892results about How to "Improve temperature uniformity" patented technology

The invention discloses a temperature correction method and system for a hot press, and particularly relates to the technical field of hot press temperature control, and the method comprises the steps: obtaining and preprocessing multi-dimensional operation data, including a temperature time sequence, pressure setting and material attributes; constructing a coupling model based on the multilayer neural network, and predicting temperature distribution of different process stages; performing sensor drift compensation, analyzing temperature deviation characteristics, judging whether sensor drift or material thermal diffusion abnormity exists or not, and generating a local distortion mark; determining a compensation mode according to the distortion mark, and starting a local compensation mode or a global balance control mode if the distortion is recognized as over-limit distortion; and comparing with the output of the coupling model, verifying the temperature correction effect, and if the deviation is reduced and the distortion mark is converged, outputting a stable temperature correction result. The problems of temperature distortion and sensor drift are effectively solved, and the long-term precision and stability of the hot press under complex working conditions are improved.

The dynamic hot runner temperature control method suitable for the mold comprises the steps that S1, a temperature sensor is installed in a mold hot runner to collect flow characteristics, heat distribution and temperature original data in the material solidification process, and the temperature original data are transmitted to a temperature control system; s2, the required power adjustment amount Pc is calculated through a PID controller in the temperature control system according to the deviation value delta T between the actual temperature Ta and the set target temperature Ts, and the power adjustment amount Pc is sent to a heater for adjustment; s3, constructing a temperature prediction model M, and predicting the temperature change trend of each section of the mold hot runner through the temperature prediction model M; and S4, a multi-objective optimization function Ft is created, an optimal combination solution St is searched through a particle swarm optimization algorithm PSO, and the optimal set value combination of the hot runner temperature is maintained according to an optimization objective. According to the invention, the energy consumption is reduced while uniform temperature distribution is ensured, the temperature control precision and the response speed are obviously improved, and the requirement of human intervention is reduced.

The invention provides a hydrophilic and hydrophobic composite wetting microstructure steam cavity and a manufacturing method thereof, and relates to the technical field of heat dissipation devices. The hydrophilic and hydrophobic composite wetting microstructure steam cavity comprises an evaporation end and a condensation end, the surface of the evaporation end comprises a micro-channel hydrophilic area and a micro-array hydrophilic area, and the micro-channel hydrophilic area surrounds the micro-array hydrophilic area; the surface of the condensation end comprises condensation hydrophilic areas and condensation hydrophobic areas which are distributed at intervals, and the evaporation end and the condensation end are assembled to form a flat plate structure with a cavity in the middle. Different wettability surfaces of the condensation hydrophilic area and the condensation hydrophobic area are compounded, rapid nucleation condensation can be achieved, droplet-shaped condensation heat transfer of rapid falling of liquid drops in the condensation hydrophobic area and capillary suction rapid liquid discharge of the micro-channel hydrophilic area at the evaporation end are combined, condensation heat transfer of a working medium is enhanced, liquid backflow circulation is accelerated, and the condensation efficiency is improved. The temperature uniformity of the hydrophilic and hydrophobic composite wetting microstructure steam cavity is greatly improved, and batch forming of large-area microstructure functional surfaces is achieved through the in-situ heating imprinting forming micro-imprinting technology.

A fuel cavity, an air cavity and a combustion cavity are sequentially and coaxially arranged at intervals in a sealed mode from bottom to top, a plurality of nozzle assemblies are fixedly arranged in the air cavity, and the nozzle assemblies are symmetrically arranged relative to the center of the air cavity to form an annular multi-layer array structure; the nozzle assembly comprises an air flow guide component, a tangential rotational flow component, a fuel pipe and a mixing pipe which are coaxially arranged. Through a combined adjusting mechanism of the air flow guide component and the tangential rotational flow component, different rotational flow degrees of a single nozzle can be realized, so that the nozzle adapts to fuels with different properties; according to different working conditions, different air rotational flow degrees can be set for the nozzle assemblies on different layers in a staggered mode, or different air rotational flow degrees can be set for the multiple nozzle assemblies on the same layer in a staggered mode, so that staged coupling combustion of the multiple nozzle assemblies in a large space is achieved, and the purposes of enhancing combustion stability and improving temperature uniformity are achieved.

