767 results about "Image sensing" patented technology

The invention discloses a self-isolation type image sensing structure, a sensor and a preparation method, and belongs to the field of semiconductors, the self-isolation type image sensing structure is characterized in that a shallow trench isolation structure is exposed after the back surface of a substrate is thinned, then a first semiconductor layer is extended on the back surface of the substrate, and a first isolation structure is prepared in the first semiconductor layer; sequentially depositing a second semiconductor material layer and a metal grating material layer on the first semiconductor layer; sequentially etching the metal grating material layer and the second semiconductor material layer to form a plurality of metal grating structures distributed at intervals and corresponding self-isolation structures; extending a plurality of photosensitive layers in the photosensitive region groove between the adjacent self-isolation structures to form a photosensitive region; and then activating, preparing a filter layer and the like are carried out to obtain a complete back-illuminated image sensor. The self-isolation photodiode is obtained by changing the structural distribution of the photodiode, unexpectedly, the problem that the substrate is damaged by doping is solved, meanwhile, the crosstalk effect is greatly reduced, and the performance of the image sensor is improved.

An image sensing device includes a first photoelectric conversion element configured to overlap a left region of a first microlens, a second photoelectric conversion element configured to overlap a right region of the first microlens, a first floating diffusion region configured to accumulate photocharges received from at least one of the first photoelectric conversion element and the second photoelectric conversion element, a first transfer gate disposed at a top-left side of the first floating diffusion region and configured to transfer photocharges of the first photoelectric conversion element to the first floating diffusion region, and a second transfer gate disposed at a bottom-right side of the first floating diffusion region and configured to transfer photocharges of the second photoelectric conversion element to the first floating diffusion region.

The invention relates to a laser galvanometer detection system with temperature drift self-detection and correction functions. The laser galvanometer detection system comprises an error judgment module and an error calibration module, the error judgment module comprises a CMOS image sensing module, a visual detection module and a storage module; the error calibration module comprises a calibration module and a laser marking module; the CMOS image sensing module is used for shooting a high-definition image, and the visual detection module can generate a prediction image and perform deviation identification on the image shot by the CMOS image sensing module. According to the invention, the temperature drift error is automatically detected through real-time detection of the position drift error of each visual single detection area in the galvanometer processing breadth, and each visual single detectable area is detected one by one to form an adjacent array, so that the temperature drift error detection of the whole processing breadth is realized; and comparing the difference between'theoretical due 'and'actual existing' through an intelligent algorithm so as to detect, compensate and correct the error in real time.

The invention relates to a wafer pose recognition system and an image acquisition device and an image acquisition method thereof, the wafer pose recognition system comprises a support structure for supporting a wafer to be recognized and the image acquisition device arranged above the wafer to be recognized, and an image sensing module is arranged in the image acquisition device. A fisheye lens group or a negative lens is adopted to enlarge the visual field width of an image sensor, so that the image sensing module can obtain complete edge image information of a wafer in one-time imaging, the positioning efficiency is improved, an annular first light shielding plate and a circular second light shielding plate are arranged on an optical path of the lens to form an annular visual field in a matched mode, and the positioning precision is improved. The edge blurred part image and the middle too bright part image are physically excluded, the imaging quality in the annular view is improved, the clear and complete wafer positioning edge image can be obtained, the contour recognition precision during image recognition is improved, and the positioning accuracy is improved.

In an embodiment, an image sensing device includes a pixel array including a plurality of unit pixels, wherein each of the unit pixels comprises a plurality of sub-pixels, wherein a first isolation region is formed in an edge region of the plurality of sub-pixels, wherein a second isolation region is formed from the first isolation region toward a central portion of each of the sub-pixels, wherein the second isolation region comprises: a first inner isolation region protruding from one region of the first isolation region toward the central portion of the sub-pixel; and a second inner isolation region aligned with the first inner isolation region and protruding from another region of the first isolation region toward the central portion of the sub-pixel, wherein a third isolation region is formed in a direction orthogonal to a direction in which the first inner isolation region and the second inner isolation region.

A semiconductor image sensing structure includes a semiconductor substrate having a front side and a back side, a pixel sensor disposed in the semiconductor substrate, a transistor disposed over the front side of the semiconductor substrate, and a reflective structure disposed over the front side of the semiconductor substrate. A gate structure of the transistor and the reflective structure include a same material. A top surface of the gate structure of the transistor and a top surface of the reflective structure are aligned with each other.

