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637 results about "Vacuum pressure" patented technology

Vacuum pressure is measured relative to ambient atmospheric pressure. It is referred to as pounds per square inch (vacuum) or PSIV. The electrical output of a vacuum pressure transducer is 0 VDC at 0 PSIV (14.7 PSIA) and full scale output (typically 5 VDC) at full scale vacuum, 14.7 (0 PSIA).

Low-vacuum circulating water heating dynamic load matching method based on AI regulation and control

The invention discloses a low-vacuum circulating water heating dynamic load matching method based on AI regulation and control, and the method comprises the following steps: step S100, multi-source data real-time collection: building thermal environment parameters are synchronously collected through a temperature sensor array, a vacuum pressure transmitter, a flowmeter and an environment monitoring unit which are deployed in a distributed manner; according to the method, the control period is compressed to the minute level, compared with traditional PID control, the response speed is increased by several times, the indoor temperature can be controlled more accurately, and meanwhile the failure rate of equipment is reduced. According to the sudden weather coping mechanism, heat supply strengthening can be started 30 minutes ahead of time under extreme weather such as snowstorm weather, and the stability of the system is ensured. The method is characterized in that the prediction advantage of deep learning and the optimization capability of model prediction control are deeply combined, and the control problem of multivariable strong coupling of the low vacuum system is solved through a verification system of multi-source data fusion and virtual-real combination.
Owner:华能吉林发电有限公司农安生物质发电厂

Component mounting quality detection method for chip mounter

The invention relates to the technical field of image data processing, and discloses an element mounting quality detection method for a chip mounter, which comprises the following steps of: synchronously acquiring images before and after element mounting and a vacuum pressure signal of a mounting suction nozzle, compensating vibration by utilizing an inherent substrate background area in the images, obtaining an optical position deviation through image difference and mass center calculation, and calculating the surface mounting quality of the element according to the optical position deviation. And finally, logically associating the deviation with the change characteristic of the pressure signal, and classifying the physical process of the mounting event. According to the invention, through the collaborative diagnosis of optical detection and physical signals, the physical reason of the mounting event can be clearly distinguished; the inherent limitation caused by vibration interference and unclear fault attribution during high-speed operation of a traditional detection mode is avoided, and the method has good adaptability to incoming material elements with different appearances.
Owner:ZHEJIANG HUAQI ZHENGBANG AUTOMATION TECH CO LTD

Bionic Al / SiC composite material with three-dimensional network multilevel structure and preparation method of bionic Al / SiC composite material

PendingCN121248321ACeramicwareFreeze-dryingFreeze-casting
The invention relates to a bionic Al / SiC composite material with a three-dimensional network multilevel structure and a preparation method of the bionic Al / SiC composite material, and belongs to the technical field of new material preparation. According to the method, through the collaborative process of freeze casting and organic foam impregnation, the problem that in the prior art, the multilevel aperture and the complex network structure are difficult to cooperatively regulate and control is solved. The preparation method comprises the following specific steps: preparing tert-butyl alcohol-based ceramic slurry, impregnating the slurry with polyurethane foam, performing freeze casting molding, removing a solvent through freeze drying, performing high-temperature sintering to form SiC ceramic with a three-dimensional reticular hierarchical pore structure, and finally preparing the Al / SiC composite material through a vacuum pressure infiltration process. Wherein a sintering aid is added into the slurry, so that the sintering temperature is obviously reduced; the specification (40-60 ppi) of polyurethane foam, the solid phase content (20-30 vol.%) of slurry, the freezing speed (0-90 DEG C) and the content (5-20 wt.%) of a sintering aid are regulated and controlled. And the cross-scale collaborative design of micron-scale directional holes and millimeter-scale mesh holes is realized. The Al / SiC composite material prepared by the invention has the advantages that the compressive strength, fracture toughness and other properties are obviously higher than those of the traditional single-aperture porous ceramic, and the Al / SiC composite material is suitable for the fields of manufacturing and energy absorption of precise instruments, electronic packaging and optical devices.
Owner:JILIN JIANZHU UNIVERSITY