The invention relates to a phase change sweating cooling porous structure and application thereof in an aircraft reentry capsule, the porous structure comprises a porous layer comprising a plurality of densely arranged porous units; the liquid separation cavity is connected with the porous layer; the liquid storage cavity is used for storing a cooling agent; the coolant conveying pipeline is connected with the liquid storage cavity and the liquid separation cavity; the regulating valve is arranged on the coolant conveying pipeline; each porous unit comprises a small-porosity porous part as well as a large-porosity porous part and a liquid channel which are respectively connected with the small-porosity porous part, and a gas channel is formed between the small-porosity porous part and the large-porosity porous part; and a coolant is introduced from the liquid channel, permeates into the small-porosity porous part, escapes from the large-porosity porous part along the gas channel after being gasified, and forms a gas film for heat insulation. Compared with the prior art, rapid gas-liquid separation and partitioned flow regulation and control of the coolant in the sweating cooling porous layer can be effectively achieved, and the phase change sweating cooling efficiency and reliability are effectively improved.

The invention provides a two-phase cold plate liquid cooling cabinet, a control method and a data center, the two-phase cold plate liquid cooling cabinet comprises a plurality of two-phase cold plates, an electro-hydraulic integrated distribution module, a liquid cooling heat exchange module, a system detection module and a system control module, the plurality of two-phase cold plates are used for heat transfer connection with a to-be-cooled part; the electro-hydraulic integrated distribution module is arranged on the rear side of the liquid cooling cabinet and connected with the two-phase cold plate and the to-be-cooled part. The data acquisition module is used for acquiring power consumption information corresponding to to-be-cooled equipment of each node and / or cooling capacity information of a two-phase cold plate of each node; the flow of fluid in the two-phase cold plate is controlled according to the power consumption information and / or the cooling capacity information; the liquid cooling heat exchange module comprises an accommodating cavity arranged at the bottom of the liquid cooling cabinet and is connected with the electro-hydraulic integrated distribution module, and at least three stages of heat exchange units are arranged in the accommodating cavity; and the system detection module is used for acquiring parameters of a cabinet circulation system in operation of each module and each pipeline in the liquid cooling cabinet.

The invention belongs to the technical field of battery thermal management, and discloses a battery pack and a phase change material coupling liquid cooling composite thermal management system.The battery pack comprises a plurality of battery structures, each battery structure comprises a lithium battery, a fin structure, a phase change material filling area and a liquid cooling plate, and the fin structure is arranged on the periphery of the lithium battery; the liquid cooling plate is arranged on the periphery of the fin structure, a phase-change material filling area is formed between the liquid cooling plate and the fin structure, and the phase-change material filling area is filled with a phase-change material for absorbing redundant heat and generating phase change, so that the temperature fluctuation of the battery is reduced. The lithium bromide heat pump and the direct-current power supply are combined, and accurate adjustment of the temperature of the battery pack is achieved through efficient heat exchange and intelligent control. The system can be rapidly switched between a cooling mode and a heating mode, and it is ensured that the battery is always kept within the optimal temperature range in different working environments.