One or more of the described systems, methods, and apparatuses relate to imaging devices with integrated light exposure control. An imaging device comprises an image sensor and a light modulation layer coupled to the image sensor. The light modulation layer comprises a plurality of liquid-crystal (LC) device pixels over the image sensor. The imaging device comprises control circuitry coupled to the image sensor and the light modulation layer. The control circuitry is configured to apply a transparency mask to the light modulation layer by modifying, based on at least one frame captured at the image sensor, pixel attributes of the plurality of LCD pixels for modulating exposure of the image sensor.

The invention discloses a steel-wood combined component surface defect detection system and method based on image sensing, and relates to the technical field of defect detection.The system comprises an area identification module used for collecting a multi-modal image data set and determining a steel area subset and a wood area subset; the overlap analysis module is used for performing double-layer mapping and determining steel-wood combination interface information; the surface anomaly analysis module is used for performing surface anomaly analysis; the defect feature extraction module is used for extracting steel and wood defect features; the defect distribution diagram drawing module is used for drawing a surface defect distribution diagram; and the defect influence analysis module is used for carrying out defect influence analysis and locking surface defects. The technical problem that in the prior art, steel-wood combined component surface defect detection is not accurate enough, and consequently structure safety evaluation is not comprehensive enough is solved, and the technical effects that accurate detection of the steel-wood combined component surface defects is achieved, and the comprehensiveness of component structure safety evaluation is improved are achieved.

An image sensing device includes an upper substrate configured to include a pixel region and a first peripheral region located outside the pixel region, a lower substrate configured to include a logic region and a second peripheral region located outside the logic region, the logic region configured to generate an image based on the electrical signals from the unit pixels, light reception elements disposed over the upper substrate and configured to transmit the incident light to the pixel region, an insulation layer disposed between the upper substrate and the lower substrate, a light reception alignment mark disposed in the first peripheral region and configured to assist positioning of the light reception elements, and an alignment pattern disposed between the first peripheral region and the second peripheral region and in the insulation layer. The alignment pattern is configured to absorb light used to measure the light reception alignment mark.

The measuring equipment comprises a sensing unit, the sensing unit comprises a bin body, a laser sensing module, an image sensing module, a connecting piece and a gasket, and the laser sensing module and the image sensing module are connected to a first surface and a second surface, opposite to each other up and down, of the connecting piece respectively. A part of the first surface is separated from the laser sensing module, so that an accommodating space is formed between the first surface and the laser sensing module; and / or part of the second surface is separated from the image sensing module, so that an accommodating space is formed between the second surface and the image sensing module. The containing space can be used for containing connecting lines of the laser sensing module and / or the image sensing module, and the connecting lines comprise wires and communication lines. The laser sensing module and the image sensing module are fixed together through the connecting piece, so that connection between the laser sensing module and the image sensing module is firmer, and movement is not prone to occurring. And the risk of measuring errors after the measuring equipment is used for a long time is reduced.

A semiconductor device, a back-side deep trench isolation (BDTI) structure of a semiconductor device, and method of manufacturing a semiconductor structure are provided. The semiconductor device, comprising: a pixel region disposed within a substrate and comprising an image sensing element configured to convert electromagnetic radiation into an electrical signal; and one or more BDTI structures extending from a first-side of the substrate to positions within the substrate; wherein the one or more of BDTI structures comprise one or more ferroelectric materials.

Designs of image sensing devices by including a substrate layer including a plurality of photoelectric conversion elements, a plurality of grid structures disposed over the substrate layer, a plurality of color filter layers each of which is disposed between adjacent grid structures, a plurality of over-coating layers formed over the color filter layers, and a plurality of microlenses formed over the over-coating layers. Each of the grid structures includes an air layer, and a capping film formed to cap the air layer, and an upper portion of the air layer is formed to protrude upward from the over-coating layer.

The invention relates to a boiler combustion adjusting system and method based on a slag state, and the system comprises an image data sensing system which is used for detecting the contour of a slag block according to image information, matching the three-dimensional dimension of the slag block and analyzing the ash component of the slag block, so as to generate image sensing data of the slag block according to the contour, the three-dimensional dimension and the ash component; the edge-cloud collaborative computing architecture is used for constructing a combustion big data platform and calculating the theoretical slag quantity under the current combustion working condition by utilizing the combustion big data platform; and the combustion optimization decision execution system is used for determining the abnormal condition of combustion of the hearth on the basis of the difference value between the theoretical slag falling amount and the actual slag falling amount, and adjusting at least one combustion parameter of the primary air volume, the rotating speed of the coal mill, the air distribution mode and the soot blowing system. According to the embodiment of the invention, a perception-analysis-execution integrated framework is constructed, and targeted strategy optimization is carried out on the combustion abnormal working condition based on parameters such as the slag falling amount, the slag block falling position and components.

