This invention provides a
semiconductor package and a method for fabricating the same. The method includes: forming a first
resist layer on a
metal carrier; forming a plurality of openings penetrating the first
resist layer; forming a conductive
metal layer in the openings; removing the first
resist layer; covering the
metal carrier having the conductive metal layer with a
dielectric layer; forming blind vias in the
dielectric layer to
expose a portion of the conductive metal layer; forming conductive circuit on the
dielectric layer and conductive posts in the blind vias, such that the conductive circuit is electrically connected to the conductive metal layer via the conductive posts; electrically connecting at least one
chip to the conductive circuit; forming an encapsulant for encapsulating the
chip and the conductive circuit; and removing the metal carrier, thereby allowing a
semiconductor package to be formed without a
chip carrier. Given the conductive posts, both the conductive circuit and conductive metal layer are efficiently coupled to the
dielectric layer to prevent
delamination. Further, downsizing the blind vias facilitates the fabrication process and cuts the fabrication cost.