The invention provides a printed circuit board base plate and a preparation method thereof. The base plate comprises the components of bisphenol A benzoxazine, bisphenol A epoxy resin, silicon resin, p-aminophenol triglycidyl epoxy resin, N,N-dimethylformamide, alkali-free glass fiber cloth, triethylamine, silicic acid anhydride, phenol-formaldehyde resin, polyamide polyamine epichlorohydrin, methylbenzene, acetone, propyl gallate and copper foil. The preparation method comprises the following steps: heating to dissolve bisphenol A benzoxazine, N,N-dimethylformamide, triethylamine, methylbenzene, acetone and propyl gallate at first; then adding the other components except for the alkali-free glass fiber cloth and gold foil, and stirring to obtain a steeping glue solution; removing steeped alkali-free glass fiber cloth; and then baking to obtain a prepreg, superimposing the prepreg with the copper foil, and cooling in a press after heat and pressure preservation. The printed circuit board base plate provided by the invention has the advantages of good insulating property, heat resistance and caking property and low cost; moreover, the production process is relatively simple and is suitable for industrial production.