Wafer bonding method

The invention discloses a wafer bonding method, which comprises the following steps of: 1, providing a first wafer and a second wafer, the surface of the first wafer being provided with a microstructure with a high aspect ratio; step 2, cleaning the first wafer and the second wafer; step 3, performing vacuum drying treatment on the first wafer and the second wafer, wherein the vacuum pressure is controlled to be 0.1-10 Torr in the vacuum drying treatment process; step 4, carrying out pre-bonding on the first wafer and the second wafer to form a bonding body; and step 5, carrying out annealing treatment on the bonding body. Aiming at the problem of residual water in the pre-cleaning process in the bonding process of the micro-structure wafer with a high aspect ratio, the wafer is placed in a controllable vacuum environment, phase change boiling of liquid water under the condition of no heat input is realized, and the problem of high-temperature heat damage caused by an existing heating and baking method is effectively avoided.
Owner:SHANGHAI IND U TECH RES INST

Hybrid vacuum electrostatic chuck carrier for high warpage wafers

A method of processing a substrate comprising: positioning the substrate on an upper surface of a substrate holder in a first chamber, wherein the substrate holder comprises one or more vacuum channels disposed at the upper surface and one or more electrodes disposed within the substrate holder proximate to the upper surface; while the substrate holder is within the first chamber, clamping and flattening the substrate to the substrate holder by applying a vacuum to the one or more vacuum channels; while the substrate is clamped to the substrate holder via the one or more vacuum channels, applying a voltage to the one or more electrodes to further clamp the substrate to the substrate holder with an electrostatic force; pumping out the first chamber to a vacuum pressure while continuing to clamp the substrate to the substrate holder with electrostatic force; while the substrate is clamped to the substrate holder by electrostatic force, transferring the substrate holder from the first chamber into a second chamber under vacuum conditions; and while the substrate holder is within the second chamber, maintaining the electrostatic force clamping the substrate to the substrate holder, and processing the substrate in the second chamber at a vacuum pressure.
Owner:APPL MATERIALS ISRAEL LTD

Vacuum pressure impregnation process optimization method, device, equipment, medium and product

The invention relates to the technical field of superconducting magnet manufacturing and insulation impregnation process optimization, and discloses a vacuum pressure impregnation process optimization method, device, equipment, medium and product, and the method comprises the steps: inputting a target porosity and a target permeability into an insulation layer homogenization fluid domain model to obtain a macroscopic homogeneous model; according to the macroscopic homogeneous model, a first corresponding relation between multiple technological parameters and the impregnation performance parameters under the boundary condition is determined through simulation, and the multiple technological parameters comprise at least two of the temperature, the glue injection parameter, the vacuum pressure, the resin viscosity and the resin curing kinetic parameter; and according to the plurality of first corresponding relations, optimizing the plurality of process parameters by taking the shortest filling time, the highest uniformity and the lowest residual bubble rate as optimization objectives to obtain an optimal process parameter combination of the vacuum pressure impregnation process. According to the method, the multiple process parameters are optimized, the multi-parameter optimization database can be established, and the optimal process combination scheme is obtained.
Owner:聚变新能(安徽)有限公司

Single-tower VPSA (Vacuum Pressure Swing Adsorption) skid-mounted oxygen production device applying magnetic suspension fan and fan pump

The invention relates to the technical field of oxygen production, in particular to a single-tower VPSA (vacuum pressure swing adsorption) skid-mounted oxygen production device applying a magnetic suspension fan and a fan pump, which comprises a first module and a second module, the first module comprises a magnetic suspension fan, an air cooler, an adsorption tower, an oxygen buffer tank I and a magnetic suspension fan pump; according to the invention, four storage cylinders for storing molecular sieves are arranged in the adsorption tower, and structures such as a locking mechanism, an upper electric telescopic cylinder and a lower electric telescopic cylinder are arranged, so that each storage cylinder can be automatically and independently taken out and poured out of the molecular sieves; and then a new molecular sieve is poured into the device, and the storage cylinder is sealed and installed back by the control equipment, so that the molecular sieve can be automatically replaced, a maintainer does not need to use a tool to disassemble a plurality of bolts and use a tool to replace the bolts, and the maintenance efficiency of the device is greatly improved.
Owner:SUZHOU DOER OXYGEN EQUIP CO LTD

