221results about How to "Improve thermal uniformity" patented technology

A wafer holder is provided having high rigidity and an enhanced heat-insulating effect that allow positional accuracy and heating uniformity to be improved, a chip to be rapidly heated and cooled, and the manufacturing cost to be reduced, and a wafer prober apparatus on which the wafer holder is mounted. The wafer holder of the present invention includes a chuck top for mounting a wafer, a support member for supporting the chuck top, and a stand for supporting the support member. The chuck top has a thermal conductivity K1 and a Young's modulus Y1; the support member has a thermal conductivity K2 and a Young's modulus Y2; and the stand has a thermal conductivity K3 and a Young's modulus Y3. K1>K2 and K1>K3; and Y3>Y1 and Y3>Y2.

A microwave heating device and a method for heating a load using microwaves are provided. The microwave heating device comprises a cavity adapted to receive a load and at least two microwave sources for feeding microwave energy into the cavity through at least two feeding ports respectively. The microwave heating device further comprises at least two field sensors adapted to measure field strengths of the microwave energy in the cavity. A first field sensor is arranged at a first location for measuring the field strength representative of a mode fed from a first feeding port and a second field sensor is arranged at a second location for measuring the field strength representative of a mode fed from a second feeding port. The microwave heating device further comprises a control unit connected to the microwave sources and the field sensors for regulating the microwave sources based on the measured field strengths. The present invention is advantageous in that it enables uniform heating of the load in the cavity.

A member 10 for a semiconductor manufacturing apparatus includes an electrostatic chuck 20, a cooling unit 40, a spacer (an O-ring 44, an outer periphery spacer 58, or the like) for securing a gap 48 placed between the electrostatic chuck 20 and the cooling unit 40, and a clamp ring 50 placed on the upper surface of the outer periphery of the electrostatic chuck 20. The clamp ring 50 is fastened to the cooling unit 40 with screws 60. The screws 60 are inserted into coil springs 66 that prevent loosening, and are fastened to nuts 68. The coil springs 66 are attached not to the clamp ring side but to the cooling unit side.

Methods and apparatus for providing an improved azimuthal thermal uniformity of a substrate are provided herein. In some embodiments, a substrate support for use in a semiconductor process chamber includes a susceptor plate; and a supporting member to support a backside of the susceptor plate proximate an outer edge thereof, wherein the supporting member substantially covers the backside of the susceptor plate. In some embodiments, the substrate support is disposed in a process chamber having at least some lamps disposed below the supporting member and utilized for heating the back side of the susceptor plate.

Method and apparatus are disclosed to utilize the energy in biomass (waste agricultural products). The inventive method and apparatus utilized heat and mass flow to efficiently generate a variety of products from biomass. In various embodiment, the invention may generate a liquid fuel (such as methanol or dimethyl ether), pure liquid CO2 (intended for CO2 sequestration), a soil enhancement product (intended to return to the agricultural site), process heat, and/or electricity. In one embodiment, the process requires no external energy inputs, and preserves a large percentage (ie. >50%) of the energy contained in the biomass. In another embodiment, the inventive method and apparatus can selectively be operated to produce electricity and or liquid fuels.

An electrostatic chuck heater 20 includes an electrostatic chuck 22, a sheet heater 30, and a support pedestal 60. The electrostatic chuck 22 is obtained by embedding an electrostatic electrode 24 in a ceramic sintered body 26. The sheet heater 30 is a resin sheet 32 having a plurality of correction heater electrodes 34 and a plurality of base heater electrodes 44. A first surface of the sheet heater 30 is resin-bonded to the electrostatic chuck 22, and a second surface of the sheet heater 30 is resin-bonded to the support pedestal 60 made of metal.

An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

The invention provides an inner-wall non-sectional type high-temperature thermal test device of a large high-speed aircraft round-shell structure. The device comprises an L-shaped electrode support, an annular flat copper bracket, a quartz burner, an electrode, a metal pressing piece, a water-cooling copper tube, a large high-speed aircraft round-shell structure, an annular ceramic locating rack and a round locating hole. The device can achieve a non-sectional type high-temperature thermal test for a 2-m large high-speed aircraft inner cabin structure, prevents wave-shaped peak-valley variation of a large elastomer temperature field caused by a sectional splicing heating mode, improves the temperature uniformity, reality and safe reliability of the large elastomer temperature test, and provides an important means for researching high-temperature characteristic and heat-insulation performance of the large high-speed aircraft inner cabin structure.

