75 results about "Surface resistivity" patented technology

A static dissipative single use glove having a vertical resistivity of less than about 108 Ohm when determined according to EN 1149-2 and surface resistivity of less than or equal to about 106 Ohm when determined according to EN 1149-1, which includes a polymeric layer comprising conductive filler particles. A method to produce the single use glove is also disclosed.

The present application belongs to the field of advanced coating and preparation, and particularly relates to a high-transparent and scratch-resistant multifunctional antistatic coating and a preparation method thereof. The present application provides a high-transparent and scratch-resistant antistatic coating, raw materials of the antistatic coating comprising fluorion-containing silsesquioxane monomer, functional monomer and catalyst; wherein the functional monomer is a crosslinking agent or an anti-crystallization agent. The coating obtained by the present application has a light transmittance of >98% (550 nm); a surface pencil hardness of greater than 9H, no scratches after more than 1000 times of steel wool rubbing; a surface resistivity of about 10 8 ~10 9 Ω / sq, and a fast electrostatic discharge rate.

The invention belongs to the technical field of functional coatings, and particularly relates to a static conductive coating for nonmetal and a preparation method of the static conductive coating. The coating is composed of modified Si-C fluorosilicone resin, conductive nickel powder, ethandiamide and multiple auxiliaries, the modified Si-C fluorosilicone resin is prepared through a double-grafting reaction of mercaptoethanol and vinyl trifluoroacrylate,-S-and-CF groups are introduced into molecules at the same time, and the polarity of the resin and the dispersity of the conductive nickel powder are remarkably improved. The oxadiamide as a polar small molecule synergist can promote the formation of a conductive network and enhance the interface bonding force. The surface resistivity of the obtained coating is about 2.8 * 10 omega / square, the static decay time is 0.38 s, the adhesive force reaches 5B, and the conductivity retention rate after wear resistance exceeds 97%. The coating has excellent static conductivity, adhesive force and environmental stability, is suitable for the surfaces of non-metal base materials such as ABS, PVC and polycarbonate, and can be widely applied to the fields of electronic equipment shells, rail transit interior trim parts, anti-explosion and anti-static terraces and the like.

A negative-electrode plate, a preparation method thereof, and a secondary battery, a battery module, a battery pack, and an electric apparatus including such negative-electrode plate are provided. The negative-electrode plate includes an alkali metal layer and a polymer film layer provided on at least one surface of the alkali metal layer. Surface resistivity of the polymer film layer gradually increases in a thickness direction of the polymer film layer away from the alkali metal layer. When the negative-electrode plate is used in a secondary battery, lithium dendrites can be effectively inhibited.

A curable ink stack includes an insulating ink layer, a conductive ink layer disposed on at least a portion of the insulating ink layer, and a cover ink layer disposed on the conductive ink layer. The insulating ink layer includes a first surface resistivity and the conductive ink layer includes a second surface resistivity. The second surface resistivity is less than the first surface resistivity. The cover ink layer includes epoxy-based ink. When the curable ink stack is disposed and cured on the glass substrate to form a cured ink stack, the cured ink stack exhibits a total surface resistivity greater than or equal to 1.00 * 108 Omega.

The utility model discloses a stretching electrostatic eliminating device for transparent nylon film production. The stretching electrostatic eliminating device comprises a processing box, a high-voltage generator and a side plate, empty grooves are formed in the side edges of the machining box correspondingly, a positioning frame is arranged on one side of the bottom in the machining box, and a heating pipe is arranged at the top of the positioning frame. The high-pressure generator is arranged in the processing box; a heat treatment mechanism composed of the hot-air blower, the hot-air cavity and the hot-air nozzle is combined with the ionic wind bar to perform double static electricity removal treatment on the film, heat treatment increases dispersion of conductive particles through hot-air filling gaps to reduce surface resistivity, ionic wind generated by the ionic wind bar neutralizes static electricity, and the static electricity removal effect is improved through the synergistic effect of the heat treatment mechanism and the ionic wind bar. Static electricity on the surface of the thin film can be removed more thoroughly; through the matching design of the threaded rods in threaded connection with the side plates, the concave frames and the limiting rollers, the conveying path of the thin film is accurately controlled, the stability of the thin film in the machining process is guaranteed, and the situation that the static eliminating effect and the thin film quality are affected due to thin film deviation or wrinkles is avoided.