Hybrid vacuum electrostatic chuck in vacuum chamber for high warpage wafers

A method of processing a substrate is disclosed that comprises: transferring the substrate into a processing chamber and positioning the substrate on an upper surface of a substrate holder in the processing chamber, wherein the substrate holder comprises one or more vacuum channels disposed at the upper surface and one or more electrodes disposed within the substrate holder proximate to the upper surface; while the substrate holder is within the processing chamber, clamping and flattening the substrate to the substrate holder by applying a vacuum to the one or more vacuum channels; while the substrate is clamped to the substrate holder via the one or more vacuum channels, applying a voltage to the one or more electrodes to further clamp the substrate to the substrate holder with an electrostatic force; pumping out the processing chamber to a vacuum pressure while continuing to clamp the substrate to the substrate with the electrostatic force; and while the substrate is clamped to the substrate holder by the electrostatic force, processing the substrate in the processing chamber under vacuum conditions.
Owner:APPL MATERIALS ISRAEL LTD

Multi-airflow alternating temperature calcining device for ultra-long nitride single crystal nanofibers

The invention relates to a multi-airflow alternating temperature calcining device for ultra-long nitride single crystal nanofibers. The multi-airflow alternating temperature calcining device comprises a reaction furnace; the mechanical vacuum pressure gauge and the exhaust port are arranged at the top of the reaction furnace; the reaction furnace chamber is arranged in the reaction furnace; the multi-reaction-zone graphite furnace body is arranged in the reaction furnace chamber and comprises a first low-temperature zone, a second high-temperature zone and a third low-temperature zone which are sequentially arranged from bottom to top and are not in contact with one another; the electromagnetic heating controller is arranged on the periphery of the multi-reaction-area graphite furnace body; the graphite boat is movably arranged in the multi-reaction-area graphite furnace body; the movable alumina crucible is arranged in the graphite boat; the graphite columns are arranged at the top and the bottom of the multi-reaction-zone graphite furnace body; the hydraulic cylinder is connected with the graphite column; and a control assembly. Compared with the prior art, the method has the advantages that the nitridation reaction process can be accurately controlled, the fiber quality and the crystal integrity can be improved, and independent and accurate temperature control can be realized.
Owner:DONGHUA UNIV

Method for machining pressure-resistant shell of unmanned underwater vehicle

The invention discloses a method for processing a pressure-resistant shell of an unmanned underwater vehicle, which relates to the technical field of underwater vehicles, and is technically characterized by comprising the following steps of: firstly, respectively forging a pipe material or a bar material, a cake material and a plate material by adopting titanium alloy, customizing raw materials, machining according to preset parameters, drilling, cleaning, and matching with radiographic inspection to complete processing of a shell, an end socket and a hoop; and the seal head also needs to be marked by laser. And in the assembling stage, an O-shaped sealing ring is arranged at the connecting part of the shell and the end socket for sealing, and a bulkhead of the cabin penetrating piece is fixed and assembled by using a hoop. Then, the vacuum degree change is monitored in a vacuum pressure maintaining mode to conduct air tightness detection, after qualification, a hydrostatic pressure test is adopted, step type pressure increasing is conducted according to preset pressure, the pressure is maintained to the specified time length, whether deformation and leakage occur or not is detected, finally, pressure-resistant shell machining is completed, the structural strength and sealing performance of the pressure-resistant shell are guaranteed, and the underwater use requirement is met.
Owner:HARBIN ENG UNIV

