Title: Cooling Device Cooling device (100) for at least two electronic devices (1, 2), in particular two
data center servers, the cooling device (100) comprising: a sealed receptacle (110) comprising at least first and second separate electronic device (121, 122) slots (1, 2) configured to each receive one of the electronic devices (1, 2), and configured to receive
dielectric fluid (30) intended to immerse, at least partially, the electronic devices (1, 2), at least one first plate-type
heat exchanger (4) configured to define a bottom (112) of the sealed receptacle (110), the first
heat exchanger (4) comprising a network of channels (14) configured to circulate a
heat transfer fluid (35) so as to cool the
dielectric fluid (30) contained in the sealed receptacle (110),the
channel network (14) comprising at least one first
heat transfer fluid path (41) and a second
heat transfer fluid path (42), in particular at least one second
heat exchanger (5) connected to at least one of the first fluid path (41) and the second fluid path (42) of the first heat exchanger (4), in particular downstream thereof, and configured to cool a component (11, 12, 21, 22) of one of the electronic devices (1, 2), for example by direct contact between the second heat exchanger (5) and this component (11, 12, 21, 22). Figure for the abstract: Fig. 3,