The invention relates to the technical field of intelligent control, in particular to a coke pushing process environment dust removal system air volume intelligent energy-saving regulation and control system and method, and the system comprises a process signal module, an image sensing module, a dynamic infrared module, a real-time flue gas analysis module and a dust removal air volume control module. In the invention, the air volume regulation of the dust removal equipment is not a fixed and extensive mode any more, but is converted into a four-gear variable-speed intelligent response matched with the actual smoke dust load, the dust removal equipment runs at a low-energy-consumption gear when the smoke dust generates initial stage or light pollution, and the air volume is gradually increased along with the rising of the smoke dust load, so that the dust removal efficiency is improved. When large-scale smoke dust leakage caused by equipment faults or extreme working conditions is monitored, the highest-gear full-force trapping is immediately started, the treatment effect is ensured, and the regulation and control according to needs not only improves the smoke dust trapping efficiency and effectively restrains unorganized emission, but also reduces the operation energy consumption of a dust removal system, and realizes double improvement of environmental protection benefits and economic benefits.

The invention discloses a readout circuit and a readout system for image sensing and solid-state imaging equipment, and relates to the technical field of image sensing readout, and the readout circuit comprises a pixel array unit which is used for photoelectric signal conversion; a current mirror circuit unit; wherein the current mirror circuit unit comprises a cascode current mirror or two N-channel field effect transistors; a negative impedance conversion unit; and a charging and discharging acceleration unit. According to the invention, the negative impedance conversion unit and the charging and discharging acceleration unit are utilized, and the negative impedance generated by the negative impedance conversion unit is counteracted with the parasitic impedance influencing the VSL establishment speed, so that the small signal establishment speed is accelerated; the charging and discharging acceleration unit is used for selectively providing charging and discharging current in the VSL descending establishment process or the VSL ascending establishment process, so that the large signal establishment speed is accelerated. In this way, corresponding response cooperation can be carried out for the VSL descending establishment process or the VSL ascending establishment process.

An image sensing device includes first color filters having a first color, second color filters having a second color, third color filters having a third color, fourth color filters having a fourth color, and a grid structure disposed between adjacent color filters of the first to fourth color filters and configured to prevent crosstalk between the adjacent color filters. The grid structure includes a first grid region disposed on sides of some of the fourth color filters and a second grid region different from the first grid region, and the grid structure has different structures in the first grid region and the second grid region.

The invention provides an electromagnetic adsorption type drilling actuator capable of achieving automatic feeding and an automatic drilling method, and relates to the technical field of intelligent machining. The electromagnetic adsorption type drilling actuator comprises a drilling machine body, a connecting support, a feeding system, an electromagnetic adsorption device, an image sensing unit and a control system; the connecting support is slidably connected with the drilling machine body and fixedly connected with the tail end of the mechanical arm. The feeding system is fixedly arranged on the connecting bracket; a moving part of the feeding system is fixedly connected with the drilling machine body; the electromagnetic adsorption device is fixedly arranged on the connecting support, and the adsorption face of the electromagnetic adsorption device faces the feeding direction of the drilling machine body. The image sensing unit is fixedly arranged on the drilling machine body; and the control system is electrically connected with the drilling machine body, the feeding system, the electromagnetic adsorption device and the image sensing unit. A visual module is integrated on the aspect of the device, an executing mechanism with the real-time environment sensing capacity is constructed, and cooperative control of precise feeding transmission and self-adaptive adsorption is achieved through modular design.

The invention provides an active train sensing system and method based on thunder and vision fusion. Comprising an acquisition module used for acquiring multi-path image data containing different focal length images and three-dimensional point cloud data corresponding to the front of a train; the time synchronization module is used for generating synchronous image data and synchronous three-dimensional point cloud data; the coordinate transformation module is used for establishing a spatial transformation relation between the three-dimensional point cloud coordinate system and the image coordinate system; the image sensing module is used for inputting the synchronous image data and the three-dimensional point cloud data into the target segmentation network to obtain track coordinates; the point cloud sensing module is used for obtaining three-dimensional point cloud data in front of the train; and the thunder-vision fusion module is used for distributing an accurate center representative coordinate for each obstacle, generating structured obstacle information and outputting the structured obstacle information to a vehicle-mounted train control system. The multi-source sensing information utilization rate can be improved, the track obstacle recognition and three-dimensional positioning precision is improved, and the system sensing stability in a complex scene is enhanced.