Hybrid vacuum electrostatic chuck in dedicated chamber for high warpage wafers

A method of processing a substrate in a processing chamber that includes a primary volume and an auxiliary volume that can be environmentally sealed from the primary volume, the method including: transferring the substrate into the primary volume of the processing chamber and onto an upper surface of a substrate holder while the primary volume is at a vacuum pressure, wherein the substrate holder comprises one or more vacuum channels disposed at the upper surface and one or more electrodes disposed within the substrate holder proximate to the upper surface; moving the substrate holder within the processing chamber such that the substrate is moved from the primary volume to the auxiliary volume; sealing the auxiliary volume from the primary volume and increasing the pressure within the auxiliary volume; while the substrate is within the auxiliary volume, clamping and flattening the substrate to the substrate holder by applying a vacuum to the one or more vacuum channels; while the substrate is within the auxiliary volume and clamped to the substrate holder via the one or more vacuum channels, applying a voltage to the one or more electrodes to further clamp the substrate to the substrate holder with an electrostatic force; and while the substrate is clamped to the substrate holder by the electrostatic force, moving the substrate from the auxiliary volume back into the primary volume and processing the substrate in the primary volume at a vacuum pressure.
Owner:APPL MATERIALS ISRAEL LTD

Multi-melting-machine collaborative vacuumizing control system and control method

The invention provides a multi-melting-machine collaborative vacuumizing control system and control method, and belongs to the technical field of quartz crucible manufacturing, the multi-melting-machine collaborative vacuumizing control system comprises a main controller, a main vacuumizing assembly, a plurality of branch vacuumizing assemblies and a plurality of melting machines; the main vacuumizing assembly is connected with the multiple branch vacuumizing assemblies through the vacuum main pipeline, and the multiple branch vacuumizing assemblies are connected with the multiple melting machines in a one-to-one correspondence mode through the melting machine connecting vacuum pipes. The main vacuumizing assembly comprises a vacuum pump, a first pneumatic valve, a first proportional electromagnetic valve, a vacuum tank and a vacuum main valve which are connected in sequence; the branch vacuumizing assembly comprises a vacuum proportion regulating valve, a buffer tank and a vacuumizing valve which are connected in sequence; a vacuum tank is arranged, and the vacuum pressure in the vacuum tank is kept constant by controlling a first pneumatic valve and a first proportional electromagnetic valve; the buffer tanks are arranged on the branches, and the vacuum pressure in the buffer tanks is controlled by the vacuum proportioning valves to be kept constant, so that a stable vacuum system is formed in the melting process of the quartz crucible.
Owner:ADVANCED QUARTZ MATERIAL (HANGZHOU) CO LTD

Screw vacuum pump self-adaptive energy-saving operation system based on multi-source information fusion

The invention discloses a screw vacuum pump self-adaptive energy-saving operation system based on multi-source information fusion, and relates to the field of screw vacuum pump operation systems, and the screw vacuum pump self-adaptive energy-saving operation system comprises a multi-source sensing unit, an edge intelligent processing unit, a self-adaptive decision engine, an actuator array and a cloud edge collaboration platform; according to the system, the multi-source sensing unit captures multi-dimensional information such as vacuum pressure, current harmonics, a temperature field and a mechanical state in real time, and by combining efficient feature extraction of the edge intelligent processing unit, the load recognition precision and the response speed are greatly improved; the self-adaptive decision engine accurately tracks the lowest energy consumption rotating speed point based on a dynamically updated Gaussian process regression model, and redundant energy consumption caused by feedback lag and load misjudgment in traditional control is thoroughly eliminated.
Owner:SHANDONG KAIEN VACUUM TECH CO LTD

Self-adaptive vacuum filling and sealing device and method

The invention discloses a self-adaptive vacuum filling and sealing device and method, and mainly solves the problems that the existing vacuum filling and sealing technology is difficult to realize accurate adaptation and optimal adjustment of multiple types of filling and sealing adhesives, and the filling and sealing consistency and the product reliability under complex working conditions are influenced. Comprising a vacuum box, a vacuum pump, a vacuum pressure digital display meter, a control panel and an air inlet valve, wherein a liquid flow meter is arranged at a glue injection and pouring outlet in the vacuum box, and instantaneous flow data of pouring sealant is detected and fed back in real time; a refrigerating device is arranged on the side wall to inhibit local temperature rise of the two-component pouring sealant caused by heat release of a chemical reaction; a heating device is arranged at the upper part to compensate the adverse effect of environment temperature reduction on the fluidity of the pouring sealant; and meanwhile, a fusion algorithm for self-adaptive adjustment of multiple types of pouring sealants is deployed in the microprocessor, so that self-adaptive temperature balance and regulation in the pouring process are realized. According to the invention, the automation degree and the response sensitivity of the potting process can be obviously improved, and the stability and the reliability of the potting process are improved.
Owner:XIDIAN UNIV