The application provides an insulation material resistivity testing device and method, the device comprises a shielding shell provided with a shielding test cavity, an insulation material sample is arranged in the shielding test cavity, and the device further comprises a radiation module, a high-temperature module, a radiation collimation device, a PC module and a pressure and current monitoring device; the pressure and current monitoring device is connected with the insulation material sample; the PC module is connected with the radiation module, the high-temperature module and the pressure and current monitoring device; the high-temperature module is further connected with the pressure and current monitoring device; the radiation module is used for providing a radiation beam for the inside of the shielding test cavity; the high-temperature module is used for providing a high-temperature environment for the inside of the shielding test cavity; the pressure and current monitoring device is used for applying a voltage to the insulation material sample and monitoring the current flowing through the insulation material sample; and the PC module determines the surface resistivity or volume resistivity of the insulation material sample according to the received voltage and current. The device can complete the resistivity testing of the insulation material under different radiation intensities and different temperature environments.

Provided is an electromagnetic wave shielding film from which static electricity that has accumulated during production or transfer can be easily dissipated. An electromagnetic wave shielding film of the present invention includes a protective layer disposed outermost and a shielding layer stacked inward from the protective layer, wherein the protective layer has a surface resistivity of 1.0×105 to 2.0×1012Ω / □, and the protective layer contains a binder resin and carbon particles having an average particle size of 0.1 to 15 μm.

The objective is to provide a wafer processing tape that can be used across a wafer in semiconductor processing, which can suppress the adhesion of cutting debris generated during the dicing process due to static electricity, and can also suppress contamination of chips by antistatic agents during processes requiring heating, and a wafer processing method that can integrate multiple semiconductor processing processes by using this tape. [Solution] The device comprises a base layer, an adhesive layer, and an antistatic layer disposed between the base layer and the adhesive layer, wherein the ratio (R1 / R0) of the surface resistivity R1 of the adhesive layer after heating at 250°C for 5 minutes to the surface resistivity R0 of the adhesive layer before heating is 0.001 to 10 or less, and the surface resistivity R1 is 1.0 × 10 12 The following is a tape for wafer processing.

To provide an electromagnetic wave absorber that can improve electromagnetic wave absorption performance. [Solution] The electromagnetic wave absorber according to the present invention includes a plurality of sheets comprising glass fibers and a conductive carbon material, the plurality of sheets being laminated, the first sheet of the plurality of sheets being provided on the incident surface side to which electromagnetic waves are incident, and the surface resistivity of the first sheet is higher than that of the second sheet.

The application relates to the technical field of composite materials, in particular to a surface electrically continuous composite material and a preparation method thereof. The preparation method of the surface electrically continuous composite material comprises the following steps: preparing conductive resin by using a resin matrix and conductive fillers, and preparing conductive adhesive film by using a film machine; placing the conductive adhesive film on the upper side of conductive fabric, and obtaining electrically continuous conductive prepreg by hot pressing or a prepreg machine; and compounding single-layer conductive prepreg and multi-layer structure prepreg through a co-curing process to form an integrated surface electrically continuous composite material. The application can obtain a novel "structure-function integrated" composite material which has excellent electrical continuity, can be co-cured with a main load-bearing structure, and can withstand severe service environments. The surface of the material has high electrical continuity after curing, and the surface resistivity is less than 200 m omega / sq. The preparation method can ensure the formation and stability of the conductive network in the curing process.

This utility model discloses a surface resistivity testing device for antistatic masterbatch production, relating to the field of antistatic masterbatch production technology. It includes a workbench with a base fixedly connected to its bottom and a heating plate fixedly installed on its top. Multiple support rods are fixedly connected to the top of the workbench, and a common top plate is fixedly connected to the top of the support rods. A hydraulic cylinder is fixedly connected to the top of the top plate, and a pressure plate is fixedly connected to the piston end of the hydraulic cylinder. Two connecting holes are opened on the top of the pressure plate, and movable rods are inserted into the inner walls of the connecting holes. A mounting groove is opened at the bottom of the movable rod, and a guide rod is fixedly connected to the top inner wall of the mounting groove. A probe is installed at the bottom end of the guide rod. This utility model is simple to operate and avoids dust adhesion during the handling of antistatic masterbatch flakes, which can affect the test results.

