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278 results about "Bond energy" patented technology

In chemistry, bond energy (E) or bond enthalpy (H) is the measure of bond strength in a chemical bond. IUPAC defines bond energy as the average value of the gas-phase bond dissociation energies (usually at a temperature of 298 K) for all bonds of the same type within the same chemical species. For example, the carbon–hydrogen bond energy in methane H(C–H) is the enthalpy change involved with breaking up one molecule of methane into a carbon atom and four hydrogen radicals, divided by 4. Tabulated bond energies are generally values of bond energies averaged over a number of selected typical chemical species containing that type of bond. Bond energy (E) or bond enthalpy (H) should not be confused with bond-dissociation energy. Bond energy is the average of all the bond-dissociation energies in a molecule, and will show a different value for a given bond than the bond-dissociation energy would. This is because the energy required to break a single bond in a specific molecule differs for each bond in that molecule. For example, methane has four C–H bonds and the bond-dissociation energies are 435 kJ/mol for D(CH₃–H), 444 kJ/mol for D(CH₂–H), 444 kJ/mol for D(CH–H) and 339 kJ/mol for D(C–H). Their average, and hence the bond energy, is 414 kJ/mol, even though not a single bond required specifically 414 kJ/mol to be broken.

Printed wiring board having highly reliably via hole and process for forming via hole

Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900° C. and a bond energy of at least 300 kJ/mol on a copper foil as an outermost layer of a copper-clad laminate having at least two copper layers, or providing a coating or sheet of the same after oxidizing a copper foil as an outermost layer, irradiating the coating or sheet with a carbon dioxide gas laser at an output of 20 to 60 mJ/pulse, thereby removing a micro-via-hole-forming portion of at least the copper foil as the outermost layer, then irradiating micro-via-hole-forming portions of the remaining layers with a carbon dioxide gas laser at an output of 5 to 35 mJ/pulse to make a micro-via hole which does not penetrate through the copper foil in a bottom of the micro-via hole, and electrically connecting the copper foil as the outermost layer and the copper foil in the bottom of the micro-via hole with a metal plating or an electrically conductive coating composition.
Owner:MITSUBISHI GAS CHEM CO INC

Forming method of metal gate, forming method of MOS transistor and forming method of CMOS structure

The invention discloses a forming method of a metal gate, a forming method of an MOS (metal oxide semiconductor) transistor and a forming method of a CMOS (complementary metal oxide semiconductor) structure. The forming method of the metal gate comprises the following steps: after removing a pseudo polycrystalline silicon gate and forming a groove, forming high-K gate medium layers at the bottom and on the side wall of the groove, fluoridizing the high-K gate medium layers, and forming a function layer and a metal layer on the surfaces of the high-K gate medium layers. As fluorine bonds such as fluorine-silicon bonds and fluorine-hafnium bonds can be formed among the high-K gate medium layers and a semiconductor substrate after fluoridization and the bond energy of the fluorine bonds is higher than that of original hydrogen bonds, the instability of the negative bias temperature of a device is reduced; as fluorine is strong in oxidability, oxygen vacancies can be prevented from generating donor level in a band gap and becoming positively charged oxygen vacancies, the oxygen vacancies are passivated, and the instability of the positive bias temperature of the device is reduced.
Owner:SEMICON MFG INT (SHANGHAI) CORP

Method for handling semiconductor layers in such a way as to thin same

This invention relates to a method for making a thin layer starting from a wafer comprising a front face with a given relief, and a back face, comprising steps consisting of: a) obtaining a support handle with a face acting as a bonding face;
    • [0001]
    • b) preparing the front face of the wafer, this preparation including incomplete planarisation of the front face of the wafer, to obtain a bonding energy E0 between a first value corresponding to the minimum bonding energy compatible with the later thinning step, and a second value corresponding to the maximum bonding energy compatible with the subsequent desolidarisation operation, the bonding energy E0 being such that E0=α.E, where E is the bonding energy that would be obtained if the front face of the wafer was completely planarised, α is the ratio between the incompletely planarised area of the front face of the wafer and the area of the front face of the wafer if it were completely planarised; c) solidarising the front face of the wafer on the bonding face of the support handle, by direct bonding; d) thinning the wafer starting from its back face until the thin layer is obtained; e) transferring the thin layer onto a usage support, involving separation from the support handle.
Owner:COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Manganese-based metal organic framework compound-coated lithium ion battery ternary positive electrode material and preparation method thereof

The invention discloses a manganese-based metal organic framework compound-coated lithium ion battery ternary positive electrode material. Based on the self-assembling performance of an MOFs material,coating of a spherical ternary positive electrode material is realized through a simple one-step method; the positive electrode material has a layered structure, is free of impurity phase, and structural changing of the material is not caused by coating; and the positive electrode material has a two-stage spherical-like structure formed by sheet-rod-like small particles in an clustering manner. The preparation method comprises the steps of 1) preparation of a precursor; 2) preparation of a spherical ternary positive electrode material; and 3) preparation of the manganese-based metal organic framework compound-coated ternary positive electrode material. According to the application as the battery positive electrode material, the discharge specific capacity is 160-180mAh g<-1> after 50 cycles of constant current charging and discharging at 0.5C; and the discharge specific capacity is 140-160mAh g<-1> at high rate of 10C. The positive electrode material has the advantages of providing porous channels, improving wetting degree, improving cycling stability and high-rate cycle performance, reinforcing stability of M-O bond energy, low cost, simple operation and suitability of large-scale production.
Owner:GUILIN UNIV OF ELECTRONIC TECH
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