A modular vacuum pressure swing adsorption FPSO carbon dioxide capture method

This invention relates to the field of carbon dioxide capture technology, and more particularly to a modular vacuum pressure swing adsorption (FPSO) carbon dioxide capture method. The method provides a capture device comprising a pretreatment unit, an adsorption unit, a storage unit, and a control unit. A control model is set in the control unit, which outputs control rate, optimal adsorption parameters, optimal desorption parameters, and equalization cycle parameters, and feeds them back to the actuators of the control unit. The actuators then control the operation of the pretreatment unit, the adsorption unit, and the storage unit. The pretreatment unit cools, compresses, and dries the flue gas. The adsorption unit adsorbs and desorbs CO2 from the flue gas. The desorbed CO2 is stored in the storage unit. This invention improves the efficiency and safety of carbon dioxide capture.
Owner:中海油能源发展股份有限公司采油服务分公司 +1

Milling cutter blade packaging suction tool control method and system

The invention relates to the technical field of blade packaging suction tool control, and provides a milling cutter blade packaging suction tool control method and system.The method comprises the steps that the vacuum pressure establishing speed in a suction cup, fluctuation after the vacuum pressure is stabilized and response of the vacuum pressure to tentative movement of a mechanical arm are obtained and integrated, and suction state parameters are obtained; according to the adsorption state parameters, whether the adsorption state is in a critical unstable state or not is judged, and an adsorption state judgment result is obtained; starting a dynamic vacuum compensation mechanism when the adsorption state judgment result shows that the adsorption device is in a critical unstable state; through a dynamic vacuum compensation mechanism, in the blade carrying process of the mechanical arm, the adsorption force is enhanced by dynamically adjusting the power of a vacuum generator and / or applying auxiliary airflow. The milling cutter blade packaging device has the effect of improving the stability of milling cutter blade packaging operation.
Owner:ZHEJIANG WANJIAO TOOLS CO LTD

Modularized vacuum pressure swing adsorption FPSO carbon dioxide capture method

The invention relates to the technical field of carbon dioxide capture, in particular to a modular FPSO (vacuum pressure swing adsorption) carbon dioxide capture method, and provides a capture device which comprises a pretreatment unit, an adsorption unit, a storage unit and a control unit. Setting a control model in a control unit, outputting a control rate, an optimal adsorption parameter, an optimal analysis parameter and a voltage-sharing period parameter through the control model, and feeding back the control rate, the optimal adsorption parameter, the optimal analysis parameter and the voltage-sharing period parameter to an actuator of the control unit, so that the actuator controls a preprocessing unit, an adsorption unit and a storage unit to operate; flue gas is cooled, compressed and dried through the pretreatment unit, CO2 in the flue gas is adsorbed and desorbed through the adsorption unit, and CO2 desorbed by the adsorption unit is stored in the storage and collection unit. According to the invention, the capture efficiency and capture safety of carbon dioxide are improved.
Owner:中海油能源发展股份有限公司采油服务分公司 +1