The utility model discloses an anti-static door handle, and relates to the technical field of electric door handles, the anti-static door handle comprises a handle main body, one end of the handle main body is provided with a mounting groove, one side of the interior of the mounting groove is provided with a thread groove, and the interior of the mounting groove is slidably provided with a mounting block; the outer surface of the mounting block is attached to the inner surface of the mounting groove, a through hole is formed in one end of the mounting block, a positioning mechanism is arranged at the bottom of the handle body, the handle body is sleeved with an anti-static mechanism, and a mounting mechanism is mounted in the through hole. The anti-static sleeve can be conveniently arranged outside the handle body in a sleeved mode, when the anti-static sleeve is damaged, disassembly and replacement are convenient, practicability is improved, the anti-static silica gel has the excellent anti-static function, the anti-static silica gel is also called semiconductor silica gel, the surface resistivity of the anti-static silica gel is large, and it means that the anti-static silica gel cannot accumulate static electricity, and the static electricity can be eliminated instantly.

The invention belongs to the technical field of photovoltaic modules, and particularly relates to a black lead-free environment-friendly bus bar and a coating method thereof, the black lead-free environment-friendly bus bar comprises a copper-based bar body, a lead-free conductive transition layer and a black lead-free functional coating, and the copper-based bar body, the lead-free conductive transition layer and the black lead-free functional coating are distributed from inside to outside; the copper-based belt body is a high-purity copper belt; the lead-free conductive transition layer is a tin-bismuth-silver alloy coating; the thickness of the black lead-free functional coating is 5-12 microns, and the surface resistivity is smaller than or equal to 0.05 ohm. The thickness of the copper-based strip body is 0.12-0.20 mm, and the elongation is larger than or equal to 22%. The problem of heavy metal pollution caused by lead-containing components in the bus bar can be completely eradicated, and meanwhile the current transmission efficiency of the bus bar is improved.

A transparent antenna includes a transparent substrate; and a metal thin wire layer on an upper side of the transparent substrate. The transparent substrate has a thickness of 300 μm or less. The metal thin wire layer has an opening ratio of 80% or more. When a metal conductor having a surface resistivity ρΩ / sq is placed parallel to the transparent antenna 0.15 mm apart, an input reflection coefficient S11(ρ, f) and a radiation efficiency Eff(ρ, f) at a frequency f satisfy relationsS11(0.1Ω / sq,f1 GHz)<−3 dB,S11(0.1Ω / sq,f2 GHz)<−3 dB, and|Eff(0.1Ω / sq,f1 GHz)−Eff(0.1Ω / sq,f2 GHz)|<25%at two frequencies f1 and f2 that are between 2 GHz and 50 GHz.

The invention discloses a polytetrafluoroethylene static conductive sealing ring which comprises the following components in parts by mass: 60-80 parts of polytetrafluoroethylene resin; 10 to 20 parts of nano boron carbide-graphene composite conductive filler; 3 to 8 parts of silane coupling agent modified glass fiber; 3-8 parts of nano nickel-coated silicon carbide composite powder; 2 to 6 parts of a graphene-carbon nanotube composite conductive agent; 1-4 parts of a polythiophene derivative; 0.5 to 2 parts of a coupling agent; 1-3 parts of a molybdenum disulfide lubricant; the static electricity conducting sealing ring has excellent static electricity conducting performance, the nanometer boron carbide-graphene composite conductive filler is introduced, so that the sealing ring has low surface resistance and volume resistance, static electricity can be effectively removed, and safety accidents caused by static electricity accumulation are avoided; meanwhile, the nano nickel-coated silicon carbide composite powder, the graphene-carbon nanotube composite conductive agent and the polythiophene derivative cooperate to construct an efficient conductive path, so that the surface resistivity of the sealing ring is low, static electricity can be quickly released, and a high-requirement static electricity control environment is met.

Provided are a fire-resistant insulating sheet which can maintain shape retention properties at high temperatures, and a method for manufacturing same. The fire-resistant insulating sheet comprises a single layer having fire resistance and insulating properties and is a paper sheet containing inorganic fibers, organic fibers and inorganic particles. The average thickness is 0.60 mm or less, the basis weight is 100 g / m2 to 400 g / m2, the surface resistivity at room temperature is 4.0×109 Ω / □or more at 1000 V, the surface resistivity after heating to 1300°C is 4.0×109 Ω / □or more at an applied voltage of 1000 V.

