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2274 results about "Conductive coating" patented technology

Conductive Coatings. Conductive coatings are frequently used to shield sensitive electronic components from electromagnetic and radio frequency interference (EMI/RFI) from both the device itself and from surrounding interference.

Fluoropolymer binders for carbon nanotube-based transparent conductive coatings

This invention relates to flexible, transparent and conductive coatings and films formed using carbon nanotubes (CNT) and, in particular, single wall carbon nanotubes, with polymer binders. Preferably, coatings and films are formed from carbon nanotubes applied to transparent substrates forming one or multiple conductive layers at nanometer level of thickness. Polymer binders are applied to the CNT network coating having an open structure to provide protection through infiltration. This provides for enhancement of properties such as moisture resistance, thermal resistance, abrasion resistance and interfacial adhesion. Polymers may be thermoplastics or thermosets, or a combination thereof. Polymers may also be insulative or inherently electrical conductive, or any combination of both. Polymers may comprise single or multiple layers as a basecoat underneath a CNT coating, or a topcoat above a CNT coating, or combination of the basecoat and the topcoat forming a sandwich structure. A fluoropolymer containing binder, which is a solution of one fluoropolymer or a blend of fluoropolymers, which may be formulated with additives, is applied onto a carbon nanotube-based transparent conductive coating at nanometer level of thickness on a clear substrate such as PET and glass. The fluoropolymers or blend can be either semi-crystalline (with low level of crystallinity) or amorphous, preferably to be amorphous with low refraction index. Binder coating thickness can be adjusted by changing binder concentration, coating speed and/or other process conditions. This binder coating significantly improves optical transparency, and also maintain or increases conductivity of the CNT-based coating. With other benefits such as abrasion, thermal and moisture resistance, this binder coating and the resulting products is used for display and electronic applications.

General electronic paste based on graphene filler

The invention discloses general electronic paste based on graphene filler. The electronic paste contains graphene-containing conductive filler, an organic carrier, a solvent and an auxiliary agent. Because the graphene has good electronic conductivity and a unique two-dimensional laminar nano structure, the graphene forms a conductive network in the organic carrier more easily, and the electric conductivity of the electronic paste is improved by adding the graphene. Further, the conductive filler also contains a conductive material with relatively high electric conductivity, so that the electric conductivity of the electronic paste is further improved. Because the graphene and the conductive material are compounded to form the conductive filler, the electronic paste has good electric conductivity. The electronic paste can obtain a relatively wide electric conductivity range by changing the category of the conductive material mixed with the graphene and adjusting the relative proportion of the graphene to the conductive material of different category. The electric conductivity of the electronic paste is 1*10<-3>S / cm to 1*10<3>S / cm. The paste can be widely applied, and can be particularly used as a conductive coating or adhesive.

Printed wiring board having highly reliably via hole and process for forming via hole

Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900° C. and a bond energy of at least 300 kJ/mol on a copper foil as an outermost layer of a copper-clad laminate having at least two copper layers, or providing a coating or sheet of the same after oxidizing a copper foil as an outermost layer, irradiating the coating or sheet with a carbon dioxide gas laser at an output of 20 to 60 mJ/pulse, thereby removing a micro-via-hole-forming portion of at least the copper foil as the outermost layer, then irradiating micro-via-hole-forming portions of the remaining layers with a carbon dioxide gas laser at an output of 5 to 35 mJ/pulse to make a micro-via hole which does not penetrate through the copper foil in a bottom of the micro-via hole, and electrically connecting the copper foil as the outermost layer and the copper foil in the bottom of the micro-via hole with a metal plating or an electrically conductive coating composition.
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