The invention discloses a method for degrading vomitoxin in a corn deep processing process, and relates to the technical field of corn deep processing, and the method specifically comprises the following steps: obtaining temperature dynamic distribution information of corn slurry in each region, judging whether the temperature of the corn slurry in each region is too fast or too slow or not, and if yes, judging whether the temperature of the corn slurry is too fast or too slow or not; dividing each area into a temperature acceleration area, a temperature equalization area and a temperature delay area according to the judgment result; based on the division result of each area, an adjustment mechanism of heating power and time is constructed, and different temperature adjustments are respectively carried out on the temperature acceleration area, the temperature equalization area and the temperature retardation area; in the process that the adjustment mechanism adjusts the temperature of each area, whether the temperature adjustment effect of the adjustment mechanism in each area reaches the expectation or not is evaluated, and the adjustment mechanism is optimized according to the evaluation result. The problem that the temperature is not uniform in the corn slurry heating process is solved, and the effect of uniformly degrading vomitoxin is achieved.

The invention discloses a trapezoidal manifold-microchannel cold plate with a micro-pin-fin porous structure, and belongs to the technical field of heat dissipation of electronic equipment. The device comprises an upper cover plate, a manifold layer, a micro-channel layer and a lower cover plate, the manifold layer comprises an inlet, an outlet, an inlet flow equalizing cavity, an outlet flow equalizing cavity, a manifold inlet channel and a manifold outlet channel, and the micro-channel layer comprises an acceleration section, a buffer section and a micro-pin-fin porous structure. Fluid is distributed to the manifold inlet channel through the flow equalizing cavity under the action of pump work, then enters the micro-channel layer through the manifold inlet channel and takes away heat transferred by the lower cover plate in the micro-channel, and the fluid absorbing heat enters the outlet flow equalizing cavity through the manifold outlet channel. And the manifold structure shortens the flow path, so that the flow is in a development stage, and heat exchange is enhanced while the flow resistance is reduced. The acceleration section of the micro-channel layer inhibits phase change backflow, and the acceleration section and the buffer section are formed by the micro-pin-fin porous structure, so that the formation of a vaporization core is accelerated, and the stability of two-phase boiling is improved.

The invention relates to the technical field of demolding control, and provides an anti-deformation demolding control method and system for a plastic mold. The method comprises the steps that temperature sensing is conducted on a mold, and the initial temperature is obtained; traversing according to the initial temperature, determining a to-be-preheated area, and performing temperature control calculation to obtain a temperature uniformity coefficient; activating a cooling channel based on the temperature uniformity coefficient, and performing staged cooling to obtain cooling state data; demolding analysis is conducted according to the cooling data, demolding parameters are generated, dynamic association is conducted in combination with environment temperature changes, and a demolding strategy is formulated; simulating and executing a demolding strategy, performing deformation monitoring, generating feedback data, optimizing the strategy and executing anti-deformation demolding operation. The technical problem of mold deformation caused by non-uniform temperature distribution in the demolding process of the plastic mold is solved, and the technical effects of avoiding mold deformation and improving the product quality and the production efficiency by accurately controlling the temperature distribution, the cooling process and the demolding parameters are achieved.

The utility model belongs to the technical field of semiconductors, and discloses a wafer bearing device and wafer testing equipment. The wafer bearing device comprises a bearing disc, a cooling member and a heating member. One side of the bearing disc is used for bearing wafers, and the bearing disc is provided with a plurality of adsorption holes used for adsorbing and fixing the wafers; the cooling piece is fixedly arranged on the other side of the bearing disc, and a cooling flow channel allowing cooling liquid to circularly flow is defined between the cooling piece and the bearing disc; the heating member is arranged on one side, far away from the bearing disc, of the cooling member and is used for heating the wafer. When the bearing device is used, heat generated by the heating piece can be transmitted into the bearing disc only through the one-layer structure of the cooling piece during transmission, so that the temperature control precision of the bearing disc is effectively improved, and when automatic control is carried out according to an actual control program, the temperature difference amplitude of the bearing disc can be kept at + / -0.5 DEG C or even lower; therefore, the bearing disc can keep good temperature uniformity in the wafer testing process.