Provided is a measurement method that is performed by a measurement device, wherein the measurement device performs: a first step (S2) for deriving surface resistivities of a composite material including a material with a high resistance value and a material with a low resistance value at a respective plurality of surface positions; and a second step (S6) for calculating a representative value of the surface resistivities of the composite material using a plurality of surface resistivities derived until the convergence of a surface resistivity-related value.

The invention discloses a multi-surface detection anti-vibration method applied to a semiconductor substrate slice. According to the technical scheme, the multi-surface detection anti-vibration method is characterized by comprising the following steps of S1, low-substrate leakage current detection; s2, surface resistivity detection; s3, parasitic capacitance detection; s4, noise isolation detection; s5, multi-surface anti-vibration testing is carried out; s6, multi-surface anti-vibration analysis is carried out; according to the invention, the defect that only a testing machine is adopted for testing the semiconductor substrate is overcome, and the vibration resistance of the semiconductor is influenced by other performances, so that low-substrate leakage current detection, surface resistivity detection, parasitic capacitance detection and noise isolation detection are carried out on the semiconductor substrate in the scheme; and the anti-vibration performance is comprehensively calculated and analyzed, so that the test result is relatively accurate.

The utility model relates to the technical field of wire harnesses, in particular to an anti-electromagnetic interference shielding wire harness, which comprises an outer sheath and a plurality of strands of conductive core wires, the plurality of strands of conductive core wires are arranged inside the outer sheath, protective layers are coated outside the conductive core wires, and insulating layers are arranged among the exteriors of the plurality of groups of protective layers. The multi-layer shielding structure is arranged outside the multi-strand conductive core wire, the multi-layer shielding structure is composed of an inner shielding layer, a middle shielding layer and an outer shielding layer, the inner shielding layer is formed by spirally winding a 0.05 mm copper foil belt, the middle shielding layer is a tinned copper wire woven mesh with the weaving density larger than or equal to 85%, the outer shielding layer is a nickel metallization conductive rubber layer with the surface resistivity smaller than or equal to 0.1 omega.cm, and the outer shielding layer is a nickel metallization conductive rubber layer with the surface resistivity smaller than or equal to 0.1 omega.cm. The stress buffer layer is arranged between the inner shielding layer and the insulating layer. The beneficial effects of the utility model lie in that the shielding effectiveness of the multi-layer shielding structure on 10kHz-10GHz electromagnetic interference is greater than or equal to 80dB, strict standards such as CISPR25Class5 and the like are satisfied, the three shielding layers are matched with the stress buffer layer, so that the crosstalk attenuation among multiple cables is greater than or equal to 60dB, and the multi-layer shielding structure is suitable for a high-density wiring scene.

A fixing apparatus includes a rotatable fixing member, a rotatable pressurizing member, a heating portion, and a circuit portion including a contact member and configured to remove electric charge from the fixing member, the contact member being in contact with the fixing member. A surface layer of the pressurizing member is electrically connected to the circuit portion via a surface layer of the fixing member. In a case where a surface resistivity of the surface layer of the pressurizing member is represented by X (Ω / □) and a surface resistivity of the surface layer of the fixing member is represented by Y (Ω / □), 4.0≤log X≤13.0, 5.0≤log Y≤14.0, log Y≥13.0−log X, and log Y≤23.0−log X are satisfied.

The application discloses a heterogeneous folding hexagonal boron nitride / defect-free graphene heat-conducting insulating interface material, and belongs to the technical field of thermal management materials. The material takes a defect-free graphene skeleton containing macroscopic folding and microscopic folding as a base, and a hexagonal boron nitride nano layer uniformly coats the surface of the skeleton and penetrates into a groove, thereby forming a continuous heterogeneous coating structure. The folding structure converts the high in-plane thermal conductivity of the graphene into a thickness direction heat conduction path, and the in-situ deposited hexagonal boron nitride reduces the interface thermal resistance and improves the insulation. The out-of-plane thermal conductivity of the material is up to 402 W / mK, and the surface resistivity is up to 0.1 MΩ / sq. The material can significantly reduce the working temperature of electronic devices, and is suitable for high-integration electronic, LED and other thermal management scenes.

