The invention discloses a TSV technology-based
silicon wafer image defect identification method and
system, and the method comprises the steps: synchronously collecting three-dimensional images according to the depth structure characteristics of a TSV
silicon wafer, mapping the three-dimensional images of different
modes to a unified space coordinate
system, and obtaining a three-dimensional
fusion image; according to the three-dimensional
fusion image, a
feature extraction model based on a three-dimensional
convolutional neural network is adopted, TSV hole wall morphology, depth deviation and material uniformity features are extracted, and an enhanced multi-dimensional feature
tensor is obtained; according to the multi-dimensional feature
tensor, modeling in combination with the spatial topological relation of the TSV structure to obtain a spatial topological
distribution diagram of the defects; according to the space topology
distribution diagram of the defects, the relevance between defect causes and process links is analyzed, a defect cause report and
process optimization suggestions are generated, and an interpretable defect diagnosis result is obtained. According to the embodiment of the invention, a comprehensive and accurate
silicon wafer image defect identification and
process optimization scheme can be provided, and the reliability of a TSV manufacturing process is improved.