The utility model relates to a secondary bionic vein-shaped micro-channel cooling plate which comprises a plate body, a central main channel is arranged at the central position in the plate body, and an outlet auxiliary channel connected with the central main channel is respectively arranged at the edges of the two sides of the plate body; a plurality of first-stage bionic vein-shaped small channels are arranged between the central main channel and the two outlet auxiliary channels; and a plurality of second-stage bionic vein-shaped micro-channels are arranged on the two sides of each first-stage bionic vein-shaped small channel. Under the condition of not additionally increasing the conveying power consumption of fluid in a flow channel, the high-temperature area of a heat source center can be rapidly cooled, the temperature field in the plate body can be highly homogenized, the temperature uniformity of the cooled power battery is improved, and compared with a conventional liquid cooling plate, the cooling plate has the advantages of being simple in structure and convenient to use. And the highest temperature of the power battery and the battery tabs can be reduced, and the temperature difference between the two tabs of the battery is reduced.

The invention discloses a two-phase cold plate liquid cooling data center and a control method, and the two-phase cold plate liquid cooling data center comprises a plurality of two-phase cold plate liquid cooling cabinets, a secondary side waterway looped network, and a monitoring adjustment module. A plurality of nodes to be cooled, two-phase cold plates in contact connection with the nodes to be cooled, and an electro-hydraulic integrated distribution module, a liquid cooling heat exchange module and a system detection module which are connected with the two-phase cold plates of the nodes are arranged in the liquid cooling cabinet; the secondary side waterway looped network comprises a water supply looped network and a water return looped network which are arranged at the bottom of the data center, low-temperature fluid of the water supply looped network is connected with the liquid cooling heat exchange module through a water supply branch and performs heat exchange to become high-temperature fluid, and the high-temperature fluid is output to the water return looped network through a water return branch; the monitoring and adjusting module obtains circulating system parameters, and / or power consumption information, and / or cooling capacity information of each liquid cooling cabinet, and controls the flow of the water supply branch and the water return branch corresponding to each liquid cooling cabinet.

The invention discloses a polishing machine cooling structure multi-objective optimization method based on a heat generation model, which comprises the following steps: establishing a discrete point temperature variance calculation model in the radial direction of a polishing disk surface and a water channel volume calculation model of the polishing disk; the value range of the width of each water channel of the polishing disc, the value range of the interval width of each water channel, the value range of the number of the water channels, the value range of the interval width inside the cooling water channels, the value range of the interval width outside the cooling water channels and the value range of the depth of the water channels are used as constraint conditions; the minimum temperature variance of discrete points in the radial direction of the polishing disc surface, the maximum water channel volume of the polishing disc and the maximum thickness of the polishing disc serve as optimization targets, and the water channel width and the water channel depth of the polishing disc, the inner interval width of cooling water channels, the outer interval width of the cooling water channels, the interval width of all the water channels, the thickness of the polishing disc and the number of the water channels are optimized; and taking the optimal solution obtained by optimization as the structural parameter of the cooling water channel of the polishing disk.

The invention discloses a vein-shaped composite bionic micro-channel radiator with petal-shaped fins, relates to the technical field of radiators, and solves the problems that the temperature uniformity of a radiating area of a micro-channel radiator is poor, and extra pumping work consumption is caused. A first-stage vein flow channel is arranged in the center of a micro-channel heat sink, and a hot plate is arranged at the bottom of the micro-channel heat sink; the micro-channel heat sink comprises two first heat sinks and two second heat sinks, and the second heat sinks and the first heat sinks are in mirror symmetry. A plurality of second-level vein runners, a plurality of third-level vein runners and a plurality of fin arrays are arranged in the first heat sink, and the second-level vein runners are obliquely arranged and communicate with the first-level vein runners; the plurality of third-stage vein runners are arranged among the second-stage vein runners at equal intervals; the fin array is arranged at the tail end in the second-stage vein flow channel; the fin array comprises two fins, and the fins are arc-shaped plates. The invention has the characteristics of high heat dissipation efficiency, good temperature uniformity, low flow resistance and small pressure drop, thereby ensuring efficient and stable operation of high-power micro devices.

