Hollow foam material as well as preparation method and application thereof

A foam material and hollow technology, applied in the field of foam materials, can solve the problems of materials such as low temperature resistance, no oxidation resistance, poor mechanical properties, etc.

Active Publication Date: 2018-05-25
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide a structural design of a hollow foam material and its preparation method and application, so as to solve the problems of

Method used

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  • Hollow foam material as well as preparation method and application thereof
  • Hollow foam material as well as preparation method and application thereof
  • Hollow foam material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0061] The preparation process of this embodiment is the preparation process of the hollow foam silicon carbide material with the microchannel wall of the porous structure:

[0062] (1) Preparation of thickening slurry: mix polyvinyl alcohol powder, epoxy resin, curing agent, and ethanol through ball milling to make thickening slurry, and mix polyvinyl alcohol, epoxy resin, curing agent, and ethanol The ratio is 50-500g: more than 0-500g: 10-100g: 1000mL (that is, for every 1000mL solvent in the slurry, there are 50-500g polyvinyl alcohol powder, more than 0-500g epoxy resin and 10-100g epoxy resin corresponding curing agent).

[0063] (2) Preparation of microchannel tube wall green body layer slurry: silicon carbide powder (average particle size 5 μm), silicon powder (average particle size 3.5 μm), phenolic resin, p-toluenesulfonic acid (curing agent), ethanol According to the ratio of 50-500g: 50-500g: 50-200g: (greater than 0 to 0.2) times the mass of phenolic resin: 1000m...

Embodiment 2

[0070]The preparation process of this embodiment is the preparation process of a hollow silicon carbide foam material with a microchannel wall of a dense structure: the difference between this embodiment and Example 1 is that the molding process described in step (6) is: the molding precursor The body is placed in a vacuum sintering furnace, and silicon powder particles with an average particle size of 3mm are evenly placed on the shaped precursor sample. Under vacuum conditions, the temperature is 900-2500°C, and the holding time is 10min-6h. In the obtained hollow foam material, the average size of the macroscopic three-dimensional interconnected openings is 0.5 mm. The supporting frame itself is a three-dimensionally connected microchannel with a hollow structure, the average size of the inner diameter of the hollow microchannel is 250 μm, and the average size of the outer diameter is 550 μm. The wall of the microchannel is a dense structure, and its chemical composition m...

Embodiment 3

[0072] The preparation process of this example is the preparation process of a hollow foamed alumina material with a microchannel wall of a porous structure: the difference between this example and Example 1 is that the epoxy resin in step (1) is replaced by polyurethane. In step (2), the slurry of the microchannel tube wall green body layer is composed of: alumina powder (average particle size 5 μm), phenolic resin, p-toluenesulfonic acid (curing agent), and ethanol in proportions of 50 to 500 g: 50 to 200g: (greater than 0 to 0.2) times the mass of phenolic resin: 1000mL. The polyurethane resin foam whose average pore diameter is 3 mm in step (3) is replaced with the polyurethane resin foam material whose average mesh size is 5 mm. In step (3), the thickness of the skeleton ribs supporting the skeleton reaches a pre-designed value of 600 μm. In the obtained hollow foam material, the average size of the macroscopic three-dimensional interconnected openings is 4mm. The suppo...

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Abstract

The invention relates to the field of porous materials, in particular to a hollow foam material as well as a preparation method and an application thereof. The hollow foam material is formed by three-dimensional connective support framework networks from the macroscopic angle, the support frameworks are microchannels with hollow structures in three-dimensional connection, the walls of the microchannels are compact or contain nano-scale pores and/or micro-scale pores. The hollow foam material with three-dimensional connective networks is prepared from a polymer resin foam material with three-dimensional connective networks with the structure design and the preparation method. The hollow foam material has three types of pores with adjustable sizes: macroscopic three-dimensional connective open meshes, three-dimensional connective hollow microchannels and nano-scale pores and/or micro-scale pores in microchannel wall bodies. The innovative structure characteristic of the three-dimensionalconnective hollow microchannels of the hollow foam material lays a foundation for application of the hollow foam material.

Description

technical field [0001] The invention relates to the field of foam materials, in particular to a three-dimensional interconnected hollow foam material and its preparation method and application. Background technique [0002] Foam material is a special kind of porous material. Its geometric structure is characterized by a polygonal closed ring as the basic unit, and a three-dimensional interconnected network formed by the interconnection of each basic unit. The material of this kind of structure has many advantages such as light weight, adjustable porosity, high permeability, etc., and the mass transfer, momentum transfer, and heat transfer efficiency of the fluid in its three-dimensionally connected mesh can be effectively improved. Therefore, in the field of chemical process intensification, the preparation and application of foam materials are gradually receiving extensive attention. [0003] However, the traditional foam material obtained by the preparation method based o...

Claims

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Application Information

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IPC IPC(8): C04B38/06C04B35/565C04B35/10C04B35/64C04B26/14C04B26/12C08L23/06C08L75/04
CPCC04B26/122C04B26/14C04B35/10C04B35/565C04B35/64C04B38/0615C04B2111/00482C04B2235/428C04B2235/6562C04B2235/6567C04B2235/658C04B2235/6581C04B2235/96C04B2235/9669C08L23/06C08L2203/14C08L2205/025C08L2205/03C04B38/0054C04B38/0074C04B24/2623C04B2103/0068C04B24/02C04B14/324C04B22/02C04B24/20C08L75/04C04B26/12C04B38/00C04B38/06C04B38/08C04B38/10
Inventor 张劲松高勇田冲杨振明杨晓丹矫义来
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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