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88 results about "Compound structure" patented technology

Compound structure identification database construction method, system, equipment and medium

The invention discloses a compound structure identification database construction method, system and device and a medium, and the method comprises the steps: inputting a model training data set into a plurality of retention time prediction models for training, and obtaining a plurality of trained retention time prediction models; verifying the plurality of trained retention time prediction models by adopting a model verification data set, and selecting an optimal retention time prediction model; inputting the migration training data set and the migration verification data set into the optimal retention time prediction model for migration learning to obtain a target retention time prediction model; inputting to-be-predicted compound structure data into the target retention time prediction model for prediction to obtain predicted retention time; and constructing a compound structure identification database according to the predicted retention time. The data in the compound structure identification database can be perfected, and the accuracy of the compound structure identification database is improved, so that the database performance is improved.
Owner:YANGTZE UNIVERSITY

Regenerated composite material multifunctional foam pad and production process thereof

The invention discloses a multifunctional foam pad made of a regenerated composite material and a production process of the multifunctional foam pad, and belongs to the technical field of production of regenerated composite materials. The surface of the recycled PET non-woven fabric printing layer is provided with 50 + / -5 [mu] m micropores, the cat palm bionic gradient foaming layer (the density is 0.15-0.35 g / cm < 3 > gradient distribution) is formed by blending and foaming PVC recycled materials, PET bottle chips and waste rubber powder, and the glass fiber net reinforced rubber matrix layer and the triangular pyramid micro-sucker bottom layer are arranged from top to bottom. The preparation process comprises the steps of waste material near-infrared sorting and pretreatment, multi-stage dynamic blending granulation, supercritical CO2 gradient foaming, bionic calendaring forming and laser positioning hot-pressing compounding, high-valued utilization of multi-element waste materials is achieved through combination of bionic structure design and a green process, the product has sound insulation, buffering and anti-skid performance, the tear resistance is improved by 150%, and the service life of the product is prolonged. The problems that a traditional foaming cushion depends on raw plastic, is single in function and causes manufacturing pollution are solved, and resource circulation and function strengthening unification are achieved.
Owner:DONGGUAN IUIU HOUSEHOLD PROD

Single-molecule device for detecting small-molecule gas based on supramolecules and preparation method of single-molecule device

The invention relates to the technical field of single-molecule devices, in particular to a single-molecule device for detecting small-molecule gas based on supramolecules and a preparation method of the single-molecule device. The monomolecular device comprises a functional molecule and a graphene electrode pair, wherein the functional molecule is connected between the graphene electrode pair through an amido bond. A cucurbituril hydrophobic cavity structure in the functional molecular structural formula can contain and capture target small molecular gas, gas molecules of different volumes are selectively included through multiple weak interaction, a dynamically-adjustable subject-object compound structure is formed, and then switching type sensing detection on the small molecular gas is achieved. The amino terminal of the end part of the main bridging unit in the functional molecule can be connected with the carboxyl terminal of the graphene point electrode in a covalent bond manner, and amide condensation molecular chain connection is formed at the two ends of the graphene point electrode, so that the stability of a monomolecular device is improved. The preparation method provided by the invention is simple in process, mild and controllable in reaction condition and beneficial to large-scale production.
Owner:NANKAI UNIV

Compound and organic electroluminescent device

The invention discloses a compound and an organic electroluminescent device. The compound has a structure as shown in a formula 1. On the basis of an existing carbazole-arylamine material, the structure of the compound is improved, deuteration is introduced to a special position matched with a core area, the optimized compound has good stability, meanwhile, the carrier mobility is further improved, the service life of a device is guaranteed, and compared with the closest prior art, the material has the advantages that the efficiency is high, and the cost is low. And the luminous efficiency of the device is improved. Meanwhile, compared with the existing perdeuterated carbazole-arylamine material, on the basis that the use effect of the material basically reaches the level of the prior art, the design scheme of introducing the deuterated carbazole-arylamine material has better economic benefit and use value. Formula 1.
Owner:NANJING TOPTO MATERIALS CO LTD