Reusable superconducting coil vacuum pressure impregnation tool and method

The invention discloses a reusable superconducting coil vacuum pressure impregnation tool and method, and relates to the technical field of superconducting coil preparation tools. Comprising a dipping tool cylinder, an upper cover plate, a lower cover plate, a coil outer support, a superconducting coil and a coil inner support, the two ends of the dipping tool barrel are detachably connected with the upper cover plate and the lower cover plate respectively; a vacuum joint is arranged on the upper cover plate; a glue injection opening is formed in the side wall of the dipping tool barrel; the coil outer support is arranged on the inner side of the superconducting coil, the coil inner support is arranged on the outer side of the superconducting coil, the coil outer support, the superconducting coil and the coil inner support are arranged on the lower cover plate, and the space between the coil outer support and the inner wall of the dipping tool barrel is filled with epoxy blocks. The device can adapt to superconducting coils of different sizes only by increasing or decreasing the volume of the filling epoxy block, the dipping tool does not need to be destructively disassembled when the coils are taken out, and it is ensured that the temperature is uniform when the whole tool is heated and cured through heating oil in an interlayer of the dipping tool.
Owner:HEFEI INT CENT FOR APPLIED SUPERCONDUCTIVITY

Wafer vapor deposition device

The utility model discloses a wafer vapor deposition device which comprises a wafer box lifting device used for lifting a wafer box; the load locking chamber is arranged between the reaction chamber and the wafer box lifting device, and a wafer cache structure is arranged in the load locking chamber; the wafer cache structure is used for storing wafers; the reaction chambers are used for performing thin film deposition on the wafer; the wafer carrying manipulator is used for transferring wafers among the wafer box, the wafer cache structure and the reaction chamber; the wafer carrying manipulator comprises a wafer taking fork and a wafer taking fork driving part, and the wafer taking fork driving part can drive the wafer taking fork to rotate and do reciprocating rectilinear motion; the wafer taking fork receives the wafer in the wafer cache structure through the clamping groove; the wafer taking fork is provided with a vacuum suction cup, a vacuum air channel connected with the vacuum suction cup is arranged in the wafer taking fork, and wafers in the wafer box are adsorbed through the vacuum suction cup. On the premise that the overall size of equipment is not greatly increased, the opening and closing frequency of the load locking cavity is remarkably reduced, and frequent conversion between atmospheric pressure and vacuum pressure is avoided.
Owner:大连皓宇电子科技有限公司

Chip peeling apparatus and chip peeling method using the same

A chip peeling apparatus may include a peeling device. The peeling device may include a plurality of vacuum adsorption holes and a plurality of first air blow holes arranged around the plurality of vacuum adsorption holes. The peeling device may be configured to peel a chip off a tape when the peeling device is arranged below a region of the tape on which the chip is attached, vacuum pressure is applied through the plurality of vacuum adsorption holes to adsorb the peeling device to the region of the tape, and a first air blow is directed through the plurality of first air blow holes to the region of the tape.
Owner:SAMSUNG ELECTRONICS CO LTD

Room temperature vacuum pressure bonding device

The utility model relates to a room temperature vacuum pressure bonding device which comprises a vacuum cavity, the wall surface of the vacuum cavity is respectively provided with a first through hole and a second through hole, the first through hole is connected with a plasma generating assembly, the second through hole is connected with a vacuum generating assembly, and the vacuum generating assembly vacuumizes the interior of the vacuum cavity. Activating the wafer in the vacuum cavity through a plasma generation assembly; an air cylinder is fixed to the outer top wall face of the vacuum cavity, an output guide rod of the air cylinder extends into the vacuum cavity and is connected with the bonding pressing head, an operation table is fixed to the inner bottom wall face of the vacuum cavity, and an operation arm mechanism is installed in the vacuum cavity in a matched mode. By arranging the plasma generating assembly, the plasma beam can be emitted into the vacuum cavity, so that plasma bombardment activation is carried out on the wafer, the wafer can be bonded at the room temperature without heating the wafer, energy consumption is reduced, production time is greatly shortened, and production efficiency is effectively improved.
Owner:SUZHOU MEMSTOOLS SEMICON TECH CO LTD