The invention discloses a microwave resonant atomizer (2) for an electronic cigarette. The microwave resonant atomizer comprises an oil storage unit (21), an atomizing unit (22), an upper cover plate(23) and a suction nozzle (24), wherein a microwave resonant cavity (221) is formed in the internal space of the atomizing unit (22); and a coupling hole (225) is formed in the side wall of the microwave resonant cavity (221), and the outer side wall of the microwave resonant cavity (221) with the coupling hole (225) can be covered with an energy coupling (224). When being applied to the electronic cigarette, the microwave resonant atomizer has the advantages that instant heating is realized, the efficiency is high, heat uniformity is good, non-contact atomization is realized, the low temperature sterilization of tobacco tar can be realized, and the like.

A thin film heater includes at least two open regions formed along each of two spaced-apart edges of the thin film material, which edges are parallel to two spaced-apart edges of the underlying substrate. The open regions expose areas of underlying substrate. When electrical power is coupled to the two spaced-apart edges of the thin film material, uniformity of the heat generated across the thin film material is enhanced. The substrate may be planar or curved, and the open regions in the thin film material may be removed from deposited thin film material, or may be formed by preventing deposition of thin film material in such regions.

A method for fabricating a semiconductor device including: a step of forming a first film on a substrate; and a step of performing a thermal process by scanning the first film with a flame of a gas burner using a hydrogen and oxygen gas mixture as a fuel, wherein the flame of the gas burner is approximately linear.

The invention relates to a biochemical instrument, and provides a constant temperature metal bath, which comprises a base, a warming and cooling part and a radiating part, and also comprises a heat-conducting fin used for heat exchange, wherein the upper and lower surfaces of the heat-conducting fin are attached to the base and the warming and cooling part; and the coefficient of heat conduction K of the heat-conducting fin is more than 237W/m.K. A layer of heat-conducting fin is arranged between the base and the warming and cooling part, and thermal interface materials are coated on contact surfaces among the base, the heat-conducing fin, the warming and cooling part and the radiating part, and the heat conducting uniformity is enhanced; a thermal insulation gasket is arranged between the base and the heat-conducing fin, and the thermal insulation function of the base is enhanced; an exhaust fan is moved to the bottom, and the number of the exhaust fans is increased, so that the warming and cooling efficiency is improved; and an anti-condensation device and a gasket are arranged above the base, and a lantern ring is arranged at the periphery of the base, so that the usability of the constant temperature metal bath is improved.

The invention discloses a thermal wind speed sensor encapsulated based on a carbon nanotube array, comprising a silicon substrate, four temperature measurers, a heating element, a copper film layer, a carbon nanotube layer, a nickel film layer and a thermal insulating medium layer. The top surface of the silicon substrate is connected with the bottom surface of the copper film layer, the top surface of the copper film layer is connected with the bottom surface of the carbon nanotube layer, and the top surface of the carbon nanotube layer is connected with the bottom surface of the nickel film layer; the heating element and the four temperature measurers are embedded on the bottom surface of the silicon substrate respectively, the four temperature measurers are uniformly distributed at the periphery of the heating element, and an annular thermal isolation groove is arranged between the heating element and the temperature measurers, and the distance from the top surface of the thermal isolation groove to the top surface of the silicon substrate is smaller than 50 nanometers; and the thermal insulating medium layer is covered on the outer surface of the silicon substrate, the carbon nanotube layer is formed by carbon nanotubes which are arranged in arrays, and each carbon nanotube is vertically arranged. The thermal wind speed sensor of the structure can reduce the influence of the transverse heat conduction of the silicon substrate, and the flexibility of the sensor is improved.

The object of the present invention is to provide a ceramic substrate that can provide a substantially uniform temperature distribution to a surface of the ceramic substrate where a semiconductor wafer is treated. A ceramic substrate for a semiconductor-producing/examining device according to the present invention is a ceramic substrate having a conductor formed on a surface of the ceramic substrate or inside the ceramic substrate, wherein said substrate is containing oxygen and having a disc form, the diameter thereof exceeding 250 mm and a thickness thereof being 25 mm or less.

A holder for semiconductor manufacturing equipment is provided, in which electrical leakage and sparks do not occur across the electrode terminals and lead wires to supply power to a resistive heating element embedded in a holder, and the thermal uniformity in the holder is within ±1.0%.

