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Flexible bonding copper wire and preparation method thereof

A flexible bond and copper wire technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as excessive copper wire, reduce impact force and damage, reduce bonding energy, and maintain stability.

Active Publication Date: 2010-01-13
烟台一诺电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a flexible bonding copper wire and its preparation method, solve the problem of excessive hardness of copper wire through multi-element alloys, and at the same time greatly improve its oxidation resistance, and make it truly applicable to integrated circuits, etc. In advanced packaging, to partially or completely replace the gold wire

Method used

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  • Flexible bonding copper wire and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Raw material ratio: Ce 0.001%, Pd 0.005%, Pt 0.005%, with Cu to 100%.

[0019] Preparation:

[0020] 1) Alloy: Select the alloy elements to be added, and use more than 99.999% high-purity copper to make pre-alloys and master alloys.

[0021] 2) Melting and casting: According to different models and customer requirements, 99.999% high-purity copper is added to various alloys, cast into round rods, and the crystal size can be obtained by adjusting the parameters such as the speed of drawing and casting, the temperature of heating and cooling Suitable, uniformly structured rods;

[0022] 3) Wire drawing: the gold rod is drawn into wires of different diameters through a wire drawing machine, and the appropriate processing deformation is selected to prevent recovery and recrystallization softening.

[0023] 4) Annealing: According to different requirements of customers, set different annealing parameters, eliminate stress, select recrystallization area, and obtain mechanic...

Embodiment 2

[0028] Raw material ratio: Ce 0.005%, Pd 0.003%, Pt 0.009%, with Cu to 100%.

[0029] Preparation method: with embodiment one.

Embodiment 3

[0031] Raw material ratio: Ce 0.003%, Pd 0.004%, Pt 0.007%, with Cu to 100%.

[0032] Preparation method: with embodiment one.

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Abstract

The invention relates to a flexible bonding copper wire and a preparation method thereof. The flexible bonding copper wire comprises the components: 0.001-0.005% of Ce, 0.003-0.005% of Pd, 0.005-0.009% of Pt and the rest of Cu. The invention adopts multielement doped alloy which is added with other components, so as to reduce the rigidity of copper, especially the balling rigidity, reduce the impact force and the damage for a chip, lower the bonding energy, prevent the generation of interfacial oxide and the crack, and ensure the combination performance to be stable, thus improving the combination performance, the electrical conductivity and the inoxidizability; by controlling the conditions of fusion casting, processing and hot treatment, the invention further optimizes the structure and guarantees the proper mechanical capacity, so as to meet different needs.

Description

(1) Technical field [0001] The invention relates to a bonding copper wire and a preparation method thereof. (two), background technology [0002] As a Product Family, Bonding Wires are one of the key materials for semiconductor packaging. Its function is to realize the electrical connection between the semiconductor chip and the pins, and to play the role of current import and export between the chip and the outside world. Bonding wires currently mainly include gold wires, aluminum wires and copper wires. Among them, aluminum wires are limited to low-end toy circuits, while gold wires occupy medium and high-end products, accounting for more than 80% of the total. The continuous rise in price is a new product developed to replace King Kong. Copper wire has the problems of easy oxidation and high hardness. Due to the improvement of bonding technology, the oxidation problem has basically been solved, but the core crack caused by excessive hardness is to some extent the main ca...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01L21/48C22C9/00C22C1/02B22D11/00C22F1/08C21D1/26
CPCH01L2224/45387H01L2224/45124H01L24/45H01L2924/01046H01L2924/01082H01L2924/01079H01L2924/01033H01L2924/01006H01L2924/01029H01L2924/01078H01L2224/45144H01L2924/01058H01L2924/01013H01L2224/45147H01L24/43H01L2224/43H01L2224/43848H01L2224/45H01L2224/45015H01L2924/00011H01L2924/00014H01L2924/14H01L2924/00015H01L2924/013H01L2924/00H01L2224/48H01L2924/00012H01L2924/01204H01L2924/01205
Inventor 林良
Owner 烟台一诺电子材料有限公司
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