1008results about How to "Reduce uniformity" patented technology

A plasma CVD apparatus for forming a thin film on a wafer having diameter Dw and thickness Tw, includes: a vacuum chamber; a shower plate; a top plate; a top mask portion for covering a top surface peripheral portion of the wafer; and a side mask portion for covering a side surface portion of the wafer. The side mask portion has an inner diameter of Dw+α, and the top mask portion is disposed at a clearance of Tw+β between a bottom surface of the top mask portion and a wafer-supporting surface of the top plate, wherein α is more than zero, and β is more than zero.

After a mask is carried into a reserve room for temporarily storing before carrying into a mask room filled with specific gas that has an impurity concentration lower than a first concentration (e.g. 1 ppb) and that has a characteristic of absorbing little exposure light, gas-replacement mechanisms replace gas in the reserve room with specific gas having an oxygen concentration not lower than the first concentration. Therefore, when subsequently carrying the mask into the mask room, impurities from the outside (including absorbent gas) can be substantially prevented from getting into the optical path inside the mask room. When replacing a wafer, gas in a reserve room is also replaced in the same way as the above.

A filter element having multiple formed layers of filtration media is disclosed. The media are layered so as to form a pore size gradient. The filter element is capable of removing both solid and liquid particulates from a moving fluid stream. The filter element has high strength and compressibility. The layers can be supported on a porous or perforate support to provide mechanical stability during filtering operations. The filtration media layers can be formed into various filter element forms such as panels, cartridges, inserts, and the like.

A plurality of LEDs are provided to an outer edge side of a center position of one main surface of an LED substrate main body in a deviated manner respectively. The wiring part including the connector receiving part and the wiring hole are provided at a position that overlaps the center position of the one main surface side of the LED substrate main body. Since the power feeding part is inserted into the wiring hole, the connection part and the connector receiving part can be easily connected and therefore it becomes possible to ensure ease in assembly. Since the connector receiving part is kept away from each of the LEDs with substantially equal distance so that emitted light is hardly blocked, decrease in uniformity of light distribution can be suppressed.

The invention belongs to the field of titanium-based alloys, and particularly relates to a novel heat-resisting titanium alloy and a processing and manufacturing method and application thereof. The processing and manufacturing method comprises the composition elements of alloy components, smelting, heat processing, heat treatment and the like, wherein the alloy components are as follows (in percentage by weight): 5.4%-6.3% of Al, 3.0%-5.0% of Sn, 2.5%-6.4% of Zr, 0.0%-0.96% of Mo, 0.25%-0.5% of Si, 0.2%-0.5% of Nb, 0.3%-3.4% of Ta, 0.2%-1.6% of W, 0.0%-0.07% of C, less than or equal to 0.17% of O, less than or equal to 0.03% of Fe and the balance of Ti and inevitable impurity elements. The novel heat-resisting titanium alloy disclosed by the invention can obtain different matching of tensile strength, plasticity, permanence, creep strength and heat stability through the combination of different heat processing process and heat treatment processes, can be used for manufacturing parts, namely blades, coil assemblies and the like which are positioned on the high-temperature parts of an advanced aircraft engine, is used for a long time within a range of 600-650 DEG C, can also be used for manufacturing high temperature-resistant structural members, namely aerospace craft skin and the like, is used for a short time at about 700 DEG C and can be used as a material and the like used for high temperature-resistant corrosion-resistant valves of an automobile and a boiler.

A film forming apparatus for forming a film on an object includes: a processing container; gas supply means, having gas jet ports, respectively; a holding means for holding the object; a drive mechanism for moving the holding means relative to the gas jet ports; and a control means which, when repeating P times a cycle, consisting of a supply period for supplying a gas and a supply stop period during which the supply of the gas is stopped, performs control so that as viewed from the center of the object, a gas supply starting position is sequentially shifted in the circumferential direction of the object for every cycle in such a manner that the entire circumference of the object to be processed is divided into K segments (K=P), K being an arbitrary division number, and the gas supply starting position is shifted by one segment for every cycle.