The utility model provides a lower electrode device and semiconductor processing equipment, the lower electrode device comprises a chuck, and a plurality of gas paths and a plurality of radio frequency introduction assemblies distributed around the center of the chuck, the chuck is used for bearing a plurality of wafers, the plurality of gas paths are used for being in one-to-one correspondence with the plurality of wafers, the gas paths are arranged on the chuck and penetrate through the thickness of the chuck, and the radio frequency introduction assemblies are arranged on the chuck. A gas outlet of the gas circuit is positioned in a corresponding wafer placing area on the chuck; the radio frequency feed-in pieces are used for being in one-to-one correspondence with a plurality of wafers, the radio frequency feed-in pieces are in conductive contact with the bottom of the chuck, and the orthographic projection of the contact position on the top surface of the chuck is located in the center of a corresponding wafer placing area borne on the chuck. Therefore, the gas medium flowing out of the gas path can be blown to the lower part of the corresponding wafer for heat exchange, the temperature distribution uniformity of the wafer is high, the distribution uniformity of the magnetic field is high, the process uniformity is greatly improved, and the product yield is high.

The invention relates to the technical field of batteries, and provides a battery protection plate integrated with combustible gas regulation and control, a preparation method thereof and a battery module, and the battery protection plate integrated with combustible gas regulation and control comprises a porous heat insulation base material; the phase change hydrogel is adsorbed in the porous structure of the porous heat insulation base material; the aerogenesis flame retardant layer is arranged on the surface of at least one side of the porous heat insulation base material; and the packaging film is arranged on the outer sides of the aerogenesis flame retardant layer and the porous heat insulation base material and is used for packaging the porous heat insulation base material and the aerogenesis flame retardant layer. The battery protection plate integrated with combustible gas regulation and control can uniformly heat under the normal working condition of the battery, so that local overheating in the battery is avoided; when the battery is in thermal runaway, the temperature of the battery can be reduced and the detonation risk can be reduced.

The present invention discloses an immersion liquid-cooled battery pack. The immersion liquid-cooled battery pack comprises: a shell, at least one battery pack is arranged in the shell, the battery pack comprises a plurality of battery cells arranged at intervals along a first direction; a liquid inlet cavity and a liquid outlet cavity are respectively arranged on both sides of the battery pack along a second direction, and the second direction is perpendicular to the first direction; a liquid inlet is arranged at one end of the two ends of the liquid inlet cavity along the first direction, and a liquid outlet is arranged at one end of the two ends of the liquid outlet cavity along the first direction which is different from the liquid inlet, so that the cooling liquid enters the liquid inlet cavity from the liquid inlet, flows into the liquid outlet cavity after passing through the battery pack, and flows out from the liquid outlet; a flow equalizing plate is arranged between the liquid inlet cavity and the battery pack, the flow equalizing plate is arranged along the first direction, a liquid through hole is arranged on the flow equalizing plate, and a plurality of guide plates arranged at intervals along the second direction are arranged at the liquid through hole. The present invention provides an immersion liquid-cooled battery pack with high heating / cooling efficiency, good uniformity and simple structure.

The invention belongs to the technical field of heating furnaces, and particularly relates to an oxygen-enriched combustion system and method for a coal gas single heat storage type heating furnace. Comprising an oxygen pressure regulating branch, a first heating section oxygen lance oxygen injection branch and a main pipe oxygen enrichment branch, the oxygen pressure regulating branch is provided with a pressure transmitter and a temperature transmitter, an oxygen source is communicated with the pressure transmitter and the temperature transmitter through a pipeline, and oxygen flows into the first heating section oxygen lance oxygen injection branch and the main pipe oxygen enrichment branch after being subjected to pressure regulation through a pressure valve. A flow control valve is arranged on the first heating section oxygen lance oxygen injection branch, oxygen is fed into the heating furnace, and the main pipe oxygen enrichment branch feeds enriched oxygen into the main pipe through an enriched oxygen distributor. Flexible switching of different oxygen enrichment modes of the heating furnace is achieved, the burner in the oxygen lance oxygen injection branch of the first heating section is not reversed, total-oxygen combustion of the burner is achieved, under the oxygen enrichment branch of the main pipe, oxygen is conveyed to the main pipe through the oxygen enrichment distributor through the other branch to be mixed with combustion air, and total-furnace oxygen enrichment combustion is achieved.