The holder for semiconductor manufacturing equipment, that is provided in a chamber to which reactive gas is supplied, comprises a ceramic holder 1 which holds a treated material 10 on a surface thereof and is provided with a resistive heating element 2 for heating the material to be treated, and a support member 6 one end of which supports the ceramic holder 1 at a position other than the surface holding the material to be treated, and the other end of which is fixed to the chamber. Electrode terminals 3 and lead wires 4 of the resistive heating element 2 provided at a portion other than the surface of the ceramic holder 1 holding the material to be treated are housed within an insulating tube 5 in the holder 1 for the semiconductor manufacturing equipment.

An apparatus for a substrate support heater and associated chamber components having reduced energy losses are provided. In one embodiment, a substrate support heater is provided. The substrate support heater includes a heater body having a first surface to receive a substrate and a second surface opposing the first surface, a heating element disposed in the heater body between the first surface and the second surface, and a thermal barrier disposed on the second surface of the heater body, wherein the thermal barrier comprises a first layer and a second layer disposed on the first layer.

A high efficiency fuel cell system comprising a topping fuel cell assembly comprising a topping cathode portion and a topping anode portion; and a bottoming fuel cell assembly comprising a bottoming cathode portion and a bottoming anode portion, wherein the bottoming anode portion receives anode exhaust output from the topping anode portion and the topping cathode portion receives cathode exhaust from the bottoming cathode portion, and wherein the topping fuel cell assembly has a greater number of fuel cells than the bottoming fuel cell assembly so that the topping fuel cell assembly utilizes more fuel than the bottoming fuel cell assembly.

The present invention relates to a method for treating a feed corresponding to a pyrolysis gasoline, comprising:

• • a) at least one stage of selective hydrogenation of the feed, referred to as HD1,
  • b) fractionating in one or more distillation columns the effluent from stage a) in order to produce at least one light C5 cut, an intermediate C6 or C6-C7 or C6-C8 cut intended for aromatics production, a heavy C7+ or C8+ or C9+ cut intended for gasoline production,
  • c) at least one stage of hydrodesulfurization and deep hydrogenation of the intermediate cut, referred to as HD2,
  • d) at least one stage of alkylation of the heavy C7+, C8+ or C9+ cut consisting of a treatment on an acid catalyst allowing weighting of the sulfur compounds,
  • e) at least one stage of distillation of the effluent from stage d), intended to produce a light fraction that can be directly used as a low-sulfur gasoline base, and a heavy C11+ or C12+ fraction rich in sulfur compounds, used as middle distillate or fuel oil.

A device for making particulate analyte molecules comprising a nebulizer producing a plume of liquid droplets, a vessel having a chamber to receive the plume in which the chamber has a nebulization section, a desolvation section. The nebulization section is cooled to form a condensed waste from a portion of said plume. The desolvation section is heated to form solvent gas molecules and particulate analyte molecules.

The invention provides a multifunctional heating plate used at the bottom of a 3D printer. The heating plate comprises a metal support plate, an insulating plate, a metal ceramic heating plate, a high-temperature resisting heat conducting film and a high-temperature glass plate. According to the heating bottom plate of the 3D printer, the metal ceramic heating plate serves as a heating material, edge warping of a printed object can be effectively prevented, the printing quality is improved, and damage of the heating bottom plate when the 3D printer breaks down can be effectively avoided. A temperature sensor can accurately feed back the actual temperature of the heating bottom plate of the 3D printer to a control circuit of the 3D printer in time. Due to the insulating plate, heat losses can be effectively reduced, and the temperature of the heating bottom plate is more stable and uniform. Due to the high-temperature resisting heat conducting film, heat on the metal ceramic plate can be transmitted to the high-temperature glass plate more effectively and evenly. The adhesion force of the high-temperature glass plate to plastic materials is high, the trouble of replacing high-temperature double-sided adhesive tape is saved, and the printed object can be easily separated from the 3D printer.

A backlight module includes a light guide plate, a back plate, a heat-dissipating element, a light-emitting element, and at least one high-performance heat sink. The heat-dissipating element is disposed adjacent to a light incident surface of the light guide plate, and the heat-dissipating element has a bottom portion and a side portion forming an angle with the bottom portion. The light-emitting element is disposed on one side of the heat-dissipating element facing the light guide plate. The high-performance heat sink is disposed on the back plate, one end of the high-performance heat sink overlaps the heat-dissipating element, and another end of the high-performance heat sink extends away from the light-emitting element.