A shower head structure characterized by comprising a shower head section, opposed to the upper surface of a mounting table in an evacuable treating vessel, for injecting a processing gas into the treating vessel; a temperature observation through-hole which opens in the lower surface of the shower head so as to be opposed to the upper surface of the mounting table, a transparent observation window which hermetically seals the upper end of the temperature observation through-hole, a radiation thermometer disposed on the upper surface of the transparent observation window, an adhesion preventive gas supply path communicating with the temperature observation through-hole to prevent a film from adhering to the transparent observation window, wherein the adhesion preventive gas supply path communicates with the temperature observation through-hole through an injection nozzle for injecting the adhesion preventive gas to the transparent observation window.

The invention relates to an independent feathering control system and a control method for a wind driven generating set, wherein the control system comprises a sampling module, a control module and a driving module. A feathering motor in the driving module is connected with the blades of the wind driven generating set through a speed reducer. The sampling module is used to acquire the signals such as the wind driven generating set power, the boss rotating speed, the impeller position, the feathering angle, the paddle vibration, and the like, and to respectively send the acquired signals to the control module. The control module comprises a wind machine power controller for processing the wind driven generating set power signal and the boss rotating speed signal, a periodic unbalanced load compensation controller for processing the impeller position signal, the wind machine power signal and the boss rotating speed signal, a transient state impact load compensation controller for processing the feathering angle signal, the paddle vibration signal, the impeller position signal, the wind machine power signal and the boss rotating speed signal, and an output coupler for processing the signals outputted from the three controllers and comprehensively outputting the signals to the driving module.

Proposed is a Cu—Mn alloy sputtering target, wherein the Mn content is 0.05 to 20 wt %, the total amount of Be, B, Mg, Al, Si, Ca, Ba, La, and Ce is 500 wtppm or less, and the remainder is Cu and unavoidable impurities. Specifically, provided are a copper alloy wiring for semiconductor application, a sputtering target for forming this wiring, and a manufacturing method of a copper alloy wiring for semiconductor application. The copper alloy wiring itself for semiconductor application is equipped with a self-diffusion suppression function for effectively preventing the contamination around the wiring caused by the diffusion of active Cu, improving electromigration (EM) resistance, corrosion resistance and the like, enabling and facilitating the arbitrary formation of a barrier layer, and simplifying the deposition process of the copper alloy wiring for semiconductor application.

The invention provides a method for preparing a ceramic particle enhanced metal matrix composite coating in a laser cladding mode through an asynchronous powder feeding method. A lateral powder feeding nozzle is fixed to one coaxial powder feeding nozzle and assembled into an asynchronous powder feeding nozzle; the lateral powder feeding nozzle is used for feeding ceramic particle enhancing phases into the portion between the middle portion and the tail portion of the side, opposite to the laser scanning direction, of a molten pool; the coaxial powder feeding nozzles are used for feeding alloy powder or metal ceramic composite powder to the center of the molten pool; a laser device is used for conducting laser cladding, and then the ceramic particle enhanced metal matrix composite coating is obtained. According to the method, the coaxial powder feeding method and the lateral powder feeding method are combined, the ceramic particle enhancing phases are fed into the low-temperature region at the rear portion of the molten pool, so that the phenomena of nonuniformity of melting decomposition, clustering and distribution of the ceramic particle enhancing phases are reduced, and the ceramic particle enhancing phases are evenly distributed in the whole coating by keeping the original appearance to the maximum extent; accordingly, the ceramic particle enhancing phases are effectively retained and evenly distributed, and the performance of the composite coating can be substantially improved.

A display includes a pixel circuit. The pixel circuit includes a light emitting diode, a first transistor, a second transistor and a third transistor. The first transistor includes a first semiconductor layer. The first transistor has a first control terminal, a second terminal, and a third terminal electrically connected to the light emitting diode. The second transistor includes a second semiconductor layer, and is electrically connected to the third terminal. The third transistor is electrically connected to the first control terminal. A material of the first semiconductor layer is different from a material of the second semiconductor layer.

