TiB2 and D022-Al3Ti strengthening phases are synthesized in situ so that the medium-temperature strength of the material can be improved. By optimizing the content of the components, the adding proportion of the AlB2 powder and the adding proportion of the Ti powder are controlled to be 1.20-1.60 wt.% and 1.80-2.40 wt.% respectively, and the mass ratio of the AlB2 powder to the Ti powder is 2: 3. Through the synergistic effect of the two nanoscale second phases, the alloy can have high strength in a medium-temperature environment without post-heat treatment, and meanwhile, the high percentage elongation after fracture is kept. The yield strength of the alloy in the environment of 300 DEG C reaches 190 MPa, the tensile strength reaches 200 MPa, the ductility reaches 10%, and the strength upper limit of the selective laser melting near-eutectic Al-Si alloy in the working environment of 300 DEG C is broken through. The mechanical property of the aluminum alloy is comparable with that of Al-Ni, Al-Ce and other heat-resistant aluminum alloys prepared through selective laser melting, and the aluminum alloy is lower in cost and lighter in density.