The invention provides an implementation method of a sound-light alarm linkage terminal device under external force construction monitoring. The implementation method comprises the following specific steps that a low-power-consumption image sensing terminal deployed along a power transmission line continuously collects channel environment images; performing target detection and behavior modeling on the uploaded image, identifying whether an external force construction behavior exists or not, and judging whether the image enters a high-voltage line protection area or not; when the system judges that the invasion risk exists, an acousto-optic warning signal is sent out, and field intervention is carried out on constructors; and after completing the acousto-optic intervention, the mobile terminal uploads the event to a remote platform. The method has the advantages that the construction behavior can be accurately identified and the risk level can be evaluated in real time; after potential threats are identified, on-site illegal behaviors are quickly stopped; the response speed, the intervention effect and the intelligent management level of the power grid to external force damage behaviors are improved, and an efficient, intelligent and sustainable evolution early warning protection system is constructed for high-voltage line channel safety.

The invention relates to the technical field of laboratory information management, and discloses a laboratory information management system combining artificial intelligence perception and service-oriented construction, and the system comprises an AI data and image perception module which comprises a data and image collection unit, a model building unit and a processing unit based on a convolutional neural network; the service-oriented architecture service layer comprises a service bus and a plurality of service interfaces, and the service interfaces package the AI data and the image sensing module into independent services by adopting a RESTfulAPI standard; the core laboratory information management module comprises a database and a user interaction interface; and the resource management module comprises a resource monitoring unit and a distribution unit. In the invention, through a service bus of a service oriented architecture (SOA) and a priority scheduling algorithm, and in combination with an artificial intelligence image perception module, computing resources can be dynamically allocated according to a task emergency degree and resource availability, efficient optimization of laboratory data processing is realized, and continuity of laboratory workflow and real-time performance of data processing are improved.

The invention discloses an image sensing chip board-level packaging structure and a manufacturing method thereof.The packaging structure comprises a cofferdam type chip unit, the cofferdam type chip unit comprises a transparent substrate, a cofferdam structure and an image sensing chip, the front face of the image sensing chip is provided with a photosensitive area and a bonding pad, the transparent substrate covers the photosensitive area, and the cofferdam structure covers the bonding pad; a cofferdam structure is arranged between the transparent substrate and the image sensing chip, and the cofferdam structure surrounds the photosensitive area to form a closed area; the plastic package body wraps the side surface and the back surface of the cofferdam type chip unit; the first rewiring layer is arranged on one side, close to the front surface of the image sensing chip, of the plastic package body and is electrically connected with a bonding pad of the image sensing chip; the second rewiring layer penetrates through the plastic package body and is electrically connected with the first rewiring layer; and the external interconnection structure is electrically connected with the second rewiring layer. The packaging structure has excellent electrical quality and reliability, the packaging size is larger than the size of a bare chip, and the problem that the heat dissipation capacity is limited due to miniaturization of wafer-level packaging can be solved.

Systems and methods are disclosed herein that include a polarization sorting metasurface microlens array device. In a particular embodiment, a polarization imaging device is provided. A polarization imaging apparatus includes: an image light source; a metasurface lenslet array including a plurality of repeating metasurface lenslets, where the plurality of repeating metasurface lenslets include a plurality of first metasurface lenslets configured to diffract image light into first polarized light in a first direction and second polarized light in a second direction; and an image sensor in an optical path of the first polarized light and the second polarized light, and wherein the image sensor includes a plurality of image sensing units including a first image sensing unit positioned to sense the first polarized light and a second image sensing unit positioned to sense the second polarized light.

An image sensing device includes a pixel array configured to include a plurality of pixel groups arranged in a matrix structure. Each of the pixel groups includes an optical filter configured to selectively pass incident light, a plurality of photoelectric conversion regions disposed below the optical filter and arranged in a matrix structure, a first isolation structure disposed between the photoelectric conversion regions and other pixel groups, a plurality of second isolation structures disposed between two adjacent photoelectric conversion regions from among the photoelectric conversion regions, and a third isolation structure disposed between the second isolation structures, and configured to interconnect the second isolation structures. The third isolation structure includes a cavity region formed adjacent to contact any one of the photoelectric conversion regions.

