The invention provides a heat-conduction heat-dissipation interface material and a manufacturing method thereof, wherein the heat-conduction heat-dissipation interface material is applied to the field of heat dissipation of electronic products. The heat-conduction heat-dissipation interface material comprises a heat-conduction heat-dissipation layer and a surface protective material layer, wherein the heat-conduction heat-dissipation layer consists of one or more of graphite, nano graphite, crystalline flake graphite, graphene, pyrolytic carbon, pyrolytic graphite, graphite powder, carbon nano tubes, carbon fibers, graphite fibers, resin, ceramic fibers, quartz fibers, metal fibers, zirconia, boron nitride, silicon nitride, boron carbide, silicon carbide, magnesia powder, metasillicio acid fibers, calcium silicate aluminum fibers, aluminium oxide fibres, copper power, aluminium power, silver power, tungsten power and molybdenum power; and the surface protective material layer is a polymeric membrane. The heat-conduction heat-dissipation interface material manufactured according to the materials and the method provided by the invention has the advantages of effectively improved heat-dissipation performance, small volume, light weight and small thickness, can be used for prolonging the service life of an electronic component, and simultaneously is easy to produce and process.