Fine dried noodles with low glycemic index and preparation method thereof

The invention discloses fine dried noodles with a low glycemic index and a preparation method of the fine dried noodles. The fine dried noodles are prepared from the following production raw materials: high-amylose corn starch subjected to alkaline hydrothermal modification and a composite structure base material, the composite structure base material is formed by compounding highland barley flour, vital gluten and wheat flour. The preparation method comprises the following steps: premixing the vital gluten and the wheat flour, and adding water for the first time to prepare a mixture 1; premixing modified starch and coarse cereal powder, and then adding water for the second time to prepare a mixture 2; and mixing the two mixtures, stirring, fermenting, rolling, cutting into strips, and drying. The invention has the following advantages: 1) through the synergistic effect of the high-amylose corn starch hydrothermally modified by the alkaline method and the composite structure base material with a specific ratio, the prepared fine dried noodles have significantly reduced glycemic index; the method has the advantages of low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index, low glycemic index and good glycemic index.
Owner:ZHEJIANG ACADEMY OF AGRICULTURE SCIENCES

Face mask

The invention relates to a face mask comprising a compound structure with an inner layer and two sandwich layers, whereinthe inner layer is made from a filter material for filtering particles and germs,the sandwich layers are made from a textile material,the inner layer is sandwiched by the sandwich layers, andthe sandwich layers are bonded to the inner layer at least in sections along the perimeter of the face mask and in sections in the inner area of the face mask.In this way, a reusable face mask with enhanced filtration efficiency is provided.
Owner:TAL APPAREL LTD

System for generating compound structure representation

A structure model includes a first encoder that converts a compound structure representation to a real number vector and a first decoder that estimates the compound structure representation from the real number vector resulting from the conversion by the first encoder. A structure-property relationship model includes a second encoder that converts, to a real number vector, an extended vector including, as components, the real number vector generated by the first encoder and a target value vector including target values of one or more physical property values and a second decoder that estimates the extended vector from the real number vector generated by the second encoder.
Owner:HITACHI LTD

Pick racket with asymmetric composite structure

The invention relates to the technical field of Pick rackets, in particular to a Pick racket with an asymmetric composite structure, which comprises a base plate, a first racket surface and a second racket surface, the first racket surface is provided with a first clamping column; the second racket surface is provided with a second clamping column; the base plate is rotationally provided with a fixing column. The bat faces are fixed through spiral matching of the first clamping column, the second clamping column and the fixing column, so that the first bat face and the second bat face respectively keep uniformity of materials of the whole faces, the problem that a frame is not matched with the materials of the bat faces is solved, stress unbalance caused by sudden change of the materials is avoided even if a ball makes contact with the edge of the bat faces during ball hitting, and the service life of the bat is prolonged. Athletes are guaranteed to play competitive roles; in addition, the first racket face and the second racket face are both of a detachable structure, disassembly and assembly can be completed by rotating the fixing column, operation is convenient and fast, extra tools are not needed, the double racket faces are matched with materials with different performance parameters in a supporting mode, a user can flexibly switch the racket faces according to sports scenes and individual hitting habits, and differential hitting hand feelings and effects are achieved.
Owner:DONGGUAN PINGKE SPORTS PRODUCTS CO LTD

An anticoagulant microsphere, its preparation method and application

This invention discloses an anticoagulant microsphere, its preparation method, and its application, belonging to the field of biomedical materials technology. The preparation method includes: preparing a droplet solution using polyethersulfone, polyvinylpyrrolidone, and dimethylacetamide; preparing polyethersulfone framework microspheres; preparing a functional monomer solution using acrylic acid monomer, 2-acrylamide-2-methylpropanesulfonic acid monomer, initiator, crosslinking agent, and deionized water; immersing the polyethersulfone framework microspheres in the functional monomer solution; polymerization; and post-treatment. This invention utilizes oil-phase isolated in-situ polymerization, allowing the functional monomers to polymerize within the aqueous phase inside the porous framework microspheres and form a stable bond with the pore walls, preventing adhesion and extravasation. The resulting PES-gel interpenetrating network composite structure exhibits excellent anticoagulant properties. The preparation process is simple, easy to scale up for production, the oil phase and ethanol are recyclable, the steps are modular, and the production window is wide, making it suitable for large-scale and continuous production.
Owner:SICHUAN UNIV