An array substrate includes a base substrate including a display area and a peripheral area adjacent to the display area, a gate line extending in a first direction, a data line extending in a second direction crossing the gate line, a switching element electrically connected to the gate and data lines, a color filter pattern and a dummy color pattern in the display and peripheral areas, respectively, a pixel electrode on the color filter pattern, and a light blocking pattern including a black matrix pattern partially overlapping the color filter pattern and a black boundary pattern overlapping the dummy color pattern. The black boundary pattern covers the peripheral area and includes a first portion which overlaps the dummy color pattern and a second portion which does not overlap the dummy color pattern. A cross-sectional thickness of the first portion is smaller than that of the second portion.

Presented are methods for reducing energy consumption by coating external vertical walls of a building with a wall paint comprising reflective metal oxide pigments. Methods for painting external vertical walls as well as compositions comprising base paint combined with reflective metal oxide pigments are also presented.

A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.

Disclosed is a power storage device including a negative electrode and a positive electrode. The negative electrode includes a negative electrode current collector including a common portion and a plurality of protrusions protruding from the common portion, and a negative electrode active material layer which covers a side surface of the protrusion. The positive electrode faces the negative electrode with an electrolyte provided therebetween. In the plurality of protrusions, a distance between adjacent protrusions is a distance with which adjacent negative electrode active material layers are in contact with each other before the capacity of the negative electrode active material layer reaches the theoretical capacity of the negative electrode active material layer by insertion of carrier ions from the positive electrode.

The invention discloses a backlight module and a display device. The backlight module comprises a light source module, a framework, a fixing part and an elastic element. The light source module comprises a circuit board provided with a first fixing hole and an LED; the side wall of the framework is provided with a second fixing hole; the fixing part comprises a first part, a second part and a third part, and the first part is in a thread structure; and the elastic element is arranged between the side wall and the circuit board. The first part penetrates through the second fixing hole to be locked and fixed with the first fixing hole, and the second part is movably positioned in the second fixing hole. When light source module is pressed to compress the elastic element, the light source module moves towards a first direction facing the side wall, and the second part moves towards the first direction along the second fixing hole; and when the elastic element recovers, the light source module moves towards a second direction far away from the side wall, and the second part moves towards the second direction along the second fixing hole. The elastic element of the light source module ensures that the light source module can move relative to the framework and can prevent the LED from being damaged by pressing.

A polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption and providing high polishing rate includes a polishing layer of a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol, (2) an isocyanate-terminated prepolymer (B) that includes a polymerized diisocyanate and a polyethylene glycol with a number average molecular weight of 200 to 1,000, and (3) a chain extender.

There is provided a technique for securing a large examination space in a tunnel type MRI device without inviting increase of manufacturing cost and without significantly reducing irradiation efficiency or uniformity of the irradiation intensity distribution in an imaging region. Between rungs of a partially cylindrical RF coil, which coil corresponds to a cylindrical RF coil of which part is removed, there are disposed half-loops generating magnetic fields, which are synthesized with magnetic fields generated by loops constituted by adjacent rungs of the partially cylindrical RF coil and rings connecting the rungs to generate a circularly polarized or elliptically polarized magnetic field. Further, high-frequency signals of the same reference frequency having a desired amplitude ratio and phase difference are supplied to the partially cylindrical RF coils and half-loops.

A positive photosensitive composition comprises: (A) an acid generator capable of generating an acid upon irradiation with one of an actinic ray and a radiation; and (B) a resin having a monocyclic or polycyclic alicyclic hydrocarbon structure and capable of decomposing by the action of an acid to increase the solubility in an alkali developer, wherein the acid generator (A) comprises at least two compounds of a sulfonium salt compound not having an aromatic ring, a triarylsulfonium salt compound, and a compound having a phenacylsulfonium salt structure.