This application discloses a method for manufacturing
probe card adapter boards based on MEMS
processing technology. The adapter board is made of a
ceramic substrate that has undergone correction and compensation treatment followed by rewiring. The correction and compensation treatment involves forming several position-corrected pads on the bonding surface of the
ceramic substrate after
sintering using a rewiring process. These pads are then electrically connected to several electrodes within the
ceramic substrate. This method changes the position of the PADs through a compensation layer, ensuring that the position of the exposed PADs on the flip-
chip bonding surface of the adapter board meets production requirements. The flip-
chip bonding surface can be reprocessed, and this method offers faster
turnaround time, stability, and simplicity.