Heating disc and semiconductor equipment

The invention relates to the technical field of semiconductor equipment, in particular to a heating disc and semiconductor equipment. In order to achieve the purpose, the invention provides the heating plate which comprises a plate body and a plate handle, a plurality of circles of concentric adsorption grooves and a plurality of radial adsorption grooves are formed in the disc body, and the multiple circles of concentric adsorption grooves are communicated through the radial adsorption grooves; a main air exhaust pipeline is arranged in the plate handle, and the main air exhaust pipeline is communicated with the radial adsorption groove; wherein the diameter of the outermost concentric adsorption groove is configured to enable the vacuum adsorption force generated by the heating disc to be greater than or equal to the minimum adsorption force required for flattening the wafer in the preset warping state. According to the method, the diameter of the outermost concentric adsorption groove is determined based on the thin plate bending theory and the vacuum pressure difference principle, stable adsorption and rapid flattening of the high-warpage wafer are achieved, the film deposition uniformity is remarkably improved, the process defect rate is reduced, and the wafer production yield is improved.
Owner:PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO LTD

Vacuum pressure impregnation system suitable for insulating part of high-voltage electrical equipment

The invention relates to the technical field of vacuum pressure impregnation, in particular to a vacuum pressure impregnation system suitable for an insulating part of high-voltage electrical equipment, comprising: an impregnation module which comprises an impregnation tank and a liquid level measurement unit and is used for performing impregnation treatment on the insulating part; the vacuum module is connected with the impregnating tank and comprises a vacuum pump and a vacuum degree monitoring unit; the pressurizing module is connected with the impregnating tank and comprises a pressurizing unit and a pressure monitoring unit; the curing module is connected with the impregnating tank and is used for carrying out paint draining and drying treatment on the impregnated insulating part; the detection module is connected with the curing module and comprises an image recognition unit and a performance detection unit; and the control module is used for carrying out secondary judgment on the impregnation qualification according to the impregnation integrity and uniformity evaluation value of the paint film under the condition that the impregnation qualification is judged according to the surface defect characterization value of the cured insulating part. According to the invention, the impregnation quality and efficiency of the insulating part are improved.
Owner:ZHANGJIAGANG SHUANGCHENG ELECTRICIAN EQUIP CO LTD

Vacuum-vertical shaft-electroosmosis combined dehydration test device for waste mud

The invention discloses a vacuum-vertical shaft-electroosmosis combined dehydration test device for waste mud, and belongs to the technical field of geotechnical tests. The device is composed of a modular model cylinder, a direct-current power supply system, a measuring system, a vacuum pump and a vertical vacuum drainage body. The model cylinder is formed by connecting a top cylinder, a middle cylinder and a bottom cylinder through bolts and stacking sealing rings, the height can be flexibly adjusted, and good air tightness is kept. And the cylinder side is provided with a standard quick-plug interface, so that a vacuum meter and a pore pressure sensor can be conveniently connected. An anode electrode plate and a cathode electrode plate which are connected with a direct-current power supply are respectively arranged on the top surface and the bottom surface of the slurry, and the vertical vacuum drainage body penetrates through the bottom horizontal drainage layer and is fixed on the positioning frame to form a vacuum-vertical shaft combined drainage channel. The device effectively overcomes the problems of vacuum pressure transmission attenuation, overlong drainage path, non-uniform electroosmosis dehydration and the like through the coupling effect of vacuum, the vertical shaft and electroosmosis, can realize accurate research on different depth dehydration mechanisms of slurry, and has the advantages of rapid dehydration, simplicity and convenience in operation, environmental protection and high efficiency.
Owner:ZHENGZHOU UNIV

Complexly curved glass articles and methods of forming the same

Complexly-curved glass articles and methods of forming the same are described herein. The glass articles described herein may be reformed via application of vacuum pressure thereto. The glass articles may comprise a first glass layer comprising a first non-developable curved shape defined by a first curved surface and a second curved surface. At least one of the first curved surface and the second curved surface comprises a surface area of 60.000 mm2 or more. A thickness of the glass articles may comprise a uniformity of + / −75 microns per 1000 mm2 of surface area. The non-developable curved shape may comprise a maximum compressive strain shape parameter, as measured between an imaginary central surface disposed between the first curved surface and the second curved surface and an imaginary surface, of greater than or equal to 3.0%.
Owner:CORNING INC