The invention relates to an SOEC metal connector Mn-Co coating and a preparation method and application thereof, and belongs to the technical field of solid oxide electrolytic cells. According to the method, firstly, a matrix is pretreated, and the Mn-Co spinel coating is constructed on the surface of a metal connector in situ by adopting an in-situ preparation process combining step-by-step electroplating and subsequent heat treatment. The coating has good oxidation resistance and low surface specific resistance, and the high-temperature service life of the connector can be remarkably prolonged.

[Problem] The purpose of the present invention is to provide a layered structure that comprises a plating film and an intermediate film and exhibits good adhesion as well as good insulation characteristics, throwing power, etching resistance, wiring formability, and migration resistance or seed layer removability. [Solution] Provided is a layered structure having a plating film formed on a substrate and containing an intermediate film between the substrate and plating film. The intermediate film is made from a metal oxide having a surface resistivity according to JIS K 6911 of at least 1.0 × 1010 Ω / sq. The film thickness of the intermediate film is at least 40 nm.

This invention relates to the field of graphene material preparation technology, and particularly to a laser-induced graphene with high reflectivity and electromagnetic shielding performance based on a sandwich structure and its preparation method. The preparation method includes the following steps: placing polyimide paper on a vacuum adsorption stage; setting femtosecond laser parameters and defocus distance; designing the laser scanning path using computer-aided SCA software; generating laser-induced graphene on two opposite surfaces of the polyimide paper to obtain laser-induced graphene with a sandwich structure. By adjusting the femtosecond laser parameters and defocus distance, combined with SCA software that controls the laser scanning path, LIGs are prepared on both sides of the polyimide. The thickness of the LIGs on both sides is controlled so that the middle part of the polyimide is completely induced into graphene to act as a conductive layer, thereby improving the conductivity of the graphene. The remaining polyimide acts as a PI framework to prevent over-carbonization and sample fragility, ensuring the flexibility of the sample. The surface resistivity of the product is stably 4.5 Ω / sq, and the reflectivity is as high as 93%.

A conductive adhesive film including an adhesive layer located at an adherend side, and a base material layer, in which a surface resistivity at 140° C. of the conductive adhesive film at a side opposite to an adhesive layer side is from 1×107Ω / □ to 1×1012Ω / □.

This invention belongs to the field of functional oxide thin film material preparation technology. It discloses a lead magnesium niobate-lead titanate (PMN-PT) based strontium titanate (SrTiO3, abbreviated as STO) / lanthanum nickelate (LaNiO3, abbreviated as LNO) heterostructure and its preparation method. This invention solves the problems of low density and easy sputtering of traditional target materials by precisely controlling the target material preparation process, laying the foundation for high-quality thin film growth. The critical process window for LaNiO3 thin film growth (600 degrees Celsius, 1.7 joules per square centimeter, 27 Pascals) was determined, and the surface resistivity was reduced from >1kΩ to 500Ω, with an improvement in electrical performance of more than 50%. The SrTiO3 buffer layer effectively blocks Pb diffusion and improves interface quality. The process repeatability is excellent, with the standard deviation of resistance of multiple batches of samples <8%, meeting the requirements of industrial production.

The objective is to provide a conductive material for tires that can improve electrostatic properties. [Solution] A conductive member for tires comprising an insulating layer containing a thermoplastic resin or thermoplastic elastomer and a conductive layer bonded to the insulating layer, wherein when the conductive member for tires is applied to a non-pneumatic tire and the non-pneumatic tire is driven for 20,000 km on a durability drum tester, the conductive layer has a surface resistivity of 1 × 10⁻¹⁰ before and after driving. 10 It is a conductive material for tires with a impedance of Ω or less.

The invention relates to an adhesive tape for wafer processing and a wafer processing method. The purpose of the present invention is to provide an adhesive tape for wafer processing, which can suppress the adhesion of cutting chips generated in a dicing step by static electricity, can suppress the contamination of a chip by an antistatic agent in a step where heating is required, and can be used throughout semiconductor processing. And a wafer processing method capable of integrating a plurality of semiconductor processing steps by using the adhesive tape. The wafer processing tape includes: a base material layer; an adhesive layer; and an antistatic layer disposed between the base material layer and the adhesive layer, in which the ratio (R1 / R0) of the surface resistivity (R1) on the adhesive layer side after heating at 250 DEG C for 5 minutes to the surface resistivity (R0) on the adhesive layer side before heating is 0.001-10, and the surface resistivity (R1) is 1.0 * 1012 or less.