Cleaning agent for integrated circuit substrate silicon chip and its cleaning method

Abstract

The cleaning agent for integrated circuit substrate silicon chip features that it consists of organic base functioning as pH regulator, complexing agent, corrosion inhibitor, dispersant and oxidizing assistant simultaneously in 40-45 %, surfactant functioning to lower surface tension of the solution, enhance mass transfer and eliminate metal ion simultaneously in 7-15 %, and water in 40-53 %. The cleaning method with the cleaning agent includes adding deionized water in 8-15 times, twice ultrasonic cleaning at 50-60deg.c for 5-10 min each, twice ultrasonic rinsing in deionized water at 50-60deg.c for 5-10 min each, sprinkling and stoving. The present invention has the advantages of excellent cleaning effect, simple preparation process, convenient operation and environment friendship.

Description

(1) Technical field:

[0001] The invention relates to a cleaning agent, in particular to a cleaning agent for silicon chips of integrated circuit substrates and a cleaning method thereof. (two) background technology:

[0002] With the development of microelectronics technology, the integration level of ULSI is rapidly increasing, and the feature size of devices is continuously decreasing, and the requirements for chip surface contamination are more stringent. In the VLSI fabrication process, the surface state and cleanliness of the chip are one of the most important factors affecting the quality and reliability of the device. The effects of pollutants on semiconductor devices are complex and also depend on the nature and quantity of the pollutants themselves. Particle contamination during packaging and masking operations is one of the most common types of contamination. For example, the adsorbate on the surface of the microelectronic device substrate forms a nail model duri...

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