Water-based cutting fluid used in slice machining of hard brittle crystal material and preparation method of water-based cutting fluid

Abstract

The invention discloses a water-based cutting fluid used in slice machining of a hard brittle crystal material, comprising the following compositions: base oil, organic amine, organic acid, synthetic ester, emulsifier, rust and corrosion inhibitor, dispersion flocculation and hard-water resisting agent, antiseptic bactericide, antifoaming agent, coupling agent, adjuvant and a proper amount of water. Aiming at the machining techniques of inner circle slicing and outer circle slicing, the water-based cutting fluid has good generality, lubricity, strong antirust property and a long service life; when the cutting fluid is used, the machining situation can be observed easily, the cooling property is good, the cleaning and the permeability are strong, cuttings subside easily, and the machining problems of machining error, crack and the like caused by cutter blocking, abrasion and the like are solved; according to the invention, the problems that cuttings are easy to adhere and suspend, a cutter is seriously abraded, a machined product cracks easily, the accuracy is not high, the machining efficiency is low, the later period cleaning is complex and the like existing in the current slice machining of the hard brittle crystal material are solved, and further, a machine bed is protected, and the cost is reduced.

Description

technical field [0001] The invention relates to a lubricating cooling fluid for mechanical processing and a method for using the same, in particular to a water-based cutting fluid for slicing hard and brittle crystal materials and a preparation method thereof. Background technique [0002] Crystal materials such as sapphire, quartz, silicon, germanium, gallium arsenide or gallium nitride have become extremely important substrate materials for modern industries, especially microelectronics and optoelectronics industries; such crystal materials have high hardness and high brittleness. Features, mechanical processing is extremely difficult, and the processing efficiency is low, and the yield is not high. With the development of semiconductor and photovoltaic materials technology, higher requirements are put forward for the specifications and quality of the front-end chips. [0003] At present, only silicon material can be sliced ​​by wire cutting process, and other crystal mat...

AI Technical Summary

Problems solved by technology

It can be commonly used in the slicing process of hard and brittle crystal materials, and has good lubrication, antirust, cleaning, cooling and sedimentation effects, and solves the problem of cutting oil used in the current hard and brittle crystal materials in the process of internal and external slicing. Or the chip powder in the cutting fluid is easy to adhere and suspend, the processing tool wears seriously, the processed product is easy to crack and the precision is not high, the processing efficiency is low, and the post-cleaning is complicated. It protects the machine and improves the processing environment and sanitation. status, reduced costs