Cyclic suction system for generating cyclic suction pressure waveform using vacuum pump and positive pressure pulse generator mechanism

The cyclical suction system generates an intermittent cyclically spaced cyclical suction pressure waveform of a vacuum pressure below atmospheric pressure and a positive pressure above the vacuum pressure. The system includes a flexible inlet tubing connected in fluid communication between a vacuum pump and a suction conduit. A positive pressure pulse generator mechanism intermittently cyclically applies an external force that compresses the segments of the flexible inlet tubing, thereby reducing the internal volume and displacing fluid that can be collected therein, thereby generating positive pressure pulses. Upon withdrawal of the applied external force, the flexible inlet tubing is configured to be able to be forced to return to an uncompressed state, thereby increasing the internal volume while reducing pressure therein until the vacuum pressure ultimately regenerates, thereby minimizing return time and maximizing cycle frequency.
Owner:NEURAVI

Vacuum pressure sensor

To provide a method for manufacturing a vacuum pressure sensor, a device including the vacuum pressure sensor, and / or a system including the vacuum pressure sensor.SOLUTION: The vacuum pressure sensor can comprise a weld ring and a header element welded to the weld ring. The header element may comprise one or more header pins hermetically sealed to the header element, a piezoresistive sensing element coupled to the header element and electrically coupled to the one or more header pins, a corrugated diaphragm coupled to the header element and the weld ring, the corrugated diaphragm defining, with the header element, a cavity configured to contain a material, and a plastic spacer disposed within the cavity. The vacuum pressure sensor may comprise a protruding sharp edge or a substantially flat edge without corner breaks of at least a portion of the header element in physical contact with the metal plate.SELECTED DRAWING: Figure 1
Owner:HONEYWELL INTERNATIONAL INC

Assembling device for vacuum pressure immersion mold

The invention discloses an assembling device for a vacuum pressure immersion mold, and relates to the technical field of assembling devices.The immersion mold comprises a plurality of mold units, and the multiple mold units are assembled in a matched mode to define a mounting cavity used for mounting a magnet coil; any two adjacent mold units which are assembled in a matched mode are connected in a welded mode through the assembly flanges of the two mold units, the multiple supporting mechanisms are used for supporting the corresponding mold units correspondingly, the two supporting tables are arranged in the height direction of the supporting mechanisms in a spaced mode, and the two supporting plates are assembled between the two supporting tables. The two supporting plates are opposite and spaced in the first direction, so that the two supporting tables and the two supporting plates jointly define a mounting space allowing the corresponding mold units to penetrate through, and the positions, relative to the supporting tables, of the two supporting plates are adjustable in the first direction. Therefore, the structural strength of the immersion mold can be improved, the welding quality and precision of the mold unit are improved, and the welding deformation risk and failure risk of the immersion mold are effectively reduced.
Owner:聚变新能(安徽)有限公司

Multi-stage vacuum generator

The invention relates to a multi-stage vacuum generator applied to the field of vacuum generators, in the multi-stage vacuum generator, through the arrangement of a plurality of reducing vacuum shafts, traditional first-stage vacuum is improved into multi-stage vacuum, the Laval structure in a traditional vacuum generator is changed, the air inlet flow is reduced, and the air inlet efficiency is improved. Meanwhile, the vacuum degree and the vacuum flow are greatly improved, so that when the vacuum generator is used for carrying and moving materials, the stability is greatly improved, the probability that the materials fall off is reduced, meanwhile, through the arrangement of a plurality of sealing plugs and negative pressure holes, the vacuum pressure can be adjusted according to actual needs, and the adaptability is higher; in addition, in cooperation with the arrangement of a disassembly-free cleaning rope, the interior can be cleaned under the condition that only the outer sleeve is disassembled, and compared with the mode that the outer sleeve is completely disassembled for cleaning in the prior art, the situation that recombination is difficult after disassembly is effectively avoided, and then the utilization rate of the vacuum generator is effectively guaranteed.
Owner:QINHUANGDAO OKEN TECH CO LTD