Polishing pad cleaning device in full aperture polishing

The present application relates to the polishing disc cleaning device in full caliber polishing, is carried on full caliber polishing polishing machine, it includes: brush mechanism, brush mechanism is connected to polishing machine crossbeam, its output end below is connected with the brush disc of compound structure, the brush disc has brush hair towards the polishing disc surface side, the brush hair center to the outer edge gradually from sparse to dense arrangement forms multiple rings, the washing range of brush disc covers the entire polishing disc surface, the liquid supply faucet provides the cleaning agent for the brush hair in real time;Liquid supply mechanism, liquid supply mechanism provides the cleaning agent suitable for temperature, and according to the required flow is supplied to the polishing disc surface through liquid supply faucet;Control cabinet, at least part of the components of liquid supply mechanism and brush mechanism is electrically connected with control cabinet.The present application realizes the efficient, uniform, stable cleaning of polishing disc by integrating liquid supply mechanism, brush mechanism and control cabinet and other components, improves the cleaning quality and efficiency.At the same time, through the accurate control and monitoring system, the reliability and safety of the cleaning process are ensured.
Owner:LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS

Flexible composite structure mold

The application discloses a flexible composite structure mold and belongs to the technical field of mechanical molds. The mold base assembly comprises a mold base and a supporting mechanism guide sleeve fixing plate. A plurality of mold surface supporting mechanisms are evenly and vertically arranged in the mold base. The execution ends of the mold surface supporting mechanisms pass through the supporting mechanism guide sleeve fixing plate and are positioned at the bottom of the working mold surface. The mold surface supporting mechanism and the multi-point forming curved surface part are combined, the workload of mold processing is reduced, and the mold processing efficiency is improved. The mold quality and effective volume ratio are reduced by using the working mold surface with small thickness, the hollow base and the arrayed supporting rods, and the lightweight of the mold is realized. The working mold surface is connected to the base through the mold surface supporting mechanism, the working mold surface is detachable, the mold base is reused, and the mold manufacturing cost is reduced.
Owner:JILIN UNIVERSITY

GICL package structure with integrated isolation as part of die

A system and packaged integrated circuit device include first and second integrated circuit dies with first and second communication coils, respectively. The second die is positioned with respect to the first die such that the first communication coil is aligned with the second communication coil to allow inductive coupling between the first communication coil and the second communication coil. The system and device also include a molding compound structure positioned around a perimeter of the second die, and an insulating layer positioned between the first die and the second die, and positioned between the first die and the molding compound structure. A method of forming a device includes forming the molding compound structure on at least four sides of the second die, exposing a backside of the second die, and forming the insulating layer on the backside of the second die and the molding compound structure.
Owner:NXP USA INC

Sheet containing polyurethane layers, preparation method and use

A sheet comprising a support layer, an intermediate layer containing polyurethane having a gel content of at least 20 %, and a cover layer containing thermoplastic polyurethane having a gel content of less than 10 %, wherein the support layer and the intermediate layer only partly interpenetrate each other in their thickness direction to form a compound structure, wherein the thickness of the intermediate layer above the compound structure is at least 20 µm; a method of preparing the sheet; and the use of the sheet as a surface material in the interior of a vehicle.
Owner:TMG TECIDOS PLASTIFICADOS E OUTROS REVESTIMENTOS PARA A IND STRIA AUTOMOVEL SA

Sheet containing polyurethane layers, preparation method and use

A sheet comprising a support layer, an intermediate layer containing polyurethane having a gel content of at least 20 %, and a cover layer containing thermoplastic polyurethane having a gel content of less than 10 %, wherein the support layer is a textile layer and the intermediate layer is a compact layer, wherein the support layer and the intermediate layer only partly interpenetrate each other in their thickness direction to form a compound structure, wherein the thickness of the intermediate layer above the compound structure is at least 20 μm; a method of preparing the sheet; and the use of the sheet as a surface material in the interior of a vehicle.
Owner:TMG TECIDOS PLASTIFICADOS E OUTROS REVESTIMENTOS PARA A IND STRIA AUTOMOVEL SA

Fiber attach enabled wafer level fanout

A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.
Owner:AYAR LABS INC

Wheel-foot compound structure pid control and gait planning method and electronic equipment

The application relates to the field of robot control, and particularly discloses a PID control and gait planning method of a wheel-foot composite structure and electronic equipment, which comprises the following steps: a PID control model with a coupling compensation term is established; each joint angle error is calculated; adjacent joint motion interference is compensated according to the PID control model with the coupling compensation term; in the wheel mode, an outer ring controls speed with the second threshold value as the target, and an inner ring corrects the posture according to IMU feedback; when the inclination exceeds the third threshold value, the posture control weight is enhanced; in the foot mode, PID parameters are adjusted in advance according to laser radar prediction, and the adaptability to complex terrains is improved; terrain, gait, control precision and energy consumption data are collected in real time, PID parameters are automatically adjusted based on a PPO algorithm, and the control precision of the robot in unknown terrains is improved; and through a dynamic coupling compensation mechanism, the motion interference between joints is accurately resolved, each joint can keep high coordination in motion, and accurate motion postures can be stably maintained regardless of complex terrains.
Owner:FUDAN UNIVERSITY

Composition for resist underlayer film formation, resist underlayer film, method for forming resist pattern, and method for manufacturing semiconductor device

A composition for resist underlayer film formation, which contains a resin (G) having a complex structural unit and a solvent, the complex structural unit having a structural unit (A) having an aromatic ring, and a structural unit (B) having one or more carbon atoms, the resin (G) being a resin obtained by a reaction of generating a covalent bond between a carbon atom constituting the aromatic ring of the structural unit (A) and a carbon atom in the structural unit (B), the structural unit (A) containing a structural unit (A-I) containing at least a nitrogen atom and a carbon-carbon triple bond, the structural unit (B) containing a structural unit (B-I) having a non-aromatic hydrocarbon ring, the number of carbon atoms constituting the non-aromatic hydrocarbon ring of the structural unit (B-I) being 5 to 30.
Owner:NISSAN CHEM CORP

Safety seat with composite structure and child restraint system

The utility model discloses a safety seat of a composite structure and a child restraint system.The safety seat of the composite structure comprises a frame and an insert embedded in the frame, the frame is made of foaming materials and forms a semi-surrounding structure, and the interior of the semi-surrounding structure is a sitting space; at least one part of the insert extends into the frame, the other part of the insert is exposed out of the frame, and the structural strength of the insert is greater than that of the frame; the inserts comprise one or more of the following inserts: a first insert in contact with the supporting surface; the second insert and the third insert are used for positioning the first restraining piece; the fourth insert is used for mounting a handle; the fifth insert is used for mounting a buffer part; the sixth insert is used for mounting a sunshade; and the seventh insert and the eighth insert are used for positioning the second restraining piece. The frame is made of the foaming materials, the self weight of the seat is effectively reduced, the use experience is improved, and meanwhile the advantages of being good in integrity and high in production efficiency are achieved.
Owner:绍兴上虞日星五金制品有限公司

A semiconductor package structure and a method of manufacturing the same

This invention provides a semiconductor packaging structure and its fabrication method. The fabrication method includes the following steps: providing a packaging substrate, the packaging substrate including a first surface and a second surface disposed opposite to each other; providing at least one chip, each chip having metal bumps on its active surface; bonding the active surface of the chip to the first surface of the packaging substrate; providing at least one heat dissipation silicon sheet; and attaching each heat dissipation silicon sheet to the side of each chip away from the packaging substrate to form a molding compound structure. The molding compound structure includes a first molding compound layer and a second molding compound layer with different coefficients of thermal expansion. The first molding compound layer fills the gap between the chip and the packaging substrate, and the second molding compound layer is located on the packaging substrate, encapsulating the first molding compound layer, the chip, and the heat dissipation silicon sheet, exposing the side of the heat dissipation silicon sheet away from the chip. The semiconductor packaging structure fabrication method of this invention can achieve both high heat dissipation performance and high reliability of the packaging structure.
Owner:SILICONWARE TECH SUZHOU

Resistive work memory devices and methods for their manufacture for improving RAM storage by separating a TI top layer in front of an HK-HFO separation

Resistive working memory device (100) comprising: a variable-resistance dielectric layer (110, 604) having a top surface and a bottom surface; a cathode (114, 112, 113, 608, 606, 607) arranged above the variable-resistance dielectric layer (110, 604) adjacent to the top surface; a metal cover layer (108, 602) arranged below the variable-resistance dielectric layer (110, 604) adjacent to the bottom surface; and an anode (106, 502) arranged below the metal cover layer (108, 602), wherein the resistive working memory device (100) further comprises: a semiconductor support area (103, 403) comprising a metal compound structure (101, 401) arranged in a low-k dielectric layer (102, 402) is arranged;and a dielectric protective layer (104, 404) having an opening over a section of the metal compound structure (101, 401), wherein side walls of the dielectric protective layer (104, 404) adjoining the opening terminate over the metal compound structure (101, 401) and wherein the anode (106, 502) lies over the dielectric protective layer (104, 404) and adjoins the metal compound structure (101, 401) through the opening in the dielectric protective layer (104, 404).
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

Active energy ray-curable resin composition, cured product, and optical sheet

The present invention provides an active energy ray-curable resin composition, a cured product, and an optical sheet that exhibit high refractive index, high abrasion resistance, and high self-healing properties while suppressing moisture adhesion. The active energy ray-curable resin composition comprises a polymerizable compound (A), a photopolymerization initiator (B), and a leveling agent (C). The active energy ray-curable resin composition is characterized in that the polymerizable compound (A) comprises a polymerizable compound (A1) having an alkylene oxide chain in its structure and a polymerizable compound (A2) having an SP value of 8.88 or less, and the polymerizable compound (A1) is contained such that the content of the alkylene oxide chain in the compound structure is 0.6 mmol / g or greater in the total amount of the composition.
Owner:DIC CORP

COMPOUND STRUCTURES WITH RUTHENIUM LINING WITH COBAL INFUSION AND A COBAL COVER AND METHOD FOR FORMING SUCH COMPOUND STRUCTURES

ActiveDE112021000239B4RutheniumCompound structure
Methods for forming a connection structure, including: Forming a recess (108) within a dielectric layer (106); shape-adapted deposition of a barrier layer (110) within the recess; Forming a ruthenium lining with cobalt infusion over the barrier layer, the cobalt-containing ruthenium lining comprising: a first lining (120) directly above the barrier layer, wherein the first lining comprises ruthenium; a second lining (130) directly above the first lining, the second lining comprising cobalt; and a third lining (240) directly above the second lining, wherein the third lining contains ruthenium, wherein the ruthenium lining with cobalt infusion is formed by migration of cobalt atoms from the second lining into the first and the third lining; Deposition of a conductive material (242) over the ruthenium lining with cobalt infusion to fill the recess; and Forming a cover layer (256) over an upper surface of the conductive material, wherein the cover layer comprises cobalt.
Owner:INTERNATIONAL BUSINESS MACHINE CORPORATION

Method for transferring an embossed structure to the surface of a coating and compound structure containing said coating

The present disclosure relates to a method for transferring an embossed structure to at least a part of a surface of a coating (B2), using a composite (F1B1) composed of a substrate (F1) and of an at least partially embossed and at least partially cured coating (B1), where the coating (B2) and the coating (B1) of the composite (F1B1) have embossed structures which are mirror images of one another. Also described herein is a composite (B2B1F1). Further described herein is a use of this composite for producing an at least partially embossed coating (B2) in the form of a free film or a composite (B2KF2) composed of a substrate (F2), at least one adhesive (K), and the coating (B2).
Owner:BASF COATINGS GMBH

Electric screwdriver with composite structure

According to the electric screwdriver of the composite structure, a first motor and a second motor of the electric screwdriver are fixedly arranged on one side of a mounting plate, a transmission mechanism is fixedly arranged on the other side of the mounting plate, the output end of the first motor is connected with the input end of the transmission mechanism, and a nut screwdriver head is connected with the output end of the transmission mechanism; one end of the screw bit is connected with the output end of the second motor through an elastic floating assembly, and the other end of the screw bit penetrates through the output end of the transmission mechanism and extends to the inner side of the nut bit. The screw bit is integrally arranged in the nut bit, the nut bit is also in butt joint with the nut while the screw bit is in butt joint with the screw, the nut bit is kept still when the second motor drives and controls the screw bit to rotate, and after the screw is adjusted, the first motor drives and controls the nut bit to rotate, and at the moment, the screw bit is kept still; and the screw at the set screwing depth can be fixed until the nut is tightened, so that the screw can accurately adjust functional parameters of a product.
Owner:SHENZHEN SHENSI MICRO INTELLIGENT TECH CO LTD

Fiber Attach Enabled Wafer Level Fanout

A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.
Owner:AYAR LABS INC

Crushing structure and food processing equipment applying same

A smashing structure can be applied to food processing equipment and comprises a smashing wall and a smashing roller, the smashing roller rotates on the inner side of the smashing wall and is matched with the smashing wall to smash materials, the smashing roller comprises a roller body and a plurality of stainless steel grinding heads, and the stainless steel grinding heads are detachably installed on the periphery of the roller body. Mounting tables corresponding to the stainless steel grinding heads are arranged on the periphery of the roller body, the roller body is formed by compounding an aluminum core and a stainless steel shell, the stainless steel shell wraps the outer side of the aluminum core, the aluminum core is provided with a core body and a plurality of protruding parts distributed on the periphery of the core body, and the inner surface of the stainless steel shell comprises a plurality of concave cavities corresponding to the protruding parts. The easy-to-wear part of the crushing structure is manufactured in the form of the stainless steel grinding head, spare parts are low in cost and convenient to replace, the roller main body is formed by compounding the aluminum core and the stainless steel shell, the cost is low, the light weight requirement is met, and the imbedding composite structure is easy to manufacture and high in strength; and the crushing wall can be designed into a working layer and a supporting layer to further save cost or realize light weight.
Owner:SHANDONG HEALTH SOURCE BIOLOGICAL ENG CO

Electron transport layer material and organic electroluminescent device

ActiveCN121673237AOrganic chemistryThin film morphologyPhenyl group
The invention belongs to the technical field of organic electroluminescent devices, and discloses an electron transport layer material and an organic electroluminescent device.In the electron transport layer material, the compound structure is mainly composed of 9-alkyl-9-benzofluorene and two triazine groups, wherein the 9-alkyl-9-phenylfluorene is used as a bridging group, and the two triazine groups are respectively connected to phenyl in fluorene below the 9-alkyl-9-phenylfluorene group and phenyl on the 9-site. Through collaborative design of a fluorene bridging group and two triazine acceptor units, high electron mobility, adjustable energy level and excellent thin film form are realized, the material has a good electron transport function, and as an electron transport layer material, an organic electroluminescent device prepared from the material has the advantages of low driving voltage, high luminous efficiency and long service life, and can be widely applied to the field of organic electroluminescent devices. And meanwhile, the efficiency roll-off is small.
Owner:JILIN OPTICAL & ELECTRONICS MATERIALS CO LTD

Cavity sound insulation block structure

The utility model belongs to the technical field of injection molding products, and particularly relates to a cavity sound insulation block structure which comprises a PA framework and EVA polystyrene foam compounded on the surface of the PA framework, the PA framework is connected at a bending position through a PA bending buckle, the bending position of the PA bending buckle is preformed to form an included angle of 135 degrees, the wall thickness of the bending position is thinned, and the thickness of the PA bending buckle is reduced. And the connecting structure can adaptively block a bending section cavity between 90 degrees and 180 degrees of a vehicle body. According to the utility model, through the composite structure of the PA framework and the EVA polystyrene foam layer which are integrally extruded and molded, and in combination with the pre-molded 135-degree bending angle and the wall thickness reduction design, the sound insulation block can be self-adaptive to 90-180-degree bending requirements, and the application range of cavity section plugging is obviously widened.
Owner:TIANJIN GUOXIN RUBBER & PLASTIC

Compound with nine-ring side chain and organic electroluminescent device thereof

The invention belongs to the technical field of organic electroluminescent materials, and particularly relates to a compound with a nine-ring side chain and an organic electroluminescent device.The series of compounds contain a large conjugate fragment and a benzo five-membered heterocyclic ring or five-membered heterocyclic ring structure, sulfur and other heavy atoms contained in the large conjugate fragment can improve the spin-orbit coupling capacity, and therefore the stability of the compound is improved. According to the invention, charge transfer in molecules is enhanced, so that a higher anti-intersystem crossing coefficient is achieved, efficient conversion of triplet excitons can be realized, and loss of the excitons is reduced; meanwhile, the compound structure has an extremely remarkable intramolecular distortion structure, molecular stacking is effectively reduced, annihilation of carriers and excitons is inhibited, triplet-state excitons can be converted more efficiently, combination of the excitons in a light-emitting layer is guaranteed through cooperation of the structures of all the parts, and the light-emitting efficiency is improved. Therefore, the comprehensive performance of the organic light-emitting device is improved.
Owner:JILIN YUANHE ELECTRONICS MATERIALS CO LTD