An image sensing device is provided. The image sensing device includes: a micro lens, a first optical layer, a second optical layer, and an anti-reflection layer. The first optical layer is formed on the micro lens. The second optical layer is formed on the first optical layer. An interface is formed between the first optical layer and the second optical layer, and the interface is beveled. The anti-reflection layer is formed on the second optical layer.

The invention provides a device and method for confirming the crack position of a bonded wafer, and the device comprises a bonded wafer placement part, a light source, an image sensing part, an insertion piece part, and a shading part, the insertion piece part is disposed at the outer side of the bonded wafer placement part, and an insertion piece is inserted into the bonded wafer for confirming the crack position; and the bonding wafer placing part, the light source, the image sensing part and the sheet inserting part are covered in the shading part. The wafer position can be observed in real time through the image sensing technology, the wafer defect can be observed conveniently, and the wafer crack generation position can be accurately positioned. And then the wafer insertion part is inserted into the crack generation position of the wafer, so that the generation source of the wafer crack can be found more accurately, and the personnel can be assisted to improve the process. The crack generation position of the bonding wafer can be accurately positioned by using a simple structure, the wafer detection efficiency is improved, and the phenomena of wrong detection and missing detection caused by manual detection are reduced.

The invention relates to the technical field of image sensing, general image recognition and feature positioning under computer vision, and discloses an acupuncture point positioning method and system based on artificial intelligence, and the method comprises the steps: obtaining a non-rigid target section image through an image collection module; the key point identification module determines topological anchor points at two ends of the section; the reference construction module establishes a structure reference vector; a deflection calculation module extracts surface texture feature points, obtains a high-frequency component and a low-frequency component through multi-scale frequency domain decomposition, and determines a spatial deflection parameter based on the gradient of the energy distribution ratio of the high-frequency component and the low-frequency component; the proportion compensation module corrects a target distribution proportion coefficient; according to the method, the pose is inversed by using the scale invariance between the frequency domain components, the decoupling of the anatomical positioning logic and the pixel space is realized, and the non-linear interference of the non-uniformity of the biological surface and the dynamic environment illumination on the positioning precision is eliminated.

An image sensing device is provided to include: a substrate; a photoelectric conversion element formed in the substrate; an isolation structure disposed between the photoelectric conversion element and an additional photoelectric conversion element disposed adjacent to the photoelectric conversion element; a floating diffusion region disposed above an upper portion of the isolation structure; and a floating diffusion region protecting layer disposed below the floating diffusion region and contacting the upper portion of the isolation structure.

Image sensing devices are disclosed. In an embodiment, an image sensing device may include a substrate; a color filter formed over the substrate; first isolation regions formed at both sides of the color filter; and a microlens formed over the color filter, and a lower portion of the color filter may be formed in one region of an upper end of the substrate.

The invention discloses a backside illuminated image sensing structure, a sensor and a preparation method, and belongs to the field of semiconductors, the backside of a substrate is thinned to form a laminated photosensitive structure through a deposition process, a deep trench isolation structure is prepared on the laminated photosensitive structure, a first section of metal grating is prepared, and ions of VA group elements are injected to form a second section of metal grating; an inclined reinforced doping belt is formed; then preparing a second section of metal grating to obtain a complete metal grating, obtaining a back-illuminated image sensing structure, and then performing the processes of activation, preparation of a filter layer and the like to obtain a complete back-illuminated image sensor; according to the invention, the stacked photosensitive structure and the reinforced doping band are combined, so that the crosstalk effect is greatly reduced while the problem of doping damage to the substrate is solved, and the performance of the image sensor is improved.

The invention provides a virtual image distance measurement method and system, and belongs to the technical field of near-to-eye display equipment, and the system comprises a displacement sensing module which is used for obtaining the measurement information of the rear intercept of a lens; the driving module is used for adjusting the rear intercept of the lens; the image sensing module is used for collecting projection images generated by the to-be-detected object in different focusing states of the lens; the calculation module is in signal connection with the displacement sensing module, the driving module and the image sensing module, and is used for determining the virtual image distance of the target projection image by utilizing target measurement information corresponding to the target projection image in a preset focusing state according to a pre-constructed virtual image distance measurement model; wherein the virtual image distance measurement model is established according to the preset calibration distance and the measurement information of the corresponding back intercept. According to the invention, higher measurement precision can be provided, the consistency and repeatability of the measurement result are improved, and the method has strong versatility.