The invention relates to the technical field of spinning forming, in particular to a current-assisted spinning forming device and method.The current-assisted spinning forming device comprises a core mold switching disc arranged on a machine tool, a core mold insulating base plate is fixed to the core mold switching disc, and a core mold penetrating through the core mold insulating base plate and connected with a main shaft of the machine tool is rotationally installed on the core mold switching disc; the clamping assembly is arranged on the machine tool, and a metal blank abutting against the core mold abuts against the clamping assembly; the workpiece forming assembly is arranged on the machine tool and used for machining the metal blank; the current applying mechanism is arranged on the workpiece forming assembly, and the workpiece forming assembly can drive the current applying mechanism to move to the position matched with the metal blank so as to heat the metal blank. And the pulse current is introduced into the spinning plastic deformation area.

A flattened temperature reactor core structure comprises a fuel assembly, and the fuel assembly comprises a base body, a fuel rod and a heat pipe. Wherein a plurality of mounting holes extending in the axial direction of the base body are formed in the axial section of the base body, the mounting holes are arranged in multiple parallel columns in the first direction, the mounting holes in the second direction forming a 60-degree included angle with the first direction are also arranged in columns, and the mounting holes arranged along the edge of the base body have the same minimum distance with the edge. Two fuel rods are arranged between every two heat pipes in the first direction and the second direction; and in the fuel rods arranged along the edge of the base body, one of two adjacent fuel rods is replaced by a vacant position. And the plurality of fuel assemblies are densely laid to form a reactor core structure. According to the reactor core structure, temperature flattening can be effectively achieved, local overheating is avoided, and therefore the efficiency and reliability of the heat pipe micro-reactor are improved. The invention also provides a heat pipe micro-stack.

The utility model discloses a reflector lamp holder, a wafer heating assembly and epitaxial growth equipment. The wafer heating assembly comprises a reflector lamp holder, a wafer heating element and a wafer heating element, a lamp holder body of the reflecting lamp holder is divided into at least two areas in the circumferential direction. A first reflection groove, a second reflection groove,... an ith reflection groove are formed in each area along the radial direction of the lamp holder body from the edge to the center of the lamp holder body; the shapes of the cross sections of the i reflection grooves in the adjacent areas are different, and the i reflection grooves in the adjacent areas are arranged in a staggered manner; and at least one heating lamp is arranged in each reflecting groove. According to the utility model, the reflection direction of each i-th reflection groove to infrared heat radiation is adjusted, the transmission path of the infrared heat radiation is accurately controlled, the temperatures of different positions on the surface of the wafer are further adjusted, and the temperature uniformity of the surface of the wafer is improved.

The invention relates to the technical field of electric heating materials, in particular to a temperature-controllable electric heating compound and a preparation method thereof. The invention provides a temperature-controllable electric heating compound which comprises a composite heating layer, a packaging insulating layer and a copper foil electrode clamped between the composite heating layer and the packaging insulating layer, a matrix insulating layer is arranged below the composite heating layer, and a series of regularly arranged circular holes are formed in the composite heating layer; and the packaging insulating layer packages the copper foil electrode and the composite heating layer on the substrate insulating layer. The composite heating layer is provided with a series of regularly arranged circular holes, so that the temperature distribution is more uniform, and the accuracy of temperature control can be improved. The supporting performance, the fatigue resistance and the bending resistance are achieved, and the risk of electric breakdown is reduced. Therefore, the method has a wide market application prospect. Meanwhile, the invention further provides a preparation method of the temperature-controllable electric heating compound, and the preparation method is simple in step, convenient to operate and suitable for large-scale industrial production.

