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1159 results about "Polymeric membrane" patented technology

Method and apparatus for determining the state of fouling/cleaning of membrane modules

The fouling state of a polymeric membrane within the high pressure housing of a spiral wound or a hollow fiber membrane module is determined. An ultra sonic transducer positioned with its emitting face in physical engagement with the outer surface of the housing is pulse energized by a pulser/receiver device. A membrane echo signal is detected by a receiver of the pulser/receiver device. A reference echo signal indicative of a fouled or an unfouled state of the membrane is compared to the echo signal to determine the membrane fouling state. The echo to reference comparing step can be based upon comparing amplitude domain signals, comparing time-domain signals, comparing combinations of amplitude domain and time-domain signals, and comparing transformations of amplitude domain and time-domain signals. A clean or a fouled reference echo can be provided from a clean or a fouled membrane and then stored for use during a liquid separation process, or a clean reference echo signal can be obtained on-line from a second transducer whose echo signal is derived from an area of the membrane known to remain relatively unfouled during the liquid separation process, or a clean or fouled reference echo signal can be provided for later use during a cleaning process or during a liquid separation process. Multiple transducers and a switching network can sample the fouling state at different positions within the membrane module.
Owner:UNIV TECH

Heat-conduction heat-dissipation interface material and manufacturing method thereof

The invention provides a heat-conduction heat-dissipation interface material and a manufacturing method thereof, wherein the heat-conduction heat-dissipation interface material is applied to the field of heat dissipation of electronic products. The heat-conduction heat-dissipation interface material comprises a heat-conduction heat-dissipation layer and a surface protective material layer, wherein the heat-conduction heat-dissipation layer consists of one or more of graphite, nano graphite, crystalline flake graphite, graphene, pyrolytic carbon, pyrolytic graphite, graphite powder, carbon nano tubes, carbon fibers, graphite fibers, resin, ceramic fibers, quartz fibers, metal fibers, zirconia, boron nitride, silicon nitride, boron carbide, silicon carbide, magnesia powder, metasillicio acid fibers, calcium silicate aluminum fibers, aluminium oxide fibres, copper power, aluminium power, silver power, tungsten power and molybdenum power; and the surface protective material layer is a polymeric membrane. The heat-conduction heat-dissipation interface material manufactured according to the materials and the method provided by the invention has the advantages of effectively improved heat-dissipation performance, small volume, light weight and small thickness, can be used for prolonging the service life of an electronic component, and simultaneously is easy to produce and process.
Owner:SHANGHAI QI JIE CARBON MATERIALS
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