Heat-conduction heat-dissipation interface material and manufacturing method thereof

A technology of interface material and manufacturing method, which is applied in the processing and manufacturing of heat conduction and heat dissipation interface materials, and in the field of heat conduction and heat dissipation interface materials, can solve the problems of uncontrollable thermal conductivity, short service life, and large volume, and achieve light weight and improved service life , small size effect

Active Publication Date: 2012-08-29
SHANGHAI QI JIE CARBON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In view of the above-mentioned defects, the purpose of the present invention is to provide a heat-conducting and heat-dissipating interface material to solve the problems of large weight, large volume, high thickness, short service life and uncontrollable thermal conductivity caused by the use of non-ferrous metals in the prior art. technical p

Method used

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  • Heat-conduction heat-dissipation interface material and manufacturing method thereof
  • Heat-conduction heat-dissipation interface material and manufacturing method thereof
  • Heat-conduction heat-dissipation interface material and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Please refer to image 3 , Is a flow chart of a matrix material of PET film, using graphene to make a thermal and heat dissipation interface material. It can be seen that it mainly includes the following steps:

[0061] S101: Pre-coated adhesive on PET film;

[0062] S102: Cover the surface of the PET film with adhesive evenly with graphene;

[0063] S103: Cover the side where the graphene is covered with a polymer film;

[0064] S104: Press the fabricated multilayer structure sheet on a molding machine;

[0065] S105: Obtain a manufactured heat and heat dissipation material;

[0066] S106: Add polymer film protective material layer;

[0067] S107: The upper die-cutting equipment is cut into thermal and heat dissipation interface materials that meet the requirements as required.

[0068] Please refer to image 3 , Step A: The production of thermal and heat dissipation materials includes step S101 to step S104.

[0069] Graphene has extraordinary electrical conductivity, the highest t...

Embodiment 2

[0072] Please refer to Figure 4 , Is a flow chart of a matrix material of PET film, using graphite fiber to manufacture high thermal conductivity and heat dissipation interface material, it can be seen that it mainly includes the following steps:

[0073] S201: Pre-coated adhesive on PET film;

[0074] S202: Lay the graphite fiber unidirectional cloth on the PET film with adhesive;

[0075] S203: Cover the side covering the graphite fiber with a polymer film;

[0076] S204: Molding the manufactured multilayer structure sheet on a molding press;

[0077] S205: Obtain a manufactured heat and heat dissipation material;

[0078] S206: Add polymer film protective material layer or adhesive;

[0079] S207: The upper die-cutting equipment is cut into thermal and heat dissipation interface materials that meet the requirements as required.

[0080] Please refer to Figure 4 , Step A: The production of thermal and heat dissipation materials includes step S201 to step S204.

[0081] The above method ...

Embodiment 3

[0083] Please refer to Figure 5 , Is a flow chart of PET film, which uses aluminum powder to manufacture high thermal conductivity and heat dissipation interface material, as a matrix material. It can be seen that it mainly includes the following steps:

[0084] S301: Pretreatment of PET film;

[0085] S302: Put the PET film in the vapor deposition furnace for aluminum plating;

[0086] S303: Turn on the vapor deposition equipment, and aluminum will be plated on the surface of the film;

[0087] S304: Rewinding;

[0088] S305: Obtain a manufactured heat and heat dissipation material;

[0089] S306: Add a polymer film protective material layer;

[0090] S307: The upper die-cutting equipment is cut into thermal and heat dissipation interface materials that meet the requirements as required.

[0091] Please refer to Figure 5 , Step A: The production of heat and heat dissipation materials includes steps S301 to S304.

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Abstract

The invention provides a heat-conduction heat-dissipation interface material and a manufacturing method thereof, wherein the heat-conduction heat-dissipation interface material is applied to the field of heat dissipation of electronic products. The heat-conduction heat-dissipation interface material comprises a heat-conduction heat-dissipation layer and a surface protective material layer, wherein the heat-conduction heat-dissipation layer consists of one or more of graphite, nano graphite, crystalline flake graphite, graphene, pyrolytic carbon, pyrolytic graphite, graphite powder, carbon nano tubes, carbon fibers, graphite fibers, resin, ceramic fibers, quartz fibers, metal fibers, zirconia, boron nitride, silicon nitride, boron carbide, silicon carbide, magnesia powder, metasillicio acid fibers, calcium silicate aluminum fibers, aluminium oxide fibres, copper power, aluminium power, silver power, tungsten power and molybdenum power; and the surface protective material layer is a polymeric membrane. The heat-conduction heat-dissipation interface material manufactured according to the materials and the method provided by the invention has the advantages of effectively improved heat-dissipation performance, small volume, light weight and small thickness, can be used for prolonging the service life of an electronic component, and simultaneously is easy to produce and process.

Description

technical field [0001] The invention relates to the application of a polymer composite material, in particular to a heat conduction and heat dissipation interface material made of a polymer composite material and a processing and manufacturing method of the heat conduction and heat dissipation interface material. Background technique [0002] Thermal conduction and heat dissipation interface materials are widely used in the fields of computers, notebook computers, LED lighting, communications, rectifiers, medical and industrial equipment, etc. The existing heat conduction and heat dissipation interface materials generally use aluminum, aluminum alloy, copper, ceramics and other materials or fillers Production. However, with the expansion and popularization of the application range of electronic and electrical equipment, the performance and structure requirements of electronic and electrical equipment are becoming more and more stringent and complex, including higher processi...

Claims

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Application Information

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IPC IPC(8): H05K7/20B32B7/10
Inventor 申富强
Owner SHANGHAI QI JIE CARBON MATERIALS
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