The invention provides a temperature control system for a radiation calibration device of an ultra-large-diameter infrared camera. The temperature control system comprises a meter-scale surface source blackbody radiation source, a temperature acquisition and control system, a heating plate group, a programmable power supply group, a low-temperature electromagnetic valve group, a liquid nitrogen supply system and an embedded control system, the temperature collection and control system collects the temperature of a radiation surface in real time through a temperature sensor and transmits the temperature to the control system, the temperature is compared with the set temperature, PID control is adopted, the refrigeration power and the heating power are controlled through two paths of output respectively, and the blackbody radiation source liquid nitrogen pipeline controls the meter-scale surface source blackbody radiation source through a plurality of low-temperature linear electromagnetic valves. The black body radiation source area is refrigerated; the programmable power pack controls the heating plate group to heat the blackbody radiation source area; the embedded control system realizes input and output of data, realization of a control strategy and remote transmission and communication of the data. The system can perform high-precision control and rapid measurement on the temperature of the black body, and improves the uniformity and stability of the meter-scale surface source black body.

The utility model discloses a liquid cooling plate, and relates to the technical field of liquid cooling, the liquid cooling plate comprises a plate-shaped body, a cooling flow channel structure is arranged in the plate-shaped body, and the cooling flow channel structure comprises a flow channel inlet, a flow channel outlet and at least one cooling flow channel communicated between the flow channel inlet and the flow channel outlet; the cooling flow channel comprises a heat exchange flow dividing section with at least one stage of flow dividing branch channel, a heat exchange concentration section with a plurality of heat exchange flow channels and a heat exchange flow gathering section with at least one stage of flow gathering branch channel, and the heat exchange flow dividing section, the heat exchange concentration section and the heat exchange flow gathering section are sequentially arranged in a communicating mode in the flowing direction of a cooling medium in the cooling flow channel. The at least one stage of shunting branch channel can uniformly distribute a cooling medium flowing into the cooling flow channel into the plurality of heat exchange flow channels, and the at least one stage of converging branch channel can converge the cooling medium in the plurality of heat exchange flow channels to flow out of the cooling flow channel. Thus, on the basis that the heat dissipation requirements of the front-end low-heat area and the rear-end low-heat area are met, efficient heat exchange of the high-heat area is achieved, and the heat dissipation effect, energy conservation and consumption reduction are both considered.

According to the system for machining the micro-hemispherical harmonic oscillator based on the carbon dioxide laser, the glass substrate is heated and softened through the carbon dioxide laser, and the energy utilization rate is higher. The horizontal displacement table drives the forming mold to move until the center coincides with the center of a laser spot, so that the positioning accuracy of a processing area is ensured; the diameter of the laser beam is adjusted through the beam expander, it is guaranteed that the diameter of a laser spot is larger than that of the to-be-machined micro-hemispherical harmonic oscillator, and the accuracy of a machining area is guaranteed. The forming mold and the glass substrate are driven to rotate through the rotating table, so that heat distribution of a processing area is relatively balanced, the size deviation of the micro-hemispherical harmonic oscillator caused by unbalanced heat distribution is avoided, and the processing quality of the micro-hemispherical harmonic oscillator is improved. Compared with a traditional method for softening the glass substrate through flame heating, all technological parameters in the machining process can be accurately controlled, the method has the advantages of being easy to operate and high in automation integration degree, and the micro-hemispherical harmonic oscillators high in forming precision and good in batch consistency can be machined.

The invention discloses a refrigerator temperature equalization method and system based on dynamic wind speed control, and relates to the technical field of refrigerator temperature equalization, and the method comprises the following steps: monitoring the standard temperature of each region under the optimal operation state of a refrigerator, and obtaining the temperature equalization data of the refrigerator; acquiring load temperature influence data and fan processing influence data which influence the temperature equalization of the refrigerator; carrying out machine learning on the load temperature influence data and the fan processing influence data to obtain a temperature change suitable model; and controlling the output wind speed and output stop of the fan according to the output of the temperature change suitable model in combination with the temperature uniformity data. According to the invention, the wind speed is accurately controlled, so that the problem that the temperature nonuniformity is influenced by over-high or over-low regulation of the wind speed is solved.

The invention belongs to the technical field of heat exchange of electronic equipment, and discloses a manifold micro-channel type radiator and a heat dissipation method.The manifold micro-channel type radiator comprises a plurality of radiator modules arranged in a linear array, and each radiator module comprises two symmetrically-arranged heat dissipation units; the heat dissipation unit comprises a manifold distributor and a micro-channel; a cold side manifold channel and a hot side manifold channel are processed on the manifold distributor; the cold side manifold channel is of a channel structure which is reduced in the flowing-in direction of a coolant, and the hot side manifold channel is a uniform-section channel; the width of the hot side manifold channel is greater than the width of the inlet end of the cold side manifold channel; the micro-channel comprises a micro-channel substrate and a micro-channel main body arranged on the micro-channel substrate; the micro-channel main body comprises a cold side micro-channel area and a hot side micro-channel area; the hot side micro-channel area comprises a plurality of hot side micro-channels which are arranged in parallel, and each hot side micro-channel is provided with a plurality of pin fins which are linearly distributed; the purpose of effectively utilizing the cooling potential of the hot side manifold channel is achieved.

The utility model discloses a plug-in frame type battery pack which comprises a group of battery cells arranged side by side, and main air ducts are arranged on polar column surfaces at the two ends of the battery cells and the upper and lower side surfaces of a battery; the battery cell shell is composed of a front end plate, a rear end plate, side cover plates on the left side and the right side, a top cover plate and a bottom cover plate, a battery cell mounting cavity is defined by the front end plate, the rear end plate, the side cover plates on the left side and the right side, the top cover plate and the bottom cover plate, and a group of battery cells arranged side by side are mounted in the battery cell mounting cavity; and the liquid cooling plate is fixedly arranged between the battery cell and the bottom cover plate and is used for carrying out bottom water-cooling heat dissipation on the battery cell. According to the plug-in frame type battery pack provided by the utility model, two thermal management modes of liquid cooling and air cooling are integrated, heat dissipation modes are allowed to be flexibly switched according to environments, the heat dissipation efficiency of the battery is optimized, and the service life of the battery is prolonged. And through the precisely designed protective shell, the production cost and the maintenance complexity are reduced, and the stability and the safety of the system are improved.

The utility model provides a tray assembly, a bearing device and semiconductor process equipment. The tray assembly comprises a tray and a pressing ring. The compression ring covers the tray, the orthographic projection of the compression ring on the top surface of the tray coincides with the circumferential edge area of the top surface of the tray, and the inner circumferential surface of the compression ring and the upper surface of the tray jointly define a mounting space; a plurality of supporting convex parts are convexly arranged on the upper surface of the tray, all the supporting convex parts are arranged in the mounting space, all the supporting convex parts are arranged in at least one circle on the upper surface of the tray, the center of each circle of supporting convex part is located on the central axis of the pressing ring, and at least one circle of supporting convex part is used for supporting a wafer; and each supporting convex part is configured to be a cambered surface in contact with the wafer. When semiconductor process equipment adopts the tray assembly provided by the utility model, the heating modes of the central area and the edge area of the wafer are consistent in the buckling deformation process of the wafer, and the temperature uniformity of the surface of the wafer is effectively improved, so that the uniformity of a film is improved.