The invention provides a
chip packaging device and a packaging method thereof, belongs to the technical field of
chip packaging, and mainly aims at solving the problem that an existing packaging device is poor in gluing effect, the
chip packaging device comprises a base and a mounting table, two sets of glue storage assemblies are arranged at one end of the mounting table, and a
relay tank is arranged at the bottom of one set of glue storage tanks; a bubble removing
assembly is arranged in the
relay tank, bubbles in glue can be removed through the bubble removing
assembly, the bonding effect of the glue is improved, a grid
laser transmitter is arranged at the bottom of the mounting plate and can conduct grid
laser irradiation on a chip substrate, a camera is arranged on one side of the grid
laser transmitter, and the camera is arranged on the other side of the grid
laser transmitter. Wherein a control module and a
visual identification module are arranged on one side of one group of glue storage
assembly, through the arrangement of the camera and the
visual identification module, the control module can control the glue dispensing assembly to perform glue dispensing on grids at the edge of a chip substrate, glue is flattened through the glue smearing mechanical arm